Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
720 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX64 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
25.53 mm |
3.81 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH; WD-MAX |
.0024 Amp |
67.6 mm |
60 ns |
|||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
600 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
R-PDMA-N144 |
100 MHz |
Not Qualified |
268435456 bit |
.008 Amp |
7 ns |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
960 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
DIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
480 mA |
262144 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX64 |
256K |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
125 MHz |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
6.5 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
1 |
3.6 V |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
7 ns |
|||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
1.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
1.9 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
12 mm |
.55 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
630 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
143 MHz |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
400 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
25.4 mm |
100 MHz |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
6 ns |
|||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
5.4 ns |
|||||||||||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1080 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.8 |
2.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.94 V |
1.4 mm |
300 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.66 V |
AUTO/SELF REFRESH |
e0 |
.08 Amp |
2,4,8 |
12 mm |
.6 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
760 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
262144 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX64 |
256K |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
12 mm |
.7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
880 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
29.9974 mm |
133 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
|||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
444 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
.0016 Amp |
60 ns |
||||||||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.7 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
840 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
1 |
3.6 V |
29.9974 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
7 ns |
|||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
144 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
64 |
MICROELECTRONIC ASSEMBLY |
16MX64 |
16M |
DUAL |
1 |
R-XDMA-N144 |
Not Qualified |
1073741824 bit |
6 ns |
||||||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1048576 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX64 |
1M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
8 ns |
||||||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
920 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
133 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
480 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
268435456 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
.0008 Amp |
50 ns |
||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1760 mA |
67108864 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
100 MHz |
Not Qualified |
4294967296 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.032 Amp |
6 ns |
||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
620 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
6 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
R-PDMA-N144 |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
.008 Amp |
7 ns |
||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
314 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
1 |
1.9 V |
1.4 mm |
300 MHz |
12 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
2,4,8 |
12 mm |
.55 ns |
||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
2 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.7 ns |
|||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
960 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
.0024 Amp |
50 ns |
||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
26.67 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
7 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4194304 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
7 ns |
||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
TIN SILVER COPPER |
DUAL |
R-PDMA-N144 |
3 |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
e1 |
.016 Amp |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
820 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
.024 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY |
BGA144,12X18,40/32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
333 MHz |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
.5 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
880 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
6 ns |
||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.94 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.55 ns |
|||||||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
368 mA |
8388608 words |
2,4,8 |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
BOTTOM |
S-PBGA-B144 |
1 |
400 MHz |
Not Qualified |
268435456 bit |
2,4,8 |
.45 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1000 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
880 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
1 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.016 Amp |
6 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
920 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
133 MHz |
Not Qualified |
2147483648 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.016 Amp |
5.4 ns |
||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
30 |
240 |
12 mm |
.45 ns |
|||||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
750 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
222 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
.065 Amp |
2,4,8 |
12 mm |
.7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
840 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
1 |
3.6 V |
29.9974 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
6 ns |
|||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
4294967296 bit |
3 V |
AUTO/SELF REFRESH |
5.4 ns |
|||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
615 mA |
4194304 words |
2,4,8 |
YES |
COMMON |
2 |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.4 mm |
450 MHz |
12 mm |
Not Qualified |
134217728 bit |
1.9 V |
AUTO/SELF REFRESH |
e0 |
.066 Amp |
2,4,8 |
12 mm |
.45 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
760 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX64 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
100 MHz |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
7 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.