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Manufacturer | Samsung |
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Manufacturer's Part Number | K4X51323PI-8GC6000 |
Description | DDR1 DRAM; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 5.5 ns; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; |
Datasheet | K4X51323PI-8GC6000 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 16MX32 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1 mm |
Access Mode: | FOUR BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.7 V |
Surface Mount: | YES |
No. of Terminals: | 90 |
No. of Words: | 16777216 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B90 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | VFBGA |
Width: | 9 mm |
No. of Ports: | 1 |
Memory Density: | 536870912 bit |
Self Refresh: | YES |
Memory IC Type: | DDR1 DRAM |
Memory Width: | 32 |
No. of Functions: | 1 |
Length: | 13 mm |
Maximum Access Time: | 5.5 ns |
No. of Words Code: | 16M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Maximum Supply Voltage (Vsup): | 1.95 V |