Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1000000000 Hz |
ECL |
4 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.675 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
MATTE TIN |
QUAD |
1100 MHz |
S-PQCC-J28 |
3 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
81 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
30 |
260 |
11.505 mm |
100E |
||||||||||
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1100000000 Hz |
ECL |
5 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.9 ns |
Shift Registers |
1.27 mm |
85 Cel |
RIGHT |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
TIN LEAD |
QUAD |
1100 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
100E |
||||||||||||
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1000000000 Hz |
ECL |
2 |
6 |
TR |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
1.05 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
TIN LEAD |
QUAD |
1000 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
130 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
100E |
||||||||||
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3 |
1000000000 Hz |
ECL |
1 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.85 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
TIN LEAD |
QUAD |
1100 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
132 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
|||||||||||
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
6 |
ECL |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
4.5 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
-30 Cel |
TIN LEAD |
QUAD |
125 MHz |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
121 mA |
COMMON RESET, RESET ACTIVE ONLY WHEN CLOCK IS LOW |
e0 |
235 |
8.965 mm |
10K |
||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
6 |
TR |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
900 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
72 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
100E |
||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
TR |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
152 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e3 |
260 |
11.505 mm |
100E |
||||||||||||
|
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1000000000 Hz |
ECL |
2 |
6 |
TR |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
1.05 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
POSITIVE EDGE |
0 Cel |
TIN |
QUAD |
1000 MHz |
S-PQCC-J28 |
3 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
130 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
260 |
11.505 mm |
100E |
||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.9 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
83 mA |
NECL MODE OPERATING RANGE:VCC=0 V WITH VEE=-4.2 V TO -5.7 V |
e0 |
11.505 mm |
10E |
||||||||||||||
|
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1100000000 Hz |
ECL |
6 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
1.05 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
TIN |
QUAD |
1100 MHz |
S-PQCC-J28 |
3 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
101 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||
|
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1100000000 Hz |
ECL |
6 |
TR |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
1.05 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
0 Cel |
Tin (Sn) |
QUAD |
1100 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
116 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
40 |
260 |
11.505 mm |
100E |
|||||||||
Onsemi |
D FLIP-FLOP |
OTHER |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
6 |
TR |
-5.2 |
CHIP CARRIER |
LDCC20,.4SQ |
4.5 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
POSITIVE EDGE |
-30 Cel |
Tin/Lead (Sn80Pb20) |
QUAD |
125 MHz |
S-PQCC-J20 |
1 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
121 mA |
e0 |
8.965 mm |
10K |
|||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
103 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
100E |
||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
132 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
ECL |
4 |
IN-LINE |
6.2 ns |
2.54 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.495 mm |
10K |
||||||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
90 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
||||||||||||
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
200000000 Hz |
ECL10K |
-5.2 |
IN-LINE |
DIP16,.3 |
FF/Latches |
2.54 mm |
85 Cel |
MASTER-SLAVE |
-30 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
72 mA |
e0 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
176 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
28 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.5 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B176 |
2 |
2 V |
1.15 mm |
6 mm |
Not Qualified |
COMPLEMENTARY |
1.7 V |
15 mm |
32868 |
||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
160 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
28 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
550 MHz |
R-PBGA-B160 |
2 |
2 V |
1.15 mm |
9 mm |
Not Qualified |
TRUE |
1.7 V |
13 mm |
SSTU |
|||||||||||||||||||||
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
ECL |
6 |
IN-LINE |
2.2 ns |
85 Cel |
POSITIVE EDGE |
0 Cel |
TIN LEAD |
DUAL |
375 MHz |
R-CDIP-T24 |
COMPLEMENTARY |
e0 |
100K |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
160 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
28 |
1.8 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA160,12X18,25 |
1.4 ns |
Other Logic ICs |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B160 |
2 |
2 V |
1.15 mm |
9 mm |
Not Qualified |
TRUE |
1.7 V |
13 mm |
SSTU |
||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
160 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
28 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B160 |
2 |
2 V |
1.15 mm |
9 mm |
Not Qualified |
TRUE |
1.7 V |
13 mm |
SSTU |
|||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
176 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
28 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.5 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B176 |
2 |
2 V |
1.15 mm |
6 mm |
Not Qualified |
COMPLEMENTARY |
1.7 V |
15 mm |
32868 |
||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
96 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
25 |
1.8 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA96,6X16,32 |
1.5 ns |
Other Logic ICs |
.8 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
550 MHz |
R-PBGA-B96 |
2 |
2 V |
1.5 mm |
5.5 mm |
Not Qualified |
COMPLEMENTARY |
1.7 V |
13.5 mm |
32866 |
|||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
96 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
25 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.5 ns |
.8 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
550 MHz |
R-PBGA-B96 |
2 |
2 V |
1.5 mm |
5.5 mm |
Not Qualified |
COMPLEMENTARY |
1.7 V |
13.5 mm |
32866 |
||||||||||||||||||||
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
ECL |
3 |
IN-LINE |
1.8 ns |
85 Cel |
POSITIVE EDGE |
0 Cel |
TIN LEAD |
DUAL |
400 MHz |
R-CDIP-T24 |
COMPLEMENTARY |
e0 |
100K |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
96 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
25 |
1.8 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA96,6X16,32 |
1.5 ns |
Other Logic ICs |
.8 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B96 |
2 V |
1.5 mm |
5.5 mm |
Not Qualified |
COMPLEMENTARY |
1.7 V |
13.5 mm |
32866 |
||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
176 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
28 |
1.8 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA176,8X22,25 |
3 ns |
Other Logic ICs |
.65 mm |
85 Cel |
POSITIVE EDGE |
0 Cel |
BOTTOM |
450 MHz |
R-PBGA-B176 |
2 |
2 V |
1.15 mm |
6 mm |
Not Qualified |
TRUE |
1.7 V |
15 mm |
32868 |
|||||||||||||||||||
|
NXP Semiconductors |
D FLIP-FLOP |
OTHER |
BALL |
160 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
28 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 ns |
.65 mm |
85 Cel |
OPEN-DRAIN |
POSITIVE EDGE |
0 Cel |
BOTTOM |
550 MHz |
R-PBGA-B160 |
2 |
2 V |
1.15 mm |
9 mm |
Not Qualified |
TRUE |
1.7 V |
40 |
260 |
13 mm |
SSTU |
Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.
A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.
Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.
Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.
Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.