D LATCH Latches & Flip-Flops 2,378

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LV259PW,112	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	60 ns	6 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	3.6 V	1.1 mm	4.4 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	5 mm	LV/LV-A/LVX/H
HEF4042BP	NXP Semiconductors	D LATCH	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		4		5	5/15	50 pF	IN-LINE	DIP16,.3	260 ns	.36 Amp	FF/Latches	2.54 mm	85 Cel		HIGH LEVEL	-40 Cel		DUAL		R-PDIP-T16	1	15 V	4.7 mm	7.62 mm	Not Qualified	COMPLEMENTARY	3 V	PROGRAMMABLE TRIGGER TYPE				21.6 mm	4000/14000/40000
74LV259PW,118	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	60 ns	6 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	3.6 V	1.1 mm	4.4 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	5 mm	LV/LV-A/LVX/H
74HCT259D	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5	5	50 pF	SMALL OUTLINE	SOP16,.25	57 ns	4 Amp	FF/Latches	1.27 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	60 MHz	R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	9.9 mm	HCT
74HC75N	NXP Semiconductors	D LATCH	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	2	CMOS		2		5	2/6	50 pF	IN-LINE	DIP16,.3	190 ns	4 Amp	FF/Latches	2.54 mm	125 Cel		HIGH LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	60 MHz	R-PDIP-T16		6 V	4.2 mm	7.62 mm	Not Qualified	COMPLEMENTARY	2 V		e4			19.025 mm	HC/UH
74HC259BQ-Q100,115	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	TR	5	2/6	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	255 ns	4 Amp	FF/Latches	.5 mm	125 Cel		LOW LEVEL	-40 Cel		QUAD		R-PQCC-N16	1	6 V	1 mm	2.5 mm	Not Qualified	TRUE	2 V	1:8 DMUX FOLLOWED BY LATCH		30	260	3.5 mm	HC/UH
74HC75PW,112	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		5	2/6	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	190 ns	4 Amp	FF/Latches	.65 mm	125 Cel		HIGH LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	60 MHz	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	COMPLEMENTARY	2 V		e4	30	260	5 mm	HC/UH
74LV259PWDH	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		60 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16		3.6 V	1.1 mm	4.4 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH				5 mm	LV/LV-A/LVX/H
HEF4042BTD	NXP Semiconductors	D LATCH	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		4		5		50 pF	SMALL OUTLINE		260 ns			1.27 mm	85 Cel		HIGH LEVEL	-40 Cel		DUAL		R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	COMPLEMENTARY	3 V	PROGRAMMABLE TRIGGER TYPE				9.9 mm	4000/14000/40000
5962-3831601BFX	NXP Semiconductors	D LATCH	MILITARY	FLAT	16	DFP	RECTANGULAR	CERAMIC, GLASS-SEALED	YES	1	TTL		4		5			FLATPACK		46 ns				125 Cel		POSITIVE EDGE	-55 Cel		DUAL		R-GDFP-F16		5.5 V			Not Qualified	COMPLEMENTARY	4.5 V						LS
74HC75N,652	NXP Semiconductors	D LATCH	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	2	CMOS		2		5	2/6	50 pF	IN-LINE	DIP16,.3	190 ns	4 Amp	FF/Latches	2.54 mm	125 Cel		HIGH LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	60 MHz	R-PDIP-T16		6 V	4.2 mm	7.62 mm	Not Qualified	COMPLEMENTARY	2 V		e4			19.025 mm	HC/UH
74HC259DB	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5	2/6	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	255 ns	4 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	TRUE	2 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	6.2 mm	HC/UH
74AUP1G373GM-H	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	25.9 ns	1.7 Amp	FF/Latches	.5 mm	125 Cel	3-STATE	POSITIVE EDGE	-40 Cel		DUAL		R-PDSO-N6		3.6 V	.5 mm	1 mm	Not Qualified	TRUE	.8 V					1.45 mm	AUP/ULP/V
74LV259BQ	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1	TUBE	3.3	3.3	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	60 ns	6 Amp	FF/Latches	.5 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-XQCC-N16	1	3.6 V	1 mm	2.5 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	3.5 mm	LV/LV-A/LVX/H
HEF4724BT-T	NXP Semiconductors	D LATCH	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5		50 pF	SMALL OUTLINE		230 ns			1.27 mm	85 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	TRUE	3 V	1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH				9.9 mm	4000/14000/40000
74LV259N,112	NXP Semiconductors	D LATCH	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		1		3.3	3.3	50 pF	IN-LINE	DIP16,.3	60 ns	6 Amp	FF/Latches	2.54 mm	125 Cel		LOW LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16		3.6 V	4.2 mm	7.62 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4			19.025 mm	LV/LV-A/LVX/H
74AUP1G373GS,132	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	25.9 ns	1.7 Amp	FF/Latches	.35 mm	125 Cel	3-STATE	HIGH LEVEL	-40 Cel	TIN	DUAL		S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	TRUE	.8 V		e3	30	260	1 mm	AUP/ULP/V
74HCT259PW-T	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	57 ns	.02 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	5 mm	HCT
74HCT259BQ,115	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	59 ns	.02 Amp	FF/Latches	.5 mm	125 Cel		LOW LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N16	1	5.5 V	1 mm	2.5 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	3.5 mm	HCT
74HCT259PW,118	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	5	5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	57 ns	.02 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	5 mm	HCT
74AHC259D,118	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1	TR	5	2/5.5	50 pF	SMALL OUTLINE	SOP16,.25	18.5 ns	8 Amp	FF/Latches	1.27 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2 V		e4	30	260	9.9 mm	AHC
74AHC259PW-Q100	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		19 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16		5.5 V	1.1 mm	4.4 mm		TRUE	2 V					5 mm	AHC/VHC/H/U/V
74LV259DB	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3	3.3	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	60 ns	6 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	3.6 V	2 mm	5.3 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	6.2 mm	LV/LV-A/LVX/H
74HCT75DB	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		5		50 pF	SMALL OUTLINE, SHRINK PITCH		45 ns			.65 mm	125 Cel		HIGH LEVEL	-40 Cel		DUAL	60 MHz	R-PDSO-G16		5.5 V	2 mm	5.3 mm	Not Qualified	COMPLEMENTARY	4.5 V					6.2 mm	HCT
74AHC259D-Q100J	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	TR	5	2/5.5	50 pF	SMALL OUTLINE	SOP16,.25	19 ns	8 Amp	FF/Latches	1.27 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16		5.5 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2 V					9.9 mm	AHC/VHC/H/U/V
74HCT75U	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	2	CMOS		2		5			UNCASED CHIP		45 ns				125 Cel		HIGH LEVEL	-40 Cel		UPPER		R-XUUC-N		5.5 V			Not Qualified	COMPLEMENTARY	4.5 V						HCT
74AHC259PW,118	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1	TR	5	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	18.5 ns	8 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	2 V		e4	30	260	5 mm	AHC
74HC75D,652	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		5	2/6	50 pF	SMALL OUTLINE	SOP16,.25	190 ns	4 Amp	FF/Latches	1.27 mm	125 Cel		HIGH LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	60 MHz	R-PDSO-G16	1	6 V	1.75 mm	3.9 mm	Not Qualified	COMPLEMENTARY	2 V		e4	30	260	9.9 mm	HC/UH
74HCT75DB-T	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		5		50 pF	SMALL OUTLINE, SHRINK PITCH		45 ns			.65 mm	125 Cel		HIGH LEVEL	-40 Cel		DUAL	60 MHz	R-PDSO-G16		5.5 V	2 mm	5.3 mm	Not Qualified	COMPLEMENTARY	4.5 V					6.2 mm	HCT
74AHCT259PW-Q100	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		13 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16		5.5 V	1.1 mm	4.4 mm		TRUE	4.5 V					5 mm	AHCT/VHCT/VT
HEF4724BDF	NXP Semiconductors	D LATCH	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS		1		5		50 pF	IN-LINE		230 ns			2.54 mm	85 Cel		LOW LEVEL	-40 Cel		DUAL		R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	TRUE	3 V	1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH					4000/14000/40000
74AUP1G373GS	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	25.9 ns	1.7 Amp	FF/Latches	.35 mm	125 Cel	3-STATE	POSITIVE EDGE	-40 Cel	Tin (Sn)	DUAL		S-PDSO-N6	1	3.6 V	.35 mm	1 mm	Not Qualified	TRUE	.8 V		e3	30	260	1 mm	AUP/ULP/V
74HCT259PW-Q100	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		57 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm		TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH				5 mm	HCT
74LV259D,118	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	3.3	3.3	50 pF	SMALL OUTLINE	SOP16,.25	60 ns	6 Amp	FF/Latches	1.27 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	3.6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	1 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	9.9 mm	LV/LV-A/LVX/H
HEF4042BDB	NXP Semiconductors	D LATCH	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS		4		5		50 pF	IN-LINE		260 ns			2.54 mm	85 Cel		HIGH LEVEL	-40 Cel		DUAL		R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	COMPLEMENTARY	3 V	PROGRAMMABLE TRIGGER TYPE					4000/14000/40000
HEF4042BT-T	NXP Semiconductors	D LATCH	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		4		5		50 pF	SMALL OUTLINE		260 ns			1.27 mm	85 Cel		HIGH LEVEL	-40 Cel		DUAL		R-PDSO-G16		15 V	1.75 mm	3.9 mm	Not Qualified	COMPLEMENTARY	3 V	PROGRAMMABLE TRIGGER TYPE				9.9 mm	4000/14000/40000
74HC75PW-T	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS		2		5		50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		190 ns			.65 mm	125 Cel		HIGH LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	60 MHz	R-PDSO-G16	1	6 V	1.1 mm	4.4 mm	Not Qualified	COMPLEMENTARY	2 V		e4			5 mm	HC/UH
74HC259PW-Q100	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1		5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		255 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDSO-G16	1	6 V	1.1 mm	4.4 mm		TRUE	2 V	1:8 DMUX FOLLOWED BY LATCH				5 mm	HC/UH
74HCT259NB	NXP Semiconductors	D LATCH	AUTOMOTIVE	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		1		5		50 pF	IN-LINE		57 ns			2.54 mm	125 Cel		LOW LEVEL	-40 Cel		DUAL		R-PDIP-T16		5.5 V	4.06 mm	7.62 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH				19.09 mm	HCT
74HCT259DB-T	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5			SMALL OUTLINE, SHRINK PITCH		57 ns			.65 mm	125 Cel		LOW LEVEL	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	60 MHz	R-PDSO-G16	1	5.5 V	2 mm	5.3 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH	e4			6.2 mm	HCT
74HC75U	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	2	CMOS		2		5			UNCASED CHIP		190 ns				125 Cel		HIGH LEVEL	-40 Cel		UPPER		R-XUUC-N		6 V			Not Qualified	COMPLEMENTARY	2 V						HC/UH
74AUP1G373GF,132	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	25.9 ns	1.7 Amp	FF/Latches	.35 mm	125 Cel	3-STATE	POSITIVE EDGE	-40 Cel	TIN	DUAL		R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	TRUE	.8 V		e3	30	260	1 mm	AUP/ULP/V
74AUP1G373GM	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	25.9 ns	1.7 Amp	FF/Latches	.5 mm	125 Cel	3-STATE	POSITIVE EDGE	-40 Cel	Tin (Sn)	DUAL		R-PDSO-N6	1	3.6 V	.5 mm	1 mm	Not Qualified	TRUE	.8 V		e3	30	260	1.45 mm	AUP/ULP/V
74HCT259BQ-Q100,11	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	TR	5	5	50 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20	57 ns		FF/Latches	.5 mm	125 Cel		LOW LEVEL	-40 Cel		QUAD		R-PQCC-N16		5.5 V	1 mm	2.5 mm	Not Qualified	TRUE	4.5 V	1:8 DMUX FOLLOWED BY LATCH				3.5 mm	HCT
74HC259DB,112	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		5	2/6	50 pF	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	255 ns	4 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	6 V	2 mm	5.3 mm	Not Qualified	TRUE	2 V	1:8 DMUX FOLLOWED BY LATCH	e4	30	260	6.2 mm	HC/UH
74AHC259PW,112	NXP Semiconductors	D LATCH	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	8	CMOS		1	TUBE	5	2/5.5	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	18.5 ns	8 Amp	FF/Latches	.65 mm	125 Cel		LOW LEVEL	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	5.5 V	1.1 mm	4.4 mm	Not Qualified	TRUE	2 V		e4	30	260	5 mm	AHC
HEF4724BDB	NXP Semiconductors	D LATCH	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS		1		5		50 pF	IN-LINE		230 ns			2.54 mm	85 Cel		LOW LEVEL	-40 Cel		DUAL		R-GDIP-T16		15 V	5.08 mm	7.62 mm	Not Qualified	TRUE	3 V	1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH					4000/14000/40000
74AUP1G373GM-G	NXP Semiconductors	D LATCH	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1			1.2/3.3	30 pF	SMALL OUTLINE	SOLCC6,.04,20		1.7 Amp	FF/Latches	.5 mm	125 Cel	3-STATE		-40 Cel		DUAL		R-PDSO-N6					Not Qualified

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.