144 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

KMM466S803BT2-FL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1200 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

29.21 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

M464S1724CT1-L1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

960 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

M464S1654DTS-C1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

760 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

K4D263238G-VC36

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

392 mA

4194304 words

2,4,8

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

BOTTOM

S-PBGA-B144

3

275 MHz

Not Qualified

134217728 bit

260

.015 Amp

2,4,8

.6 ns

KMM464S924T-GH

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

800 mA

8388608 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

R-PDMA-N144

25.4 mm

100 MHz

Not Qualified

536870912 bit

.004 Amp

6 ns

KMM466S803AT-F0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1080 mA

8388608 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

R-PDMA-N144

31.75 mm

100 MHz

Not Qualified

536870912 bit

.016 Amp

7 ns

KMM464S424CT1-FH

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

500 mA

4194304 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

25.4 mm

100 MHz

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

.004 Amp

6 ns

K4D623238B-GC55

Samsung

DDR1 DRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

700 mA

2097152 words

2,4,8,FP

YES

COMMON

2.5

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

2MX32

2M

0 Cel

TIN LEAD

BOTTOM

1

S-PBGA-B144

2.625 V

1.4 mm

182 MHz

12 mm

Not Qualified

67108864 bit

2.375 V

AUTO/SELF REFRESH

e0

.065 Amp

2,4,8

12 mm

.75 ns

M966G0225MP0-C50

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

800 mA

2097152 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX64

2M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

200 MHz

Not Qualified

134217728 bit

3.135 V

AUTO/SELF REFRESH

.008 Amp

4.5 ns

K4D26323QG-VC2A0

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

440 mA

4194304 words

2,4,8

YES

COMMON

1.8

1.8

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B144

3

1.9 V

1.4 mm

350 MHz

12 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.01 Amp

2,4,8

12 mm

.55 ns

M463S0924DT1-C1L

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

760 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,20

DRAMs

.5 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

29.9974 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

M965G5115AP0-C50

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

540 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

200 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.004 Amp

4.5 ns

M965G0115MP0-C70

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

460 mA

1048576 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX64

1M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

143 MHz

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

.004 Amp

5.5 ns

KMM965G511AQN-G8

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

400 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

ZIG-ZAG

1

R-XZMA-N144

3.6 V

125 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.004 Amp

6 ns

K4N26323AE-GC20

Samsung

GDDR2 DRAM

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1400 mA

4194304 words

4

YES

COMMON

2.5

1.8,2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

3-STATE

4MX32

4M

TIN LEAD

BOTTOM

1

S-PBGA-B144

2.6 V

1.4 mm

500 MHz

13 mm

Not Qualified

134217728 bit

2.4 V

AUTO/SELF REFRESH

e0

.11 Amp

13 mm

.35 ns

K4D263238K-FC50

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

344 mA

4194304 words

2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

200 MHz

Not Qualified

134217728 bit

e1

260

.02 Amp

2,4,8

.7 ns

M466S0823DT3-C10

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1000 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

ZIG-ZAG

1

R-XZMA-N144

3.6 V

26.67 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

7 ns

KMM966G511PN-G2

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

512KX64

512K

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

8 ns

M464S6453EN0-C7A

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1000 mA

67108864 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

133 MHz

Not Qualified

4294967296 bit

3 V

AUTO/SELF REFRESH

.032 Amp

5.4 ns

K4D553235F-GC2AT

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

342 mA

8388608 words

2,4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

8MX32

8M

0 Cel

BOTTOM

S-PBGA-B144

1

300 MHz

Not Qualified

268435456 bit

2,4,8

.55 ns

KMM466F213CS1-L5

Samsung

EDO DRAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

880 mA

2097152 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX64

2M

0 Cel

DUAL

R-PDMA-N144

25.4 mm

Not Qualified

134217728 bit

.0016 Amp

50 ns

M464S1724MT1-L1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1600 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

ZIG-ZAG

1

R-XZMA-N144

1

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

M965G5125BP0-C80

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

1024

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

630 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

125 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6.5 ns

M464S1724CT1-C1L

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

960 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

KMM466S204CT-FL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

540 mA

2097152 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX64

2M

0 Cel

DUAL

R-PDMA-N144

100 MHz

Not Qualified

134217728 bit

.008 Amp

6 ns

K4D26323AA-GL500

Samsung

DDR1 DRAM

144

LFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

4MX32

4M

BOTTOM

1

S-PBGA-B144

2.625 V

1.4 mm

12 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

12 mm

.7 ns

M466S0424BT0-L100

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

540 mA

4194304 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

R-PDMA-N144

100 MHz

Not Qualified

268435456 bit

.004 Amp

7 ns

K4C89363AF-GCF5

Samsung

DDR1 DRAM

COMMERCIAL

144

BGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

36

GRID ARRAY

BGA144,12X18,40/32

DRAMs

.8 mm

70 Cel

3-STATE

8MX36

8M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B144

2.625 V

250 MHz

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

.6 ns

KMM466S424CT-F0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

440 mA

4194304 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

25.4 mm

100 MHz

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

.004 Amp

7 ns

KMM466S424CT-F00

Samsung

DRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4194304 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

.8 mm

70 Cel

4MX64

4M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

25.53 mm

3.81 mm

268435456 bit

3 V

AUTO/SELF REFRESH; WD-MAX

67.6 mm

K4D26323RA-GC36

Samsung

DDR1 DRAM

COMMERCIAL

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1000 mA

4194304 words

2,4,8,FP

YES

COMMON

2.8

2.8

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

TIN LEAD

BOTTOM

1

S-PBGA-B144

2.94 V

1.4 mm

275 MHz

12 mm

Not Qualified

134217728 bit

2.66 V

AUTO/SELF REFRESH

e0

.075 Amp

2,4,8

12 mm

.6 ns

K4D263238E-VC22

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1290 mA

4194304 words

2,4,8,FP

YES

COMMON

2.8

2.8

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

BOTTOM

1

S-PBGA-B144

3

2.94 V

1.4 mm

450 MHz

12 mm

Not Qualified

134217728 bit

2.66 V

AUTO/SELF REFRESH

260

.12 Amp

2,4,8

12 mm

.55 ns

K4D553235F-VC25T

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

368 mA

8388608 words

2,4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

8MX32

8M

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1

400 MHz

Not Qualified

268435456 bit

e3

2,4,8

.45 ns

K4D263238E-VC2A

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

935 mA

4194304 words

2,4,8,FP

YES

COMMON

2.5

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

4MX32

4M

0 Cel

BOTTOM

1

S-PBGA-B144

3

2.625 V

1.4 mm

350 MHz

12 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

260

.095 Amp

2,4,8

12 mm

.55 ns

K4C89363AF-GIF5

Samsung

DDR1 DRAM

144

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

2,4

COMMON

1.5/1.8,2.5

36

GRID ARRAY

BGA144,12X18,40/32

DRAMs

.8 mm

3-STATE

8MX36

8M

BOTTOM

R-PBGA-B144

250 MHz

Not Qualified

301989888 bit

2,4

.6 ns

KMM466S424AT-F0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

600 mA

4194304 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX64

4M

0 Cel

DUAL

R-PDMA-N144

100 MHz

Not Qualified

268435456 bit

.008 Amp

7 ns

M464S0924CT2-C75

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

25.4 mm

133 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.004 Amp

5.4 ns

M965G2515BP0-C80

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

1024

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

560 mA

262144 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX64

256K

0 Cel

DUAL

2

R-XDMA-N144

3.6 V

125 MHz

Not Qualified

16777216 bit

3 V

AUTO/SELF REFRESH

.004 Amp

6.5 ns

KMM965G511PN-G0

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

420 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

ZIG-ZAG

1

R-XZMA-N144

3.6 V

100 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.004 Amp

7 ns

K4D263238G-GC2A0

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

65 Cel

4MX32

4M

0 Cel

BOTTOM

1

S-PBGA-B144

2.625 V

1.4 mm

12 mm

Not Qualified

134217728 bit

2.375 V

AUTO/SELF REFRESH

30

240

12 mm

.55 ns

M464S1724DTS-C1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

100 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.016 Amp

6 ns

M464S3254CK1-C1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,20

DRAMs

.5 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

100 MHz

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

.016 Amp

6 ns

KMM466F803BS2-L6

Samsung

EDO DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

880 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

Not Qualified

536870912 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN /SELF REFRESH

.0024 Amp

60 ns

M466S0823CT2-L10

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

880 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

29.21 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

7 ns

K4D55323QF-VC22

Samsung

GDDR1 DRAM

COMMERCIAL

144

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

8388608 words

4

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA144,12X12,32

DRAMs

.8 mm

65 Cel

3-STATE

8MX32

8M

0 Cel

BOTTOM

S-PBGA-B144

3

450 MHz

Not Qualified

268435456 bit

260

.45 ns

KMM466F124AT1-L6

Samsung

EDO DRAM MODULE

COMMERCIAL

144

DIMM

1024

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

600 mA

1048576 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX64

1M

0 Cel

DUAL

R-PDMA-N144

25.4 mm

Not Qualified

67108864 bit

.0008 Amp

60 ns

KMM466S823DT2-G0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1000 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

29.21 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

7 ns

M463S0924DT1-C1H

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

760 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,20

DRAMs

.5 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N144

1

3.6 V

29.9974 mm

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.