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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT47H128M8SH-25EIT:M |
Description | DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; |
Datasheet | MT47H128M8SH-25EIT:M Datasheet |
In Stock | 1,422 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | DRAMs |
Surface Mount: | YES |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | TFBGA |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Self Refresh: | YES |
Sequential Burst Length: | 4,8 |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA60,9X11,32 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Maximum Standby Current: | .01 Amp |
Organization: | 128MX8 |
Output Characteristics: | 3-STATE |
Maximum Seated Height: | 1.2 mm |
Maximum Supply Current: | 210 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 60 |
Maximum Clock Frequency (fCLK): | 400 MHz |
No. of Words: | 134217728 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B60 |
Maximum Operating Temperature: | 95 Cel |
Width: | 8 mm |
Memory Density: | 1073741824 bit |
Memory IC Type: | DDR2 DRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Refresh Cycles: | 8192 |
Interleaved Burst Length: | 4,8 |
Length: | 10 mm |
Maximum Access Time: | .4 ns |
No. of Words Code: | 128M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 1.9 V |
Power Supplies (V): | 1.8 |