LFBGA Latches & Flip-Flops 129

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Bits	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SSTU32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUP32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTUH32864EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	SSTU
SSTUP32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTU32866EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTU32866EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUB32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTU32866EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUH32866EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUA32866EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V		e1			13.5 mm	32866
SSTUH32864EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V		e0			13.5 mm	SSTU
SSTUM32866EC/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns		.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTU32866EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0			13.5 mm	SSTU
SSTU32864EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUH32866EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUH32866EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUG32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V			40	260	13.5 mm	32866
SSTUA32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTUH32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUB32864EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32864
SSTUA32866EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V		e0			13.5 mm	32866
SSTUH32864EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	SSTU
SSTU32864EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUM32866EC/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns	Other Logic ICs	.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTUG32866EC/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns		.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	550 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTU32866EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE		NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTU
SSTUA32866EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V		e0			13.5 mm	32866
SSTUA32864EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTU32866EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUB32866EC/S	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns	Other Logic ICs	.8 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
SSTUB32866EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	25	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32866
935271265518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SSTUA32864EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUA32864EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTU32864EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	3	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTUH32864EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.8 ns	Other Logic ICs	.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	SSTU
935271265551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SSTUH32864EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	SSTU
SSTUA32864EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96		2 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V					13.5 mm	SSTU
SSTUB32864EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	14	1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V					13.5 mm	32864
SSTU32864EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		25	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTVF16859EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5	2.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.5 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V					13.5 mm	SSTV
SSTV16859EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTV
SSTV16859EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	13	2.5	2.5,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.8 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	Tin/Lead (Sn63Pb37)	BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V		e0			13.5 mm	SSTV
SSTV16859EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V					13.5 mm	SSTV
SSTVF16859EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V					13.5 mm	SSTV
SSTV16859EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	13	2.5	2.5,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.8 ns	Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V		e0			13.5 mm	SSTV
SSTV16859EC-T	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		13	2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns		.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V					13.5 mm	SSTV

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.