Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
110 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
105 MHz |
Not Qualified |
67108864 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
52 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
115 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B52 |
3 |
2.7 V |
1 mm |
133 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
11 mm |
5.4 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G54 |
3 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
225 mA |
67108864 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.004 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
133 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
85 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
260 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
110 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
1 |
3.6 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
.001 Amp |
1,2,4,8 |
11 mm |
7 ns |
|||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
Tin/Bismuth (Sn/Bi) |
DUAL |
1 |
R-PDSO-G86 |
3 |
3.6 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e6 |
40 |
260 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.5 ns |
||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
190 mA |
67108864 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX4 |
64M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
268435456 bit |
e0 |
.002 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
170 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
111 MHz |
Not Qualified |
268435456 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
95 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
111 MHz |
Not Qualified |
134217728 bit |
.0003 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
2.7 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
11 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
135 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G54 |
3 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
110 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
3 |
111 MHz |
Not Qualified |
67108864 bit |
240 |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
140 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
1 |
111 MHz |
Not Qualified |
268435456 bit |
.0003 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
50 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G54 |
3 |
133 MHz |
Not Qualified |
268435456 bit |
e6 |
260 |
.002 Amp |
1,2,4,8 |
5.4 ns |
||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
125 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
1 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
|||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
134217728 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
TIN BISMUTH |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
e6 |
260 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
90 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
133 MHz |
Not Qualified |
134217728 bit |
.0003 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
2 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
13 mm |
6 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
120 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
1,2,4,8 |
22.22 mm |
5 ns |
|||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
260 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
64 |
MICROELECTRONIC ASSEMBLY |
.5 mm |
95 Cel |
2GX64 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N260 |
1.26 V |
30.15 mm |
3.6 mm |
137438953472 bit |
1.14 V |
AUTO/SELF REFRESH; WD-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
69.9 mm |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
170 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G50 |
125 MHz |
Not Qualified |
16777216 bit |
e0 |
.002 Amp |
4,8 |
5.5 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
100 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
3 |
111 MHz |
Not Qualified |
67108864 bit |
240 |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
e1 |
260 |
13 mm |
6 ns |
||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
320 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
268435456 bit |
e0 |
.0012 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
320 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
268435456 bit |
e0 |
.0012 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
4194304 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
4MX16 |
4M |
0 Cel |
TIN BISMUTH |
DUAL |
1 |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e6 |
22.22 mm |
5 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
60 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
1 |
111 MHz |
Not Qualified |
134217728 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
50 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
3 |
111 MHz |
Not Qualified |
67108864 bit |
260 |
.0003 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
30 |
240 |
8 mm |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
52 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
120 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B52 |
3.6 V |
1 mm |
105 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
.0005 Amp |
1,2,4,8 |
11 mm |
7 ns |
||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
100 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
3 |
111 MHz |
Not Qualified |
67108864 bit |
240 |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
150 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
4,8 |
7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
270 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
145 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
83 MHz |
Not Qualified |
16777216 bit |
e0 |
.002 Amp |
4,8 |
8 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
170 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
111 MHz |
Not Qualified |
268435456 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
111 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
150 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G54 |
3 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
4,8 |
7 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
185 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1 mm |
133 MHz |
8.1 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
15.1 mm |
5.4 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
52 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
135 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B52 |
3.6 V |
1 mm |
133 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
.0005 Amp |
1,2,4,8 |
11 mm |
5.4 ns |
||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
170 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G86 |
166 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
1,2,4,8 |
5.5 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
180 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G86 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.