96 Latches & Flip-Flops 134

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SSTV16859EC-T	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5			GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTV
PI74SSTUA32864NB	Diodes Incorporated	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	350 MHz	R-PBGA-B96	3	1.9 V	1.48 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0			13.5 mm	SSTU
74SSTU32864DBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
74SSTU32866BBFG	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	270000000 Hz	TTL	25		1.8					2.15 ns				70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	270 MHz	R-PBGA-B96	3	1.9 V				TRUE	1.7 V	40 mA	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e1		260		SSTU
IDT74SSTUBF32866BBFG8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32	1.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.81 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
ICSSSTUB32871AHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			27		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		3 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	32871
ICSSSTUB32872AHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	3 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	32872
74SSTU32864GBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
74SSTU32864DBF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
SSTUAF32866BHLFT	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.8					3 ns	6 Amp			70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V				TRUE	1.7 V	20 mA		e1		260		SSTU
ICSSSTUF32864YHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU
74SSTUBF32866BBFG8	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.8	1.8				1.5 ns	8 Amp	Other Logic ICs		70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V	100 mA		e1		260		SSTU
ICSSSTU3286AHLF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU
74SSTU32864ABF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
74SSTU32864CBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
ICSSSTU3286AHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU
74SSTU32864BF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
ICSSSTU32866YHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		3 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
ICSSSTU32866YHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		3 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
74SSTU32864BF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
ICSSSTU3286AHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
74SSTU32864GBF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96		1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0				SSTU
SSTUB32871AHMLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			27		1.8			GRID ARRAY, THIN PROFILE, FINE PITCH		3 ns			.65 mm	70 Cel		POSITIVE EDGE	0 Cel	MATTE TIN	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.2 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			11.5 mm	32871
74SSTU32864ABF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	340 MHz	R-PBGA-B96	1	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE					SSTU
ICSSSTU32864YHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
SSTUA32864BHMLF-T	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, THIN PROFILE, FINE PITCH		1.9 ns			.65 mm	70 Cel		POSITIVE EDGE	0 Cel	MATTE TIN	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.2 mm	5 mm	Not Qualified	TRUE	1.7 V			e3			11.5 mm	SSTU
ICSSSTUB32872AHMT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA96,6X16,25	3 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.2 mm	5 mm	Not Qualified	TRUE	1.7 V			e0			11.5 mm	32872
SSTUAF32866CHLFT	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.8					3 ns	8 Amp			70 Cel	3-STATE	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V				TRUE	1.7 V	100 mA		e1		260		SSTU
ICSSSTUA32866BHMT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, THIN PROFILE, FINE PITCH		1.9 ns			.65 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.2 mm	5 mm	Not Qualified	TRUE	1.7 V			e0			11.5 mm	SSTU
ICSSSTU32864YHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
SSTUA32864BHLF-T	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.9 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13.5 mm	SSTU
74SSTU32864CBF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
IDT74SSTUBF32866BBFG	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32	1.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.81 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
ICSSSTU3286AH	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8			GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	SSTU
74SSTUBF32866BBFG	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25	TRAY	1.8	1.8		GRID ARRAY, FINE PITCH	BGA96,6X16,32	1.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.81 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1		260	13.5 mm	SSTU
74SSTUAE32866ABFG8	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.5					3 ns	6 Amp			70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.575 V				TRUE	1.425 V	20 mA		e1		260		SSTU
74AUC32373BFI	Renesas Electronics	D LATCH	INDUSTRIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4		CMOS	8			0.8/2.7	50 pF	GRID ARRAY, FINE PITCH	BGA96,6X16,32		.1 Amp	FF/Latches	.8 mm	85 Cel	3-STATE		-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B96	3				Not Qualified	TRUE				e0	30	225		AUC
74AUC32374BFI	Renesas Electronics	D FLIP-FLOP	INDUSTRIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	32	250000000 Hz	CMOS				0.8/2.7	15 pF	GRID ARRAY, FINE PITCH	BGA96,6X16,32		.1 Amp	FF/Latches	.8 mm	85 Cel	3-STATE	POSITIVE EDGE	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B96	3				Not Qualified	TRUE				e0	30	225		AUC

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.