Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
AND-OR-INVERT GATE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
2 |
TTL |
6 |
5 |
5 |
15 pF |
IN-LINE |
DIP14,.3 |
20 ns |
8 Amp |
Gates |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.75 V |
2.8 mA |
ASYMMETRICAL I/P'S |
e0 |
LS |
|||||||||||||||
STMicroelectronics |
AND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
CMOS |
3 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
26 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
6 V |
5.08 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
HC/UH |
|||||||||||||||||
STMicroelectronics |
NAND GATE |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
TTL |
4 |
5 |
45 pF |
SMALL OUTLINE |
24 ns |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G14 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
4.75 V |
6 mA |
8.65 mm |
LS |
||||||||||||||||||||||
|
STMicroelectronics |
XOR GATE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
5 |
IN-LINE |
DIP14,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T14 |
15 V |
2.54 mm |
7.62 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
HC |
||||||||||||||||||||||
|
STMicroelectronics |
NAND GATE |
MILITARY |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
2 |
CMOS |
2 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
8.5 ns |
8 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.45 mm |
1.625 mm |
Not Qualified |
4.5 V |
2.9 mm |
74V |
|||||||||||||||
STMicroelectronics |
NAND GATE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
TTL |
2 |
5 |
5 |
45 pF |
IN-LINE |
DIP14,.3 |
28 ns |
24 Amp |
Gates |
2.54 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.75 V |
12 mA |
e0 |
LS |
|||||||||||||||
|
STMicroelectronics |
OR GATE |
MILITARY |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
2 |
2.7 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
6.9 ns |
24 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
3.6 V |
1.2 mm |
4.4 mm |
Not Qualified |
2 V |
e4 |
5 mm |
LVC/LCX/Z |
||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
XOR GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
YES |
4 |
CMOS |
38535Q/M;38534H;883B |
2 |
5 |
2/6 |
50 pF |
FLATPACK |
FL14,.3 |
150 ns |
4 Amp |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDFP-F14 |
NOT APPLICABLE |
6 V |
2.03 mm |
6.285 mm |
Not Qualified |
2 V |
NOT APPLICABLE |
NOT APPLICABLE |
9.21 mm |
HC/UH |
||||||||||||||
STMicroelectronics |
OR GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
4 |
CMOS |
2 |
4.5 |
FLATPACK |
150 ns |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
6 V |
Not Qualified |
2 V |
HC/UH |
||||||||||||||||||||||||||||
|
STMicroelectronics |
AND GATE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
CMOS |
3 |
5 |
IN-LINE |
DIP14,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T14 |
15 V |
2.54 mm |
7.62 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
HC |
|||||||||||||||||||||
STMicroelectronics |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC |
NO |
NO |
2 |
CMOS |
ESCC9000 |
4 |
5/15 |
IN-LINE |
DIP14,.3 |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T14 |
20 V |
Not Qualified |
3 V |
||||||||||||||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
BUFFER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
6 |
CMOS |
1 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
100 ns |
6 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
6 V |
Not Qualified |
2 V |
e0 |
HC/UH |
|||||||||||||||||||
STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
4 |
TTL |
2 |
5 |
IN-LINE |
15 ns |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
5.5 V |
4.5 V |
e0 |
LS |
|||||||||||||||||||||||||||
STMicroelectronics |
XOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
2 |
5 |
3/18 |
50 pF |
IN-LINE |
DIP14,.3 |
280 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
e0 |
4000/14000/40000 |
||||||||||||||||||
STMicroelectronics |
NOR GATE |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
TTL |
5 |
5 |
15 pF |
CHIP CARRIER |
15 ns |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
5.25 V |
4.57 mm |
8.9662 mm |
Not Qualified |
4.75 V |
5.5 mA |
8.9662 mm |
LS |
||||||||||||||||||||||
|
STMicroelectronics |
NAND GATE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, GLASS-SEALED |
YES |
NO |
4 |
CMOS |
2 |
5 |
IN-LINE |
DIP14,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T14 |
15 V |
2.54 mm |
7.62 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
HC |
|||||||||||||||||||||
STMicroelectronics |
OR/NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
1 |
CMOS |
8 |
5 |
3/18 |
50 pF |
IN-LINE |
DIP14,.3 |
300 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
e0 |
4000/14000/40000 |
||||||||||||||||||
STMicroelectronics |
BUFFER |
FLAT |
16 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
6 |
CMOS |
1 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
6 V |
2.38 mm |
6.91 mm |
2 V |
9.94 mm |
HC |
|||||||||||||||||||||||||
STMicroelectronics |
BUFFER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
6 |
CMOS |
1 |
5 |
3/18 |
50 pF |
IN-LINE |
DIP16,.3 |
130 ns |
Gates |
2.54 mm |
125 Cel |
OPEN-DRAIN |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
HIGH TO LOW LEVEL TRANSLATOR |
e0 |
19.43 mm |
4000/14000/40000 |
|||||||||||||||
STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
2 |
CMOS |
ESCC9000 |
4 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
120 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
6 V |
3.7 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
19 mm |
HC/UH |
||||||||||||||
STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC |
NO |
NO |
2 |
CMOS |
ESCC9000 |
4 |
5/15 |
IN-LINE |
DIP14,.3 |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T14 |
20 V |
Not Qualified |
3 V |
||||||||||||||||||||||||
STMicroelectronics |
NAND GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC |
YES |
YES |
4 |
CMOS |
2 |
STRIP PACK |
FLATPACK |
FL14,.2 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
6 V |
2.33 mm |
6.91 mm |
2 V |
SEATED HT-CALCULATED |
9.95 mm |
HC/UH |
||||||||||||||||||||||
|
STMicroelectronics |
NOR GATE |
FLAT |
14 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
2 |
CMOS |
4 |
5 |
FLATPACK |
FL14,.3 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
15 V |
2.33 mm |
6.91 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.95 mm |
HC |
|||||||||||||||||||||
STMicroelectronics |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
2 |
5 |
3/18 |
50 pF |
IN-LINE |
DIP14,.3 |
250 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
3 V |
e0 |
4000/14000/40000 |
||||||||||||||||||
|
STMicroelectronics |
INVERTER |
FLAT |
14 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
6 |
CMOS |
1 |
FLATPACK |
FL14,.3 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
20 V |
2.33 mm |
6.91 mm |
3 V |
SEATED HT-CALCULATED |
9.95 mm |
4000/14000/40000 |
|||||||||||||||||||||||
STMicroelectronics |
AND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
4 |
TTL |
2 |
5 |
5 |
IN-LINE |
DIP14,.3 |
20 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T14 |
5.5 V |
Not Qualified |
4.5 V |
8.8 mA |
e0 |
||||||||||||||||||||
STMicroelectronics |
NOR GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
2 |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
9.5 ns |
8 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G5 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
4.5 V |
e0 |
2 mm |
74V |
||||||||||||||||
STMicroelectronics |
BUFFER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, GLASS-SEALED |
NO |
NO |
6 |
CMOS |
1 |
IN-LINE |
DIP16,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
6 V |
3.83 mm |
7.62 mm |
2 V |
20.32 mm |
HC |
|||||||||||||||||||||||||
|
STMicroelectronics |
NOR GATE |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
CMOS |
2 |
5 |
IN-LINE |
DIP14,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T14 |
15 V |
2.54 mm |
7.62 mm |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
HC |
|||||||||||||||||||||
|
STMicroelectronics |
INVERTER |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
8.3 ns |
24 Amp |
Gates |
.65 mm |
125 Cel |
OPEN-DRAIN |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.65 V |
e3 |
2 mm |
TTL/H/L |
||||||||||||
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
1 |
CMOS |
8 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
170 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
6 V |
3.7 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
19 mm |
HC/UH |
|||||||||||||||
STMicroelectronics |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
4 |
CMOS |
2 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
110 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
6 V |
3.7 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
19 mm |
HC/UH |
|||||||||||||||
STMicroelectronics |
AND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
CMOS |
3 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
33 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
6 V |
5 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
HC/UH |
|||||||||||||||||
STMicroelectronics |
NOR GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
3 |
CMOS |
ESCC9000 |
3 |
4.5 |
2/6 |
50 pF |
FLATPACK |
FL14,.3 |
115 ns |
4 Amp |
Gates |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F14 |
6 V |
6.91 mm |
Not Qualified |
2 V |
e0 |
9.95 mm |
HC/UH |
|||||||||||||||
STMicroelectronics |
XNOR GATE |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
TTL |
2 |
5 |
15 pF |
CHIP CARRIER |
30 ns |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
QUAD |
S-PQCC-J20 |
5.25 V |
4.57 mm |
8.9662 mm |
Not Qualified |
4.75 V |
13 mA |
8.9662 mm |
LS |
|||||||||||||||||||||
STMicroelectronics |
INVERTER |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
6 |
CMOS |
1 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
150 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
6 V |
3.83 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
20.32 mm |
HC/UH |
|||||||||||||||
|
STMicroelectronics |
NAND GATE |
FLAT |
14 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
2 |
CMOS |
2 |
FLATPACK |
FL14,.3 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
20 V |
2.33 mm |
6.91 mm |
3 V |
SEATED HT-CALCULATED |
9.95 mm |
4000/14000/40000 |
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STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
2 |
TTL |
4 |
5 |
IN-LINE |
15 ns |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
5.5 V |
4.5 V |
e0 |
LS |
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STMicroelectronics |
AND GATE |
COMMERCIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
TTL |
2 |
5 |
5 |
15 pF |
SMALL OUTLINE |
SOP14,.25 |
35 ns |
8 Amp |
Gates |
1.27 mm |
70 Cel |
OPEN-COLLECTOR |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
4.75 V |
8.8 mA |
e0 |
8.65 mm |
LS |
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|
STMicroelectronics |
BUFFER |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
AEC-Q100 |
1 |
3 |
SMALL OUTLINE |
7 ns |
1.27 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
DUAL |
R-PDSO-G14 |
3.6 V |
1.75 mm |
3.9 mm |
2 V |
NOT SPECIFIED |
NOT SPECIFIED |
8.65 mm |
LVC/LCX/Z |
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STMicroelectronics |
AND-OR-INVERT GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
NO |
CMOS |
5/15 |
IN-LINE |
DIP14,.3 |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T14 |
Not Qualified |
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STMicroelectronics |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3 |
CMOS |
3 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
115 ns |
4 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T14 |
6 V |
3.7 mm |
7.62 mm |
Not Qualified |
2 V |
e0 |
19 mm |
HC/UH |
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|
STMicroelectronics |
INVERTER |
MILITARY |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
8.3 ns |
24 Amp |
Gates |
.95 mm |
125 Cel |
OPEN-DRAIN |
-55 Cel |
TIN |
DUAL |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1.625 mm |
Not Qualified |
1.65 V |
e3 |
2.9 mm |
TTL/H/L |
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STMicroelectronics |
XOR GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC |
NO |
YES |
4 |
CMOS |
2 |
STRIP PACK |
5 |
FLATPACK |
FL14,.2 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F14 |
6 V |
2.33 mm |
6.91 mm |
2 V |
SEATED HT-CALCULATED |
9.95 mm |
HC/UH |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.