DDR1 DRAM MODULE DRAM 11

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

M470L1714BT0-CA2

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1820 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

133 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.34 Amp

.75 ns

M366S6453JUS-C7A

Samsung

DDR1 DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1504 mA

67108864 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

133 MHz

Not Qualified

4294967296 bit

3 V

AUTO/SELF REFRESH

260

.032 Amp

133.35 mm

5.4 ns

M366S3253JUS-C7A

Samsung

DDR1 DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1280 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

133 MHz

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

260

.016 Amp

133.35 mm

5.4 ns

M366S1654JUS-C7A

Samsung

DDR1 DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

640 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

25.53 mm

133 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

260

.008 Amp

133.35 mm

5.4 ns

M470L1714BT0-LB0

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1820 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

133 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.34 Amp

.75 ns

M470L1714BT0-LA2

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1820 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

133 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.34 Amp

.75 ns

K4X56163PE-LFG000

Samsung

DDR1 DRAM MODULE

OTHER

60

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

NO

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

16MX16

16M

-25 Cel

DUAL

1

R-XDMA-N240

1.95 V

1 mm

9 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

11 mm

7 ns

M470L1714BT0-CB0

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1820 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

133 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.34 Amp

.75 ns

M470L1714BT0-LA0

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1500 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

100 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.28 Amp

.8 ns

M470L6524GL0-CB3

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

MULTI BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

2.5

64

MICROELECTRONIC ASSEMBLY

.6 mm

70 Cel

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N200

2.7 V

31.9 mm

4294967296 bit

2.3 V

AUTO/SELF REFRESH

67.6 mm

.6 ns

M470L1714BT0-CA0

Samsung

DDR1 DRAM MODULE

COMMERCIAL

200

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1500 mA

16777216 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1

2.7 V

100 MHz

Not Qualified

1073741824 bit

2.3 V

AUTO/SELF REFRESH

.28 Amp

.8 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.