96 Latches & Flip-Flops 134

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	Screening Level	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74SSTU32864CZKER-J	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.6 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	500 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTU
SNJ54ALVTH32373GKE	Texas Instruments	D LATCH	MILITARY	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		BICMOS	38535Q/M;38534H;883B	8			2.5/3.3	30 pF	GRID ARRAY, FINE PITCH	BGA96,6X16,32		24 Amp	FF/Latches	.8 mm	125 Cel	3-STATE		-55 Cel		BOTTOM		R-PBGA-B96					Not Qualified			5 mA
74SSTUB32864AZKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	4100000000 Hz	TTL		25	TR	1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	.7 ns	8 Amp	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	NOT SPECIFIED	260	13.5 mm	SSTU
V62/06676-01XE	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		26		2.5	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	5.5 ns		Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN LEAD	BOTTOM	200 MHz	R-PBGA-B96	3	2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e0	20	220	13.5 mm	SSTV
SN54ALVTH32374ZKER	Texas Instruments	D FLIP-FLOP	MILITARY	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32	250000000 Hz	BICMOS			TR		2.5/3.3	30 pF	GRID ARRAY, FINE PITCH	BGA96,6X16,32		18 Amp	FF/Latches	.8 mm	125 Cel	3-STATE	POSITIVE EDGE	-55 Cel		BOTTOM		R-PBGA-B96					Not Qualified
CSSTV32867SGKEREP	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				26		2.5	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	5.5 ns		Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN LEAD	BOTTOM	200 MHz	R-PBGA-B96	3	2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e0	20	220	13.5 mm	SSTV
74SSTUB32866AZKER	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL		25	TR	1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.6 ns	8 Amp	Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SN74SSTUB32866NMJR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL		25	TR	1.8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	.8 ns			.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm		TRUE	1.7 V	40 mA		e1	30	260	13.5 mm	SSTU
SN74SSTUB32864ZKER	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		.8 ns		Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SN74SSTU32866GKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	3 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	500 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTU
SN74SSTUB32866ZKER	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		.8 ns		Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SN74SSTU32866AZKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	500 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SN74SSTU32866AGKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	500 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V						13.5 mm	SSTU
SN74SSTL32867GKE	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				26		2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		3.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM		R-PBGA-B96		2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTL
SN74SSTUB32864NMJR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	CMOS		25	TR	1.8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	.8 ns	8 Amp		.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm		TRUE	1.7 V	40 mA		e1	30	260	13.5 mm	SSTU
SN74SSTU32866ZKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	3 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	500 MHz	R-PBGA-B96	3	1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SN74SSTV32867GKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		26		2.5	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	3.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTV
SN74SSTL32867GKER	Texas Instruments	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL		26		2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		3.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM		R-PBGA-B96		2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTL
SN74SSTUB32866ZWLR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		.8 ns		Other Logic ICs	.8 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.3 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
SSTUA32866EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			e0			13.5 mm	32866
SSTUA32866EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			e0			13.5 mm	32866
SSTUA32864EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
SSTUG32866EC/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns			.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V				40	260	13.5 mm	32866
SSTUP32866EC/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			e1			13.5 mm	32866
SSTUA32864EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
SSTUM32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	550 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			e1			13.5 mm	32866
SSTUH32864EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	SSTU
SSTUH32866EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
SSTUA32864EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
SSTUH32864EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			e0			13.5 mm	SSTU
SSTU32864EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTU32866EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0			13.5 mm	SSTU
SSTU32864EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0			13.5 mm	SSTU
SSTUB32866EC/G-T	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTUG32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTUA32866EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTUH32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V						13.5 mm	SSTU
SSTUH32866EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V						13.5 mm	SSTU
SSTUH32864EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	SSTU
SSTUH32866EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
SSTUA32864EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V						13.5 mm	SSTU
935271265557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				13		2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SSTUA32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTU32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUP32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTUH32864EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		14		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	SSTU
SSTUP32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns		Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32866
SSTU32866EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.