INDUSTRIAL Other Function Logic ICs 314

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
HD74LVC1G97CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HPL4-82C338-9	Renesas Electronics		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS		5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20					Not Qualified
HD74LVC1G58CLE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HD74LVC1G58CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HPL1-82C138-9	Renesas Electronics		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC		NO		CMOS		5	5		IN-LINE	DIP16,.3		Other Logic ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-XDIP-T16					Not Qualified
HD74LVC1G97CLE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
HD74ALVCH16269TEL	Renesas Electronics		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G56					Not Qualified
HD74LVC1G98CLE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
74ALVCHR162260PF	Renesas Electronics		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.25,16		Other Logic ICs	.4 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G56	1				Not Qualified			e0	30	240
HD74LVC1G57CLE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
RD74LVC1G98WPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.4 mm	.7 mm	Not Qualified	1.65 V					1.1 mm	LVC/LCX/Z
HD74LV1GW97ACME	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	6 Amp	Logic IC:Other	.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V		e6			2 mm	LV/LV-A/LVX/H
HPL4-82C338-9+	Renesas Electronics		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	CERAMIC		YES		CMOS		5	5		CHIP CARRIER	LCC20,.35SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20
CD4037AE	Renesas Electronics		INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO		CMOS					IN-LINE	DIP14,.3		Other Logic ICs	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14					Not Qualified			e0
HPL1-82C138-9+	Renesas Electronics		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC		NO		CMOS		5	5		IN-LINE	DIP16,.3		Other Logic ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-XDIP-T16
HD74LV1GW98ACME	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	6 Amp	Logic IC:Other	.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V		e6			2 mm	LV/LV-A/LVX/H
674R-01ILF	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		3.3	3.3/5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.25		Prescaler/Multivibrators	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	5.5 V	1.75 mm	3.9 mm	Not Qualified	3 V	ALSO OPERATES WITH 5V SUPPLY	e3	30	260	9.9 mm	674
HPL1-82C139-9	Renesas Electronics		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC		NO		CMOS		5	5		IN-LINE	DIP16,.3		Other Logic ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-XDIP-T16					Not Qualified
HPL4-82C339-9	Renesas Electronics		INDUSTRIAL	NO LEAD	28	QCCN	SQUARE	CERAMIC		YES		CMOS		5	5		CHIP CARRIER	LCC28,.45SQ		Other Logic ICs	1.27 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N28					Not Qualified
HD74LV1GW58ACME	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	6 Amp	Logic IC:Other	.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		5.5 V	1.1 mm	1.25 mm	Not Qualified	1.65 V		e6			2 mm	LV/LV-A/LVX/H
74ALVCHR162409PA	Renesas Electronics		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20		Other Logic ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G56	1				Not Qualified			e0	20	240
HD74LVC1G57CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
74ALVCH162270PF	Renesas Electronics		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS		3.3	3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.25,16		Other Logic ICs	.4 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G56	1				Not Qualified			e0	30	240
HD74LVC1G98CPE	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V					1.4 mm	LVC/LCX/Z
SLG7NT4180V	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	2			3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N12		3.6 V	.8 mm	2.5 mm		3 V	TWO DIFFRENT FUCTION AND AND OR FUCTION		NOT SPECIFIED	NOT SPECIFIED	2.5 mm	4180
SLG7NT4180VTR	Renesas Electronics	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	2			3.3			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N12		3.6 V	.8 mm	2.5 mm		3 V	TWO DIFFRENT FUCTION AND AND OR FUCTION				2.5 mm	4180

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.