BALL Logic Gates 386

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC1G34FX4-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		9.5 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G07FX4-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.5 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC2G14FX4-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		12 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74AUP1G02FX4-7	Diodes Incorporated	NOR GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SOLCC6,.04,20	24.7 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G08FX4-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	24 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
TC7SP332WBG	Toshiba	OR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES AT 1.65 V TO 3.6V SUPPLY VOLTAGE				1.2 mm	P
TC7SP300WBG	Toshiba	NAND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES AT 1.65 V TO 3.6V SUPPLY VOLTAGE				1.2 mm	P
TC7SP300WBG(EL)	Toshiba	NAND GATE	INDUSTRIAL	BALL	6	FBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	2.5	1.2/2.5,1.8/3.3	30 pF	GRID ARRAY, FINE PITCH	BGA6,2X3,16	37 ns	9 Amp	Gates	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V			Not Qualified	1.1 V
TC7SP302WBG	Toshiba	NOR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES AT 1.65 TO 3.6 V SUPPLY				1.2 mm	P
TC7SP308WBG	Toshiba	AND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES AT 1.65 V TO 3.6V SUPPLY VOLTAGE				1.2 mm	P
TC7SP381WBG	Toshiba	XNOR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES WITH 1.65 V TO 3.6 V SUPPLY				1.2 mm	P
TC7SP386WBG	Toshiba	XOR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		37 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		2.7 V	.67 mm	.8 mm	Not Qualified	1.1 V	ALSO OPERATES WITH 1.65 V TO 3.6 V SUPPLY				1.2 mm	P
HD74LVC2G00CLE	Renesas Electronics	NAND GATE	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.6 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.9 mm	LVC/LCX/Z
RD74LVC2G32WPE	Renesas Electronics	OR GATE	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.5 mm	LVC/LCX/Z
RD74LVC2G125WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.5 mm	LVC/LCX/Z
RD74VT1G08CLE	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
RD74VT1G240CLE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		1		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
HD74LVC3G04CLE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		7.9 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.9 mm	LVC/LCX/Z
RD74LVC1G02WPE	Renesas Electronics	NOR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
HD74LVC1G08CPE	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HD74LVC1G04CPE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		7.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74VT1G86CLE	Renesas Electronics	XOR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		11.2 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
RD74LVC1G14WPE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		11 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
HD74LVC1G02CPE	Renesas Electronics	NOR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74LVC2G07WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.3 ns			.4 mm	85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
HD74LVC1G02CLE	Renesas Electronics	NOR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HD74LVC1G32CPE	Renesas Electronics	OR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74LVC1G86WPE	Renesas Electronics	XOR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		9.9 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC1G126WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC1G08WPE	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC1G125WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74VT1G00CLE	Renesas Electronics	NAND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		9.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
HD74LVC1G32CLE	Renesas Electronics	OR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74LVC2G08WPE	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.5 mm	LVC/LCX/Z
RD74VT1G02CLE	Renesas Electronics	NOR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
RD74LVC1G240WPE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC1G07WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.3 ns			.4 mm	85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC2G17WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		11 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC2G02WPE	Renesas Electronics	NOR GATE	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.5 mm	LVC/LCX/Z
HD74LVC1G04CLE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		7.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74LVC1G17WPE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		11 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74LVC1G04WPE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		7.5 ns			.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
RD74VT1G32CLE	Renesas Electronics	OR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		2		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.5 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
HD74LVC3G04CPE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		7.9 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B8		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.9 mm	LVC/LCX/Z
HD74LVC1G08CPE-E	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HD74LVC1G17CLE	Renesas Electronics	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	11 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74VT1G04CLE	Renesas Electronics	INVERTER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1		1		1.5			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		9.7 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		3.6 V	.5 mm	.9 mm	Not Qualified	1.2 V					1.4 mm	74V
HD74LVC1G08CLE	Renesas Electronics	AND GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8 ns			.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.