HVSON Logic Gates 107

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74AUP1G07FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	20.7 ns	1.7 Amp	Gates	.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V	e4		260	.8 mm	AUP/ULP/V
74AUP1G02FS3-7	Diodes Incorporated	NOR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	24.7 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V	e4	30	260	.8 mm	AUP/ULP/V
74LVC1G00FS3-7	Diodes Incorporated	NAND GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	.8 mm	LVC/LCX/Z
74AUP1G34FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	20.8 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V	e4		260	.8 mm	AUP/ULP/V
74LVC1G06FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		8.5 ns			.48 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G34FS3-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3.3	3.3	50 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	9.5 ns	24 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm	Not Qualified	1.65 V	e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G32FS3-7	Diodes Incorporated	OR GATE	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		10.5 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	.8 mm	LVC/LCX/Z
74LVC1G04FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns			.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	.8 mm	LVC/LCX/Z
74AUP1G14FS3-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	NO LEAD	4	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC5(UNSPEC)	22.5 ns	1.7 Amp	Gates	.48 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N4		3.6 V	.35 mm	.8 mm	Not Qualified	.8 V	e4	30	260	.8 mm	AUP/ULP/V
TC7WG14FC	Toshiba	INVERTER	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS	1		3.3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.05,16	59.6 ns	3 Amp	Gates	.4 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-N8		3.6 V	.4 mm	1.35 mm	Not Qualified	.9 V	e0			1.45 mm	HC/UH
TC7WG17FC	Toshiba	BUFFER	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS	1		3.3	1.2/3.3	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.05,16	59.6 ns	3 Amp	Gates	.4 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-N8		3.6 V	.4 mm	1.35 mm	Not Qualified	.9 V	e0			1.45 mm	HC/UH

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.