Analog Devices Other Function Logic ICs 52

Reset All

Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
MAX6816EUS+T	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	4	LSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		BICMOS			5	3/5	SMALL OUTLINE, LOW PROFILE	TO-253	Other Logic ICs	1.92 mm	125 Cel	3-STATE		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G4	1	5.5 V	1.22 mm	1.3 mm	Not Qualified		2.7 V		e3	30	260	2.92 mm	6816
MAX6816EUS-TG48	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	4	LSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		BICMOS			5		SMALL OUTLINE, LOW PROFILE			1.92 mm	125 Cel	3-STATE		-40 Cel		DUAL	R-PDSO-G4		5.5 V	1.22 mm	1.3 mm			2.7 V			NOT SPECIFIED	NOT SPECIFIED	2.92 mm	6816
MAX6817EUT+T	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	2		BICMOS			5	3/5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37	Other Logic ICs	.95 mm	125 Cel	3-STATE		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	5.5 V	1.45 mm	1.625 mm	Not Qualified		2.7 V		e3	30	260	2.9 mm	6817
MAX6818EAP+T	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		BICMOS			5	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Logic ICs	.65 mm	125 Cel	3-STATE		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	5.5 V	1.99 mm	5.29 mm	Not Qualified		2.7 V		e3	30	260	7.2 mm	6816
MAX6816EUS+	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	4	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		BICMOS			5	3/5	SMALL OUTLINE	TO-253	Other Logic ICs		125 Cel			-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G4	1	5.5 V			Not Qualified		2.7 V		e3	30	260		6816
MAX6818EAP+	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1		CMOS				3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Logic ICs	.65 mm	125 Cel	3-STATE		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	5.5 V	1.99 mm	5.29 mm	Not Qualified		2.7 V		e3	30	260	7.2 mm
HMC744LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1					3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3	3.6 V	.92 mm	3 mm			3 V		e4	30	260	3 mm	744
HMC744LC3TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				TR	3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Clock Drivers	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3	3.6 V	.92 mm	3 mm	Not Qualified		3 V			30	260	3 mm	744
HMC713LP3ETR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				TR	3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel		QUAD	S-PQCC-N16		5.5 V	1 mm	3 mm			2.7 V			NOT SPECIFIED	NOT SPECIFIED	3 mm	713
MAX6817EUT+	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	2		BICMOS			5	3/5	SMALL OUTLINE	TSOP6,.11,37	Other Logic ICs	.95 mm	125 Cel			-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	5.5 V			Not Qualified		2.7 V		e3	30	260		6817
MAX6818EAP/GG8	Analog Devices	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	8		BICMOS			5		SMALL OUTLINE				125 Cel	3-STATE		-40 Cel		DUAL	R-PDSO-G20		5.5 V					2.7 V			NOT SPECIFIED	NOT SPECIFIED		6818
HMC848LC5	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1		BICMOS			3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20	Decoder/Drivers	.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V		e4			5 mm	848
HMC848LC5TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1		BICMOS		TR	3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20	Decoder/Drivers	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V					5 mm	848
HMC847LC5TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1		BICMOS	4	TR	3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20	Multiplexer/Demultiplexers	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V			NOT SPECIFIED	NOT SPECIFIED	5 mm	847
HMC850LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3		.92 mm	3 mm					e4	30	260	3 mm	850
HMC713LP3E	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1					3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	5.5 V	1 mm	3 mm	Not Qualified		2.7 V		e3			3 mm	713
HMC850LC3TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				TR		-3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Clock Drivers	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3		.92 mm	3 mm	Not Qualified					30	260	3 mm	850
HMC988LP3ETR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				TR	3.3	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Clock Drivers	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	3.5 V	1 mm	3 mm	Not Qualified		3.1 V	ALSO OPERATES ON 3.7 TO 5.5V SUPPLY	e3			3 mm	988
HMC724LC3TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1				TR		-3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Clock Drivers	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3		.92 mm	3 mm	Not Qualified					30	260	3 mm	724
HMC746LC3C	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	4					3.3		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3	3.6 V	1.31 mm	3 mm	Not Qualified		3 V		e4	30	260	3 mm	746
HMC746LC3CTR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1		BICMOS		TR	3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	Gates	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3	3.6 V	1.31 mm	3 mm	Not Qualified		3 V			30	260	3 mm	746
ADDS2121	Analog Devices
ADDS2133C	Analog Devices
ADDS2151AE	Analog Devices
ADDS2150AE	Analog Devices
ADDS2150A	Analog Devices
ADDS2130	Analog Devices
ADDS2190	Analog Devices
ADDS2151A	Analog Devices
HMC953LC4B	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	2							CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N24	3		1.2 mm	4 mm							260	4 mm	953
ADDS2123C	Analog Devices
435J	Analog Devices
DS1291	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO			CMOS					IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	DUAL	R-PDIP-T16					Not Qualified				e0
DS1291N	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	1		CMOS			5		IN-LINE	DIP16,.3	Other Logic ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	DUAL	R-PDIP-T16		5.5 V	4.572 mm	7.62 mm	Not Qualified		4.5 V		e0			19.175 mm
DS1292	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY		NO			CMOS					IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	DUAL	R-PDIP-T24					Not Qualified				e0
DS1293N	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	1		CMOS			5		IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	DUAL	R-PDIP-T24		5.5 V	4.572 mm	7.62 mm	Not Qualified		4.5 V		e0			30.545 mm
DS1293	Analog Devices	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY		NO			CMOS					IN-LINE	DIP24,.3	Other Logic ICs	2.54 mm	70 Cel			0 Cel	TIN LEAD	DUAL	R-PDIP-T24					Not Qualified				e0
HMC959LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3		1.31 mm	3 mm							260	3 mm	959
HMC720LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1						-3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Clock Drivers	.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16			.92 mm	3 mm	Not Qualified				e4			3 mm	720
HMC724LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3		.92 mm	3 mm					e4	30	260	3 mm	724
HMC988LP3E	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY		YES	1					3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ		.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	3.5 V	1 mm	3 mm		COMPLEMENTARY	3.1 V		e3		260	3 mm	988
HMC851LC3CTR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1		BICMOS		TR		-3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	Gates	.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3		1.31 mm	3 mm	Not Qualified					30	260	3 mm	851
HMC853LC3TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	28000000000 Hz	BICMOS		TR		-3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	FF/Latches	.5 mm	85 Cel		POSITIVE EDGE	-40 Cel		QUAD	S-CQCC-N16	3		.92 mm	3 mm	Not Qualified					30	260	3 mm	853
HMC853LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	28000000000 Hz	BICMOS				-3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	FF/Latches	.5 mm	85 Cel		POSITIVE EDGE	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3		.92 mm	3 mm	Not Qualified				e4	30	260	3 mm	853
HMC853LC3C0	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16			.92 mm	3 mm								3 mm	853
HMC844LC4BTR	Analog Devices	LOGIC CIRCUIT	OTHER	NO LEAD	24	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1		BICMOS		TR		-3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	Gates	.5 mm	70 Cel			-40 Cel		QUAD	S-CQCC-N24			1.2 mm	4 mm	Not Qualified							4 mm	844
HMC859LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1							CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel			-40 Cel		QUAD	S-CQCC-N16	3		1.31 mm	3 mm							260	3 mm	859
HMC847LC5	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1		BICMOS	4		3.3	3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20	Multiplexer/Demultiplexers	.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V		e4			5 mm	847

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.