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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Length	Family
MC100E107FN	Onsemi	XOR/XNOR GATE	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5	ECL	2		5	-4.5	CHIP CARRIER	LDCC28,.5SQ	.6 ns		Gates	1.27 mm	85 Cel	OPEN-EMITTER	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	5.7 V	4.57 mm	11.505 mm	Not Qualified	4.2 V	58 mA	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V	e0	235	11.505 mm	100E
MC10103FN	Onsemi	OR GATE	OTHER	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	4	ECL	2		-5.2	-5.2	CHIP CARRIER	LDCC20,.4SQ	2.9 ns		Gates	1.27 mm	85 Cel		-30 Cel	TIN LEAD	QUAD	S-PQCC-J20	1	-5.72 V	4.57 mm	8.965 mm	Not Qualified	-4.68 V	29 mA		e0	235	8.965 mm	10K
MC10121L	Onsemi	OR-AND/OR-AND-INVERT GATE	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	1	ECL	11			-5.2	IN-LINE	DIP16,.3	3.4 ns		Gates	2.54 mm	85 Cel		-30 Cel	TIN LEAD	DUAL	R-GDIP-T16			5.08 mm	7.62 mm	Not Qualified		29 mA	3-3-3-3 INPUT	e0		19.49 mm	10K
MC10212P	Onsemi	OR/NOR GATE	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	2	ECL	3				IN-LINE		2.8 ns			2.54 mm	85 Cel		-30 Cel	TIN LEAD	DUAL	R-PDIP-T16			4.44 mm	7.62 mm	Not Qualified				e0		19.175 mm	10K
74V2G00CTR	STMicroelectronics	NAND GATE	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	3.3	2/6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.09,20	13 ns	4 Amp	Gates	.5 mm	85 Cel		-55 Cel		DUAL	R-PDSO-G8		5.5 V	1.1 mm	1.25 mm	Not Qualified	2 V					2 mm	74V
74V2G00STR	STMicroelectronics	NAND GATE	OTHER	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	3.3	2/6	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	13 ns	4 Amp	Gates	.65 mm	85 Cel		-55 Cel		DUAL	R-PDSO-G8	1	5.5 V	1.45 mm	1.625 mm	Not Qualified	2 V				260	2.9 mm	74V
10104B	NXP Semiconductors	AND GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	4	ECL	2				IN-LINE		4.3 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		35 mA	COMPLEMENTARY O/P FOR 1 FUNCTION				10K
10111B	NXP Semiconductors	NOR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	2	ECL	3				IN-LINE		3.8 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		38 mA					10K
10211F	NXP Semiconductors	NOR GATE	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	NO	2	ECL	3			-5.2	IN-LINE	DIP16,.3			Gates	2.54 mm	85 Cel	OPEN-EMITTER	-30 Cel	TIN LEAD	DUAL	R-GDIP-T16					Not Qualified		38 mA		e0			10K
10105B	NXP Semiconductors	OR/NOR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	3	ECL	3				IN-LINE		3.3 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		21 mA	ASYMMETRICAL I/P'S				10K
10106B	NXP Semiconductors	NOR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	3	ECL	4				IN-LINE		3.3 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		21 mA	ASYMMETRICAL I/P'S				10K
100107F	NXP Semiconductors	XOR/XNOR GATE	OTHER	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED		NO	5	ECL	2		-4.5		IN-LINE		1.9 ns				85 Cel		0 Cel	TIN LEAD	DUAL	R-CDIP-T24		-4.8 V				-4.2 V			e0			ECL
10110B	NXP Semiconductors	OR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	2	ECL	3				IN-LINE		3.8 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		38 mA					10K
10107B	NXP Semiconductors	XOR/XNOR GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	3	ECL	2				IN-LINE		4 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		28 mA					10K
10119B	NXP Semiconductors	OR-AND GATE	OTHER	THROUGH-HOLE	16		RECTANGULAR	PLASTIC/EPOXY		NO	1	ECL	12				IN-LINE		3.9 ns				85 Cel	OPEN-EMITTER	-30 Cel		DUAL	R-PDIP-T16					Not Qualified		26 mA					10K
FZH101A	Infineon Technologies	NAND GATE	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO		BIPOLAR				12/15	IN-LINE	DIP16,.3		18 Amp	Gates	2.54 mm	85 Cel		-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16					Not Qualified		16 mA		e0

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.