BUTT Bus Driver & Transceivers 139

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Bits	Translation	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Control Type	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVTH16244BBX,518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	4 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2	ENABLE LOW	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V				30	260	6 mm	LVT
74LVC2G241GM	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	8	BCC	SQUARE	PLASTIC/EPOXY	YES	2		CMOS	1		TR	2.3	3.3		CHIP CARRIER	LCC8,.06SQ,20	11 ns	24 Amp	Bus Driver/Transceivers	.55 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2	ENABLE LOW/HIGH	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	TRUE	1.65 V		OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION		30	260	1.6 mm	LVC/LCX/Z
74LVC16245ABQ	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8	N/A		2.7	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC(UNSPEC)	6 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V		WITH DIRECTION CONTROL	e4	30	260	6 mm	LVC/LCX/Z
74LVC2G241GM,115	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	8	BCC	SQUARE	PLASTIC/EPOXY	YES	2		CMOS	1		TR	2.3	3.3		CHIP CARRIER	LCC8,.06SQ,20	11 ns	24 Amp	Bus Driver/Transceivers	.55 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	ENABLE LOW/HIGH	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	TRUE	1.65 V		OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION	e4	30	260	1.6 mm	LVC/LCX/Z
74LVCH16245ABX,518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8	N/A	TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SLGA60,8X12,20	6 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	MATTE TIN	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V			e3	30	260	6 mm	LVC/LCX/Z
74LVCH16244ABQ,518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4		TR	2.7	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC(UNSPEC)	6 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2	ENABLE LOW	R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V						6 mm	LVC/LCX/Z
74ALVC164245BX	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60	2	5.5 V	.5 mm	4 mm		TRUE	2.7 V						6 mm	ALVC/VCX/A
74LVTN16244BBQ	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	4 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	ENABLE LOW	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V			e4	30	260	6 mm	LVT
74LVCH16374ABQ	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	100000000 Hz	CMOS	8			2.7	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC(UNSPEC)	7.5 ns	24 Amp	FF/Latches	.5 mm	125 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.6 mm	4 mm	Not Qualified	TRUE	1.2 V			e4	30	260	6 mm	LVC/LCX/Z
74LVT16245BBX	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8			3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V				30	260	6 mm	LVT
74LVCH16245ABQ	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8	N/A		2.7	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC(UNSPEC)	6 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V		WITH DIRECTION CONTROL	e4	30	260	6 mm	LVC/LCX/Z
74LVC16244ABQ,515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V						6 mm	LVC/LCX/Z
74ALVC164245BX,518	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8	3V & 5V	TR	3.3	3.3,5	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	9.5 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	MATTE TIN	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.5 V			e3	30	260	6 mm	ALVC/VCX/A
74LVCH16244ABQ	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V			e4			6 mm	LVC/LCX/Z
74LVTH16245BBX,518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	3.5 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V				30	260	6 mm	LVT
74LVC16374ABQ,518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	100000000 Hz	CMOS	8		TR	2.7	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LGA60,8X12,20	7.5 ns	24 Amp	FF/Latches	.5 mm	125 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.6 mm	4 mm	Not Qualified	TRUE	1.2 V			e4	30	260	6 mm	LVC/LCX/Z
74LVTH16374ABQ	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	150000000 Hz	BICMOS	8			3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	5.6 ns	64 Amp	FF/Latches	.5 mm	85 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V			e4	30	260	6 mm	LVT
74AVC1T45GX	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.9 ns				125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B6		3.6 V	.35 mm	.8 mm		TRUE	.8 V						1 mm	AVC
74LVCH16374ABQ,518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	100000000 Hz	CMOS	8		TR	2.7	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LGA60,8X12,20	7.5 ns	24 Amp	FF/Latches	.5 mm	125 Cel		3-STATE	POSITIVE EDGE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.6 mm	4 mm	Not Qualified	TRUE	1.2 V			e4	30	260	6 mm	LVC/LCX/Z
74LVC16374ABX,518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2	100000000 Hz	CMOS	8		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	7.5 ns	24 Amp	FF/Latches	.5 mm	125 Cel		3-STATE	POSITIVE EDGE	-40 Cel	MATTE TIN	BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.65 V			e3	30	260	6 mm	LVC/LCX/Z
74LVCH16374ABQ,515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			2.7			CHIP CARRIER, VERY THIN PROFILE		7.5 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.6 mm	4 mm		TRUE	1.2 V			e4	30	260	6 mm	LVC/LCX/Z
74AVC20T245BQ	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	10			1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	.8 V						6 mm	AVC
74LVTN16244BBX,518	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	4		TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	4 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel		3-STATE		-40 Cel	MATTE TIN	BOTTOM	2	ENABLE LOW	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V			e3	30	260	6 mm	LVT
74LVT16245BBQ,518	NXP Semiconductors	BUS TRANSCEIVER	INDUSTRIAL	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8		TR	3.3	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	SLGA60,8X12,20	3.5 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel		BOTTOM	2	COMMON CONTROL	R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V		WITH DIRECTION CONTROL				6 mm	LVT
74LVCH16244ABQ,515	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4			2.7			CHIP CARRIER, VERY THIN PROFILE		6 ns			.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2		R-PBCC-B60		3.6 V	.5 mm	4 mm		TRUE	1.2 V						6 mm	LVC/LCX/Z
74LVC16244ABQ,518	NXP Semiconductors	BUS DRIVER	AUTOMOTIVE	BUTT	60	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	4		TR	2.7	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC(UNSPEC)	6 ns	24 Amp	Bus Driver/Transceivers	.5 mm	125 Cel		3-STATE		-40 Cel		BOTTOM	2	ENABLE LOW	R-PBCC-B60		3.6 V	.5 mm	4 mm	Not Qualified	TRUE	1.2 V						6 mm	LVC/LCX/Z
74AVC16T245BQ	NXP Semiconductors	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	8			1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		14.4 ns			.5 mm	125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	.8 V		TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B	e4			6 mm	AVC
74LVTN16245BBQ	NXP Semiconductors	BUS DRIVER	INDUSTRIAL	BUTT	60	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		BICMOS	8	N/A	TR	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LGA60,8X12,20	3.5 ns	64 Amp	Bus Driver/Transceivers	.5 mm	85 Cel	BIDIRECTIONAL	3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2	COMMON CONTROL	R-PBCC-B60	2	3.6 V	.5 mm	4 mm	Not Qualified	TRUE	2.7 V			e4	30	260	6 mm	LVT
935308442115	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V			e4	30	260	1.35 mm	AUP/ULP/V
74AUP2G125GXX	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V			e4	30	260	1.35 mm	AUP/ULP/V
935306985125	Nexperia	BUS DRIVER	INDUSTRIAL	BUTT	6	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.2			CHIP CARRIER, VERY THIN PROFILE		210 ns			.5 mm	85 Cel		3-STATE		-40 Cel	TIN	BOTTOM	2		R-PBCC-B6	1	2.75 V	.5 mm	1 mm		TRUE	.7 V			e3	30	260	1.45 mm	AXP
935308443115	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V			e4	30	260	1.35 mm	AUP/ULP/V
935308468147	Nexperia	BUS TRANSCEIVER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.9 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V			e4	30	260	1 mm	AVC
935306987125	Nexperia	BUS DRIVER	INDUSTRIAL	BUTT	6	BCC	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	1			1.2			CHIP CARRIER		210 ns			.35 mm	85 Cel		3-STATE		-40 Cel	TIN	BOTTOM	2		S-PBCC-B6	1	2.75 V	.35 mm	1 mm		TRUE	.7 V			e3	30	260	1 mm	AXP
935306986125	Nexperia	BUS DRIVER	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.2			CHIP CARRIER		210 ns			.3 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B6	1	2.75 V	.35 mm	.9 mm		TRUE	.7 V			e4	30	260	1 mm	AXP
74AXP1T125GNH	Nexperia	BUS DRIVER	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.2			CHIP CARRIER		210 ns			.3 mm	85 Cel		3-STATE		-40 Cel	TIN	BOTTOM	2		R-PBCC-B6	1	2.75 V	.35 mm	.9 mm		TRUE	.7 V			e3	30	260	1 mm	AXP
74AUP2G126GXX	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	2		CMOS	1		TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		TRUE	.8 V			e4	30	260	1.35 mm	AUP/ULP/V
74LV1T125GX	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	1	1.8V & 5V	TR, 7 INCH	5		30 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC5,.03,18	13.1 ns				125 Cel	UNI/BIDIRECTIONAL	3-STATE		-40 Cel	TIN	BOTTOM	2	ENABLE LOW	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm		TRUE	1.6 V	.01 mA		e3	30	260	.8 mm	LVT
74LV1T126GX	Nexperia	BUS DRIVER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	1			5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		13.2 ns				125 Cel		3-STATE		-40 Cel	TIN	BOTTOM	2		S-PBCC-B5	1	5.5 V	.35 mm	.8 mm		TRUE	1.6 V			e3	30	260	.8 mm	LVT
74AVCH1T45FX4-7	Diodes Incorporated	BUS TRANSCEIVER	INDUSTRIAL	BUTT	6	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.5			CHIP CARRIER, VERY THIN PROFILE		5.6 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B6		3.6 V	.4 mm	.9 mm		TRUE	1.2 V		WITH BUS HOLD AND DIRECTION CONTROL	e4	30	260	1.4 mm	AVC
74AVC1T45FX4-7	Diodes Incorporated	BUS TRANSCEIVER	INDUSTRIAL	BUTT	6	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	1			1.5			CHIP CARRIER, VERY THIN PROFILE		5.6 ns			.5 mm	85 Cel		3-STATE		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	2		R-PBCC-B6		3.6 V	.4 mm	.9 mm		TRUE	1.2 V		WITH DIRECTION CONTROL	e4		260	1.4 mm	AVC
TC7WPB8306L8X	Toshiba	BUS DRIVER	INDUSTRIAL	BUTT	8	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	2			1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		25 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		S-PBGA-B8		5 V	.55 mm	1.6 mm		TRUE	1.65 V						1.6 mm	7WPB
TC7WPB8307L8X	Toshiba	BUS DRIVER	INDUSTRIAL	BUTT	8	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	2			1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		25 ns			.5 mm	85 Cel		3-STATE		-40 Cel		BOTTOM	2		S-PBGA-B8		5 V	.55 mm	1.6 mm		TRUE	1.65 V						1.6 mm	7WPB

Bus Driver & Transceivers

A bus driver is an electronic component that manages communication between different components or devices in a computer system. It serves as an intermediary between the CPU and other components, such as memory, input/output devices, and expansion cards. The bus driver receives signals from the CPU and routes them to the appropriate component based on the address and control signals provided.

The bus driver also manages the timing of data transfer between components and ensures that the data is transferred at the correct speed and in the correct format. It may also perform error checking and correction to ensure that the data is transferred accurately.

Transceivers, on the other hand, are electronic devices that transmit and receive data signals over a communication channel. They are commonly used in telecommunications, networking, and computer systems. Transceivers can be either analog or digital and may transmit data using various modulation schemes, such as amplitude modulation (AM), frequency modulation (FM), or phase modulation (PM).

In computer systems, transceivers are commonly used to transmit and receive data over network cables, such as Ethernet cables or fiber optic cables. They may also be used to transmit and receive data over wireless networks, such as Wi-Fi or Bluetooth.

Transceivers typically include a transmitter, a receiver, and a signal processing unit that modulates and demodulates the data signals. They may also include error correction and signal amplification circuitry to improve the quality of the transmitted data.