Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
BUS DRIVER |
INDUSTRIAL |
BUTT |
6 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
3.3 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBGA-B6 |
1 |
4.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
.9 V |
e4 |
30 |
260 |
1.45 mm |
1T |
||||||||||||||||||||||
|
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
TR |
3.3 |
3.3 |
50 pF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LGA60,8X12,20 |
3.5 ns |
64 Amp |
Bus Driver/Transceivers |
.5 mm |
85 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-B60 |
2 |
3.6 V |
.5 mm |
4 mm |
Not Qualified |
TRUE |
2.7 V |
30 |
260 |
6 mm |
LVT |
||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.7 |
CHIP CARRIER, VERY THIN PROFILE |
173 ns |
12 Amp |
.4 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.65 V |
.012 mA |
e4 |
30 |
260 |
1 mm |
AXC |
||||||||||||||||||||
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
173 ns |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B6 |
36 V |
.4 mm |
.8 mm |
TRUE |
.65 V |
1 mm |
AXC |
||||||||||||||||||||||||||||
|
Nexperia |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
9.9 ns |
125 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
3.6 V |
.35 mm |
.8 mm |
TRUE |
.8 V |
e4 |
30 |
260 |
1 mm |
AVC |
|||||||||||||||||||||
|
Nexperia |
BUS DRIVER |
INDUSTRIAL |
BUTT |
6 |
BCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER |
210 ns |
.35 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN |
BOTTOM |
2 |
S-PBCC-B6 |
1 |
2.75 V |
.35 mm |
1 mm |
TRUE |
.7 V |
e3 |
30 |
260 |
1 mm |
AXP |
|||||||||||||||||||||
|
Nexperia |
BUS DRIVER |
INDUSTRIAL |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
210 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
2.75 V |
.5 mm |
1 mm |
TRUE |
.7 V |
e3 |
30 |
260 |
1.45 mm |
AXP |
|||||||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
BCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
0.7/3.3V&0.7/3.3V |
TR |
.7 |
CHIP CARRIER |
173 ns |
12 Amp |
.35 mm |
125 Cel |
BIDIRECTIONAL |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
COMMON CONTROL |
S-PBCC-B6 |
1 |
3.6 V |
.4 mm |
1 mm |
TRUE |
.65 V |
.012 mA |
e4 |
30 |
260 |
1 mm |
AXC |
||||||||||||||||
|
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
4 Amp |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
S-PBCC-B5 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.0009 mA |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
BCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER |
25.7 ns |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B5 |
3.6 V |
INVERTED |
.8 V |
AUP/ULP/V |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
6 |
VBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.7 |
CHIP CARRIER, VERY THIN PROFILE |
181 ns |
12 Amp |
125 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBCC-B6 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.65 V |
.014 mA |
e4 |
30 |
260 |
1 mm |
AXC |
||||||||||||||||||||
|
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
8 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
0.7/3.3V & 0.7/3.3V |
TR, 7 INCH |
.7 |
15 pF |
CHIP CARRIER |
170 ns |
12 Amp |
125 Cel |
BIDIRECTIONAL |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
COMMON CONTROL |
R-PBCC-B8 |
1 |
3.6 V |
.4 mm |
1.35 mm |
TRUE |
.65 V |
.023 mA |
e4 |
30 |
260 |
.8 mm |
AXC |
|||||||||||||||
|
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
4 Amp |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
S-PBCC-B5 |
1 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.0009 mA |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B5 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||||||||||
Texas Instruments |
BUS DRIVER |
INDUSTRIAL |
BUTT |
5 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
CHIP CARRIER, VERY THIN PROFILE |
21.4 ns |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
S-PBCC-B5 |
3.6 V |
.4 mm |
.8 mm |
TRUE |
.8 V |
.8 mm |
AUP/ULP/V |
||||||||||||||||||||||||||||
Texas Instruments |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
8 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
.7 |
CHIP CARRIER |
170 ns |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B8 |
3.6 V |
TRUE |
.65 V |
AXC |
|||||||||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
6 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBGA-B6 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
INVERTED |
4 V |
e4 |
1.2 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.45 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
3-STATE WITH SERIES RESISTOR |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.45 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
6 |
VFLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
S-PBGA-B6 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
INVERTED |
4 V |
e4 |
1 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
40 |
260 |
1.95 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.6 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.6 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
6 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBGA-B6 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
INVERTED |
4 V |
e4 |
1.45 mm |
CBT/FST/QS/5C/B |
||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
3-STATE WITH SERIES RESISTOR |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.6 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-XBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
40 |
260 |
1.95 mm |
3306 |
||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.6 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-XBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.45 mm |
3306 |
||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.4 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-XBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.6 mm |
3306 |
||||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
40 |
260 |
1.95 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.45 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
40 |
260 |
1.95 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.5 mm |
125 Cel |
3-STATE WITH SERIES RESISTOR |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
40 |
260 |
1.95 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||
|
Onsemi |
BUS DRIVER |
MILITARY |
BUTT |
8 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 |
4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.25 ns |
.35 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
2 |
R-PBGA-B8 |
1 |
5.5 V |
.4 mm |
1 mm |
Not Qualified |
TRUE |
4 V |
e4 |
1.45 mm |
CBT/FST/QS/5C/B |
|||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
9.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
5.5 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
6 mm |
ALVC/VCX/A |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
10 |
1.1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
10.4 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
.8 V |
6 mm |
AVC |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
7.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.6 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
WITH DIRECTION CONTROL |
6 mm |
LVT |
||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
7.5 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.6 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS TRANSCEIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
8 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.5 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
e4 |
6 mm |
LVT |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
INDUSTRIAL |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
BICMOS |
4 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
2.7 V |
e4 |
6 mm |
LVT |
|||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||||
NXP Semiconductors |
BUS DRIVER |
AUTOMOTIVE |
BUTT |
60 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
4 |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
6 ns |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
BOTTOM |
2 |
R-PBCC-B60 |
3.6 V |
.5 mm |
4 mm |
TRUE |
1.2 V |
6 mm |
LVC/LCX/Z |
A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.
The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.
Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).
In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.
Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.