Samsung - K4X51323PI-8GC6000

K4X51323PI-8GC6000 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K4X51323PI-8GC6000
Description DDR1 DRAM; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 5.5 ns; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
Datasheet K4X51323PI-8GC6000 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX32
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 90
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B90
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: VFBGA
Width: 9 mm
No. of Ports: 1
Memory Density: 536870912 bit
Self Refresh: YES
Memory IC Type: DDR1 DRAM
Memory Width: 32
No. of Functions: 1
Length: 13 mm
Maximum Access Time: 5.5 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Maximum Supply Voltage (Vsup): 1.95 V
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