DDR1 DRAM DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4X56323PG-8GCAT

Samsung

DDR1 DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

8388608 words

2,4,8,16

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

268435456 bit

.0003 Amp

2,4,8,16

6 ns

K4H280838E-TCAA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

2.5

8

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

22.22 mm

.75 ns

K4H560438E-UCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

260 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

.003 Amp

2,4,8

22.22 mm

.7 ns

K4H510838B-NLB0

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

340 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

.75 ns

K4H560838D-NLA2

Samsung

DDR1 DRAM

COMMERCIAL

54

SOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

2.7 V

133 MHz

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

.75 ns

K4H280838B-TLA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

375 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.03 Amp

2,4,8

22.22 mm

.75 ns

KM416L16331AT-G0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

175 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.025 Amp

2,4,8

22.22 mm

.8 ns

K4H560838E-ZLB0

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

250 mA

33554432 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

BOTTOM

R-PBGA-B60

3

133 MHz

Not Qualified

268435456 bit

260

.003 Amp

2,4,8

K4H560838E-VCCC0

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.6

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G54

2

2.7 V

1.2 mm

7.6 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

14 mm

.65 ns

K4C89363AF-GCFB0

Samsung

DDR1 DRAM

OTHER

144

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

36

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX36

8M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B144

2.625 V

1.2 mm

10.5 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

15.5 mm

.5 ns

K4H510438C-ZLA2

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

325 mA

134217728 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H1G1638M-TLB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

67108864 words

YES

2.5

16

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

64MX16

64M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.7 ns

K4H560838F-TLAA

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

280 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

22.22 mm

.75 ns

K4H560838D-TLA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

235 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

100 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

22.22 mm

.8 ns

K4H280438B-TCB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

350 mA

33554432 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

DUAL

R-PDSO-G66

133 MHz

Not Qualified

134217728 bit

.03 Amp

2,4,8

.75 ns

K4H510438G-LCB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

210 mA

134217728 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN BISMUTH

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

e6

260

.005 Amp

2,4,8

.7 ns

K4X56163PG-FGCA

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

90 mA

16777216 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B60

111 MHz

Not Qualified

268435456 bit

.0003 Amp

2,4,8,16

6 ns

K4H511638G-LC/LCC

Samsung

DDR1 DRAM

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

16

SMALL OUTLINE, THIN PROFILE

.65 mm

32MX16

32M

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.55 ns

K4H560838E-ULB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

.003 Amp

2,4,8

22.22 mm

.75 ns

K4H510838B-ZCB0

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

3

133 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.75 ns

K4H511638J-BCB3T

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

166 MHz

Not Qualified

536870912 bit

e3

260

.005 Amp

2,4,8

.7 ns

K4H560838D-GLA20

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

14 mm

.75 ns

K4H510838J-LPCC0

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

200 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

260

.005 Amp

2,4,8

22.22 mm

.65 ns

K4H510438B-VLA20

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.4 mm

70 Cel

128MX4

128M

0 Cel

DUAL

1

R-PDSO-G54

2

2.7 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

11.2 mm

.75 ns

KM44L64331AT-GZ0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

67108864 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

268435456 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.75 ns

KM44L32031BT-F00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

32MX4

32M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

134217728 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.8 ns

K4X51323PI-8GC6000

Samsung

DDR1 DRAM

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

16MX32

16M

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

9 mm

536870912 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

13 mm

5.5 ns

K4H1G0838M-TLA20

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

300 mA

134217728 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX8

128M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

240

.008 Amp

2,4,8

22.22 mm

.75 ns

K4H561638D-TLB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

2.5

16

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

22.22 mm

.7 ns

K4H280438C-TLB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

315 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX4

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

e0

.004 Amp

2,4,8

22.22 mm

.75 ns

K4H560438H-ZCCC0

Samsung

DDR1 DRAM

COMMERCIAL

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

300 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.6

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

BOTTOM

1

R-PBGA-B60

3

2.7 V

1.2 mm

200 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

.004 Amp

2,4,8

14 mm

.65 ns

K4H560838E-TCA2

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

22.22 mm

.75 ns

K4D263238M-QC550

Samsung

DDR1 DRAM

COMMERCIAL

100

TQFP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

2.5

32

FLATPACK, THIN PROFILE

.65 mm

65 Cel

4MX32

4M

0 Cel

QUAD

1

R-PQFP-G100

2.625 V

1.2 mm

14 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

30

240

20 mm

.75 ns

K4H511638D-ULB00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

345 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

.005 Amp

2,4,8

22.22 mm

.75 ns

K4X51163PE-LEC3T

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

33554432 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

R-PBGA-B60

133 MHz

Not Qualified

536870912 bit

.000015 Amp

2,4,8,16

6 ns

K4H511638D-UPB00

Samsung

DDR1 DRAM

INDUSTRIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

345 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

2,4,8

22.22 mm

.75 ns

K4H510838D-ZLB30

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

12 mm

.7 ns

K4H560838E-ZCCCT

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

310 mA

33554432 words

2,4,8

COMMON

2.6

2.6

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

BOTTOM

R-PBGA-B60

3

200 MHz

Not Qualified

268435456 bit

260

.004 Amp

2,4,8

.65 ns

K4X56323PI-7EC30

Samsung

DDR1 DRAM

OTHER

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

8388608 words

2,4,8,16

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.00001 Amp

2,4,8,16

13 mm

6 ns

K4H560838E-ULAA0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.75 ns

K4X56163PI-LGC30

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

95 mA

16777216 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

133 MHz

Not Qualified

268435456 bit

e1

240

.00001 Amp

2,4,8,16

6 ns

K4X56323PI-7GC6T

Samsung

DDR1 DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

8388608 words

2,4,8,16

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

268435456 bit

.00001 Amp

2,4,8,16

5.5 ns

K4H560438D-TCA20

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

67108864 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

22.22 mm

.75 ns

K4H561638F-ULB0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

300 mA

16777216 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

R-PDSO-G66

3

133 MHz

Not Qualified

268435456 bit

260

2,4,8

K4H280438F-UCA00

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

32MX4

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

.8 ns

K4H560438E-ULB0T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

67108864 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

MATTE TIN

DUAL

R-PDSO-G66

1

133 MHz

Not Qualified

268435456 bit

e3

.003 Amp

2,4,8

.75 ns

K4H560438E-NLA20

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

260 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.36,20

DRAMs

.5 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

DUAL

1

R-PDSO-G54

3

2.7 V

1.2 mm

133 MHz

7.6 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

240

.003 Amp

2,4,8

14 mm

.75 ns

K4H511638B-UCB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

33554432 words

2,4,8

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP66,.46

DRAMs

.635 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

R-PDSO-G66

3

166 MHz

Not Qualified

536870912 bit

260

.005 Amp

2,4,8

.7 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.