VBCC Logic Gates 45

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC2G00GM,125	NXP Semiconductors	NAND GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	2.3	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC3G14GM,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	12 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
SN74LVC1G11DRY	Texas Instruments	AND GATE	AUTOMOTIVE	BUTT	6	VBCC	RECTANGULAR	UNSPECIFIED		YES	1	CMOS	3		1.8			CHIP CARRIER, VERY THIN PROFILE		20 ns			.5 mm	125 Cel		-40 Cel		BOTTOM	R-XBCC-B6		5.5 V	.6 mm	1 mm		1.65 V					1.45 mm	LVC/LCX/Z
74AUP3G14GM	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		3.6 V	.5 mm	1.6 mm		.8 V					1.6 mm	AUP/ULP/V
74LVC3G34GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC8,.04,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V			30	260	1.6 mm	LVC/LCX/Z
74LVC3G16GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			CHIP CARRIER, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		5.5 V	.5 mm	1.6 mm		1.65 V					1.6 mm	LVC/LCX/Z
74LVC2G08GM	NXP Semiconductors	AND GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	11.3 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC3G07GM,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	1		1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	8.4 ns	24 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC2G02GM,125	NXP Semiconductors	NOR GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	11.2 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74AXP1G17GX,125	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2			CHIP CARRIER, VERY THIN PROFILE		136 ns				85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm		.7 V					.8 mm	AXP
74LVC3G34GM,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC2G86GM,125	NXP Semiconductors	XOR GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	12.4 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC3G04GM,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	9.5 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74LVC2G08GM,115	NXP Semiconductors	AND GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	11.3 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V					1.6 mm	LVC/LCX/Z
74AUP3G17GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.1 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		3.6 V	.5 mm	1.6 mm		.8 V					1.6 mm	AUP/ULP/V
74LVC3G17GM,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	13.1 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	R-PBCC-B8	1	5.5 V	.5 mm	.95 mm	Not Qualified	1.65 V		e4	30	260	1.95 mm	LVC/LCX/Z
74LVC3G34GM,115	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	10.8 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V					1.6 mm	LVC/LCX/Z
74AUP3G16GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.8 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		3.6 V	.5 mm	1.6 mm		.8 V					1.6 mm	AUP/ULP/V
74LVC1G99GM,125	NXP Semiconductors	MAJORITY LOGIC GATE	AUTOMOTIVE	BUTT	8	VBCC	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	4	TR	2.3	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	38.5 ns	24 Amp	Gates	.5 mm	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	R-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
SLF4002L7	Infineon Technologies	NOR GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
SLF4004L7	Infineon Technologies	INVERTER	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	1		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
SLF4007L7	Infineon Technologies	BUFFER	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	1		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
SLF4000L7	Infineon Technologies	NAND GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3	15 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
SLF4032L7	Infineon Technologies	OR GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
SLF4008L7	Infineon Technologies	AND GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V					1.6 mm
935281443125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
935307553125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
935281444125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.1 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
935307608125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			CHIP CARRIER, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm		1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
935281442125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.7 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74LV1T08GX	Nexperia	AND GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		5			CHIP CARRIER, VERY THIN PROFILE		13.4 ns				125 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm		1.6 V		e3	30	260	.8 mm	LV/LV-A/LVX/H
74AUP3G14GM,125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74LVC3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			CHIP CARRIER, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm		1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74AUP1T02GX	Nexperia	NOR GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		3		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	11.9 ns	4 Amp			125 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0035 mA	e3	30	260	.8 mm	AUP/ULP/V
74LV1T00GX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	14.4 ns	8 Amp			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm		1.6 V	.01 mA	e4	30	260	.8 mm	LV/LV-A/LVX/H
74AUP1T17GX	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	5	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		3		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,20	11.9 ns	4 Amp			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-N5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74LV1T34GX,125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		5			CHIP CARRIER, VERY THIN PROFILE		12.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm		1.6 V		e4	30	260	.8 mm	LV/LV-A/LVX/H
74AUP1T50GX	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	5	VBCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	1		3		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	11.9 ns	4 Amp			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PBCC-N5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74AUP3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74AUP1T86GX	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		3		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,20	11.9 ns	4 Amp			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74AUP3G17GM,125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.1 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74AUP3G07GM,125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.7 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74LV1T86GX	Nexperia	XOR GATE	AUTOMOTIVE	NO LEAD	14	VBCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5		30 pF	CHIP CARRIER, VERY THIN PROFILE		14.3 ns	8 Amp			125 Cel		-40 Cel	TIN	DUAL	R-PBCC-N5	1	5.5 V	.35 mm	.8 mm		1.6 V	.01 mA	e3	30	260	.8 mm	LV/LV-A/LVX/H
74AUP1T00GX	Nexperia	NAND GATE	AUTOMOTIVE	NO LEAD	14	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		3		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	11.9 ns	4 Amp			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PBCC-N5	1	3.6 V	.35 mm	.8 mm		2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74LV1T02GX	Nexperia	NOR GATE	AUTOMOTIVE	NO LEAD	5	VBCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5		30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	14.3 ns	8 Amp			125 Cel		-40 Cel	TIN	DUAL	R-PBCC-N5	1	5.5 V	.35 mm	.8 mm		1.6 V	.01 mA	e3	30	260	.8 mm	LV/LV-A/LVX/H

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.