Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
SYNCHRONOUS DRAM |
MILITARY |
50 |
DFP |
4096 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
FLAT |
SYNCHRONOUS |
175 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK |
FL50,.67,32 |
DRAMs |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-CDFP-F50 |
3.465 V |
3.55 mm |
66 MHz |
16.5 mm |
Not Qualified |
16777216 bit |
3.135 V |
AUTO REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
1,2,4,8 |
21 mm |
9 ns |
||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
R-PDSO-G44 |
66.66 MHz |
Not Qualified |
16777216 bit |
.003 Amp |
12 ns |
|||||||||||||||||||||||||||
Onsemi |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
GULL WING |
120 mA |
131072 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128KX16 |
128K |
0 Cel |
DUAL |
R-PDSO-G50 |
66 MHz |
Not Qualified |
2097152 bit |
.002 Amp |
1,2,4,8 |
|||||||||||||||||||||||||||
Onsemi |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
GULL WING |
160 mA |
131072 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128KX16 |
128K |
0 Cel |
DUAL |
R-PDSO-G50 |
100 MHz |
Not Qualified |
2097152 bit |
.002 Amp |
1,2,4,8 |
|||||||||||||||||||||||||||
Onsemi |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
GULL WING |
90 mA |
131072 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128KX16 |
128K |
0 Cel |
DUAL |
R-PDSO-G50 |
29 MHz |
Not Qualified |
2097152 bit |
.002 Amp |
2,4,8 |
17 ns |
||||||||||||||||||||||||||
Onsemi |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
GULL WING |
140 mA |
131072 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128KX16 |
128K |
0 Cel |
DUAL |
R-PDSO-G50 |
83 MHz |
Not Qualified |
2097152 bit |
.002 Amp |
1,2,4,8 |
|||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
60 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.95 V |
105 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
4096 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
52 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
64 |
UNCASED CHIP |
WAFER |
DRAMs |
90 Cel |
3-STATE |
2MX64 |
2M |
-25 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
104 MHz |
Not Qualified |
134217728 bit |
1.65 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
8192 |
CMOS |
85 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
DIE OR CHIP |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-20 Cel |
133 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
95 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
32 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX32 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
85 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
COMMERCIAL EXTENDED |
DIE |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
UNCASED CHIP |
85 Cel |
32MX16 |
32M |
-30 Cel |
UPPER |
1 |
R-XUUC-N |
1.9 V |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
DIE |
4096 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
80 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
3-STATE |
8MX16 |
8M |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
133 MHz |
Not Qualified |
134217728 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
80 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
WAFER |
DRAMs |
85 Cel |
3-STATE |
16MX16 |
16M |
-30 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.95 V |
133 MHz |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
DIE |
8192 |
UNSPECIFIED |
UNSPECIFIED |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
85 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
UNCASED CHIP |
DIE OR CHIP |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
UPPER |
1 |
X-XUUC-N |
1 |
1.9 V |
133 MHz |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
.00001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||
STMicroelectronics |
SYNCHRONOUS DRAM |
OTHER |
8192 |
CMOS |
85 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
WAFER |
DRAMs |
85 Cel |
3-STATE |
32MX16 |
32M |
-30 Cel |
133 MHz |
Not Qualified |
536870912 bit |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
7 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
190 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
195 mA |
262144 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP128,.67X.93,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G128 |
166 MHz |
Not Qualified |
8388608 bit |
e0 |
.001 Amp |
|||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
145 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
140 mA |
4194304 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
6 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
130 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
MOS |
GULL WING |
SYNCHRONOUS |
145 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
18.41 mm |
8 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
900 mA |
4194304 words |
1,2,4,8,16 |
YES |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH; LG-MAX |
e0 |
.0005 Amp |
1,2,4,8,16 |
22.62 mm |
6 ns |
|||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
240 mA |
16777216 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
160 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
130 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
3.3 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
64MX4 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
6 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
1.95 V |
8 mm |
Not Qualified |
268435456 bit |
1.65 V |
AUTO/SELF REFRESH |
12 mm |
5.4 ns |
||||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
128MX4 |
128M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
6 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
240 mA |
33554432 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
262144 words |
COMMON |
3.3 |
3.3 |
32 |
CHIP CARRIER |
LDCC68,1.0SQ |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J68 |
133 MHz |
Not Qualified |
8388608 bit |
e0 |
|||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
130 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
230 mA |
16777216 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.0015 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
130 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
900 mA |
16777216 words |
1,2,4,8,16 |
YES |
COMMON |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
66 MHz |
10.16 mm |
67108864 bit |
3 V |
AUTO/SELF REFRESH; LG-MAX |
.0005 Amp |
1,2,4,8,16 |
22.62 mm |
12 ns |
||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
4194304 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
5 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
7 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.