HVSON Logic Gates 107

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74HCT02BQ	NXP Semiconductors	NOR GATE	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	NO	YES	4	CMOS	2	TR	5	5	50 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.1X.12,20	29 ns	.02 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-N14	1	5.5 V	1 mm	2.5 mm	Not Qualified	4.5 V		e4	30	260	3 mm	HCT
74LVC1G06GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		8.5 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74AUP1G132GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		27.9 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AUP1G17GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.1 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AUP1G86GX	NXP Semiconductors	XOR GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		26.6 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AXP1G09GX	NXP Semiconductors	AND GATE	INDUSTRIAL	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		88 ns			.48 mm	85 Cel	OPEN-DRAIN	-40 Cel		DUAL	S-PDSO-N5		2.75 V	.35 mm	.8 mm		.7 V					.8 mm	AXP
74LVC1G14GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		14 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74AXP1G02GX	NXP Semiconductors	NOR GATE	INDUSTRIAL	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		98 ns			.48 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N5		2.75 V	.35 mm	.8 mm		.7 V					.8 mm	AXP
74AUP1G04GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.9 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74LVC1G00GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74AUP1T34GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		33.5 ns			.48 mm	125 Cel		-40 Cel		DUAL	S-PDSO-N5		3.6 V	.35 mm	.8 mm		1.1 V					.8 mm	AUP/ULP/V
74AUP1G34GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AUP1G14GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AUP1G08GX	NXP Semiconductors	AND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74LVC1G07GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		8.4 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74LVC1G32GX	NXP Semiconductors	OR GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74AUP1G07GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.7 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74AUP1G00GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.1 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74LVC1G34GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74AUP1G02GX	NXP Semiconductors	NOR GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		24.7 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		.8 V		e3			.8 mm	AUP/ULP/V
74LVC1G17GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		14 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74LVC1G38GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2	TR	3.3	3.3	50 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	12.5 ns	24 Amp	Gates	.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	Tin (Sn)	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm	Not Qualified	1.65 V		e3	30	260	.8 mm	LVC/LCX/Z
74LVC1G04GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74LVC1GU04GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		6.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74LVC1G02GX	NXP Semiconductors	NOR GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
74LVC1G08GX	NXP Semiconductors	AND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.65 V		e3			.8 mm	LVC/LCX/Z
935340118147	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1	TR, 7 INCH	1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	3.6 V	.35 mm	.6 mm		.8 V		e4	30	260	.6 mm	AUP/ULP/V
74AUP1G34GX4	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	3.6 V	.35 mm	.6 mm		.8 V		e4	30	260	.6 mm	AUP/ULP/V
74LVC1G14GX4	Nexperia	INVERTER		NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		3.3		50 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,32	14 ns	32 Amp		.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.6 mm		1.65 V	.004 mA	e4	30	260	.6 mm	LVC/LCX/Z
74AUP1G34GX4Z	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1	TR, 7 INCH	1.1			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	3.6 V	.35 mm	.6 mm		.8 V		e4	30	260	.6 mm	AUP/ULP/V
74LV1T32GX	Nexperia	OR GATE		NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5		30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		13.3 ns	8 Amp		.5 mm	125 Cel		-40 Cel	TIN	DUAL	S-PDSO-N5	1	5.5 V	.35 mm	.8 mm		1.6 V	.01 mA	e3	30	260	.8 mm	LV/LV-A/LVX/H
74AUP1G04GX4	Nexperia	INVERTER		NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		1.1		30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,32	20.9 ns	4 Amp		.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	3.6 V	.35 mm	.8 mm		.8 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74AUP1T08GX	Nexperia	AND GATE	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		2.5		30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC5,.03,20	11.9 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0035 mA	e4	30	260	.8 mm	AUP/ULPA
74AUP1T04GX	Nexperia	INVERTER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		3		30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,20	11.9 ns	4 Amp		.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74LVC1G14FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		14 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G17FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		14 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74AUP1G08FS3-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	24 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74AUP1G86FS3-7	Diodes Incorporated	XOR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	26.6 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74LVC1G07FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		8.5 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G02FS3-7	Diodes Incorporated	NOR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G86FS3-7	Diodes Incorporated	XOR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		13 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74AUP1G09FS3-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	24 ns	1.7 Amp	Gates	.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74AUP1G06FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	21.3 ns	1.7 Amp	Gates	.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74LVC1G08FS3-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
74AUP1G04FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	27 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4		260	.8 mm	AUP/ULP/V
74AUP1G00FS3-7	Diodes Incorporated	NAND GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	24.9 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74AUP1G32FS3-7	Diodes Incorporated	OR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	23.7 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V
74AUP1G17FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	20.1 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N5		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V		e4	30	260	.8 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.