INDUSTRIAL Other Function Logic ICs 314

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Schmitt Trigger Surface Mount No. of Functions Maximum Frequency At Nominal Supply Technology Screening Level No. of Inputs No. of Bits Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Count Direction Output Characteristics Trigger Type Minimum Operating Temperature Terminal Finish Terminal Position Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

NC7SV58FHX

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.1

1.2/3.3

15 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

2 Amp

Gates

.35 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

S-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.9 V

e4

30

260

1 mm

AUP/ULP/V

74AUP1G57L6X

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.1 Amp

Gates

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

R-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1.45 mm

AUP/ULP/V

74AUP1G57FHX

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

1.1 Amp

Gates

.35 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

S-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1 mm

AUP/ULP/V

74AUP1G58FHX

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

1.1 Amp

Gates

.35 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

S-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1 mm

AUP/ULP/V

74AUP1G98L6X

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.1 Amp

Gates

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

R-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1.45 mm

AUP/ULP/V

74AUP1T97FHX

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

2.5

2.5/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

3.1 Amp

Gates

.35 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

S-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

2.3 V

e4

30

260

1 mm

AUP/ULP/V

74AUP1G58L6X

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.1 Amp

Gates

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

R-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1.45 mm

AUP/ULP/V

74AUP1G98FHX

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

1.1 Amp

Gates

.35 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

S-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1 mm

AUP/ULP/V

74AUP1G97L6X

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.1 Amp

Gates

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM

DUAL

R-PDSO-N6

1

3.6 V

.55 mm

1 mm

Not Qualified

.8 V

e4

30

260

1.45 mm

AUP/ULP/V

HCF4529BC1

STMicroelectronics

LOGIC CIRCUIT

INDUSTRIAL

J BEND

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

5

CHIP CARRIER

1.27 mm

85 Cel

3-STATE

-40 Cel

MATTE TIN

QUAD

S-PQCC-J20

15 V

4.57 mm

8.9662 mm

Not Qualified

3 V

e3

8.9662 mm

4000/14000/40000

HCF4529BM1

STMicroelectronics

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

5

SMALL OUTLINE

1.27 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

15 V

1.75 mm

3.9 mm

Not Qualified

3 V

e4

9.9 mm

4000/14000/40000

PCA9641BS

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

3.6 V

1 mm

3 mm

2.3 V

3 mm

9641

933520200112

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

5

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-GDIP-T28

12.5 V

5.84 mm

15.24 mm

Not Qualified

4.5 V

NOT SPECIFIED

NOT SPECIFIED

4751

PCA9641BSHP

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

TR, 13 INCH

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

3.6 V

1 mm

3 mm

2.3 V

e4

30

260

3 mm

9641

PCA9641PW

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

3.6 V

1.1 mm

4.4 mm

2.3 V

NOT SPECIFIED

NOT SPECIFIED

5 mm

9641

PCA9641PW,118

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

3.6 V

1.1 mm

4.4 mm

2.3 V

5 mm

9641

PCA9641BSJ

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

3.6 V

1 mm

3 mm

2.3 V

3 mm

9641

HEF4751VTD-T

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

12.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

17.9 mm

4751

HEF4751VT-T

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

12.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

e4

17.9 mm

4751

HEF4751VTD

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

12.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

17.9 mm

4751

HEF4751VT

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5

5/10

SMALL OUTLINE

SOP28,.4

Prescaler/Multivibrators

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

12.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

e4

17.9 mm

4751

CBT16292DG-T

NXP Semiconductors

INDUSTRIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G56

Not Qualified

HEF4751VDF

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

5

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-GDIP-T28

12.5 V

5.84 mm

15.24 mm

Not Qualified

4.5 V

4751

HEF4751VD

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

5

5/10

IN-LINE

DIP28,.6

Prescaler/Multivibrators

2.54 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-GDIP-T28

12.5 V

5.84 mm

15.24 mm

Not Qualified

4.5 V

e3/e4

4751

HEF4751VPN

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T28

12.5 V

5.1 mm

15.24 mm

Not Qualified

4.5 V

e3/e4

35.5 mm

4751

HEF4751VP

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5

5/10

IN-LINE

DIP28,.6

Prescaler/Multivibrators

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T28

12.5 V

5.1 mm

15.24 mm

Not Qualified

4.5 V

35.5 mm

4751

CBT16292DG

NXP Semiconductors

INDUSTRIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G56

Not Qualified

GTL2010BS-T

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

2.5,3.3

CHIP CARRIER

LCC24,.16SQ,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

Not Qualified

GTL2000DGG,112

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

MOS

2.5,3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G48

1

Not Qualified

30

260

PI3B3251IQ

Diodes Incorporated

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

PI3B16209A48

Diodes Incorporated

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

PI3B162209A48

Diodes Incorporated

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

PI5C3383SE

Diodes Incorporated

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

5

5

SMALL OUTLINE

SOP24,.4

Other Logic ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

Not Qualified

PI5C34X2383

Diodes Incorporated

INDUSTRIAL

GULL WING

80

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

5

5

SMALL OUTLINE, SHRINK PITCH

SSOP80,.25,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G80

Not Qualified

e0

PI3B3251IW

Diodes Incorporated

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP16,.3

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

PI3B162209V48

Diodes Incorporated

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

PI13B16209A

Diodes Incorporated

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

PI3B3251IL

Diodes Incorporated

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

PI13B16209V

Diodes Incorporated

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

PI5C34X383

Diodes Incorporated

INDUSTRIAL

GULL WING

80

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

5

5

SMALL OUTLINE, SHRINK PITCH

SSOP80,.25,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G80

Not Qualified

e0

PI74ALVCH16260V56

Diodes Incorporated

INDUSTRIAL

GULL WING

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP56,.4

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G56

Not Qualified

e0

PI3B16209V48

Diodes Incorporated

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3.3

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

Other Logic ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G48

Not Qualified

e0

MAX9383ESA+

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5.2

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

5.5 V

1.75 mm

3.9 mm

Not Qualified

4.75 V

e3

30

260

4.9 mm

MAX9382ESA

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.5

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

5.5 V

1.75 mm

3.9 mm

Not Qualified

4.2 V

e0

4.9 mm

MAX9383EUA-T

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

5.2

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

5.5 V

1.1 mm

3 mm

Not Qualified

4.75 V

e0

245

3 mm

MAX9382EUA+T

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

4.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

5.5 V

1.1 mm

3 mm

Not Qualified

4.2 V

e3

3 mm

MAX9382EUA

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

4.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

5.5 V

1.1 mm

3 mm

Not Qualified

4.2 V

e0

3 mm

MAX9382ESA+T

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.5

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

5.5 V

1.75 mm

3.9 mm

Not Qualified

4.2 V

e3

4.9 mm

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.