78 DRAM 1,870

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4B2G0846E-MCF7T

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

268435456 words

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

R-PBGA-B78

400 MHz

Not Qualified

2147483648 bit

.02 Amp

.4 ns

K4B4G0846A-HYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

195 mA

536870912 words

8

YES

COMMON

1.35

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

800 MHz

10 mm

Not Qualified

4294967296 bit

1.283 V

AUTO/SELF REFRESH

260

.015 Amp

8

12.5 mm

.25 ns

K4B4G0446C-BCH9T

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

1073741824 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

4294967296 bit

.014 Amp

4,8

.255 ns

K4B4G0846C-BCK00

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

200 mA

536870912 words

4,8

YES

COMMON

1.5

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

800 MHz

8.5 mm

Not Qualified

4294967296 bit

1.425 V

AUTO/SELF REFRESH

.014 Amp

4,8

11 mm

.225 ns

K4B4G0846B-HYK00

Samsung

DDR3L DRAM MODULE

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

536870912 words

4,8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

4294967296 bit

.015 Amp

4,8

.225 ns

K4B4G0446B-MCH90

Samsung

DDR3 DRAM

OTHER

78

LFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

300 mA

1073741824 words

YES

COMMON

1.5

1.5

4

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.5 mm

667 MHz

10 mm

Not Qualified

4294967296 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.024 Amp

11.5 mm

.255 ns

K4B8G0446D-MYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2147483648 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

2GX4

2G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

11 mm

K4B2G0846D-HCH90

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

268435456 words

8

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

2147483648 bit

.012 Amp

8

.255 ns

K4B4G0846C-BCMA0

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

4,8

YES

COMMON

1.5

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

933 MHz

8.5 mm

Not Qualified

4294967296 bit

1.425 V

AUTO/SELF REFRESH

4,8

11 mm

.195 ns

K4B2G0446D-HCK00

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

536870912 words

8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.012 Amp

8

.225 ns

K4B4G0446B-HYF8

Samsung

DDR DRAM MODULE

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

1GX4

1G

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

10 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B2G0446D-HYK0T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

536870912 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.225 ns

K4B2G0846F-BYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4A4G085WE-BCRC0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4B1G0846F-HCF80

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

145 mA

134217728 words

8

YES

COMMON

1.5

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX8

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

3

1.575 V

1.2 mm

533 MHz

7.5 mm

Not Qualified

1073741824 bit

1.425 V

RAS ONLY/SELF REFRESH

e1

260

8

11 mm

.3 ns

K4B1G0446F-HYH9T

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

155 mA

268435456 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

1073741824 bit

260

8

.255 ns

K4B1G0846G-BYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B1G0446F-HCK0T

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

175 mA

268435456 words

8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B78

3

800 MHz

Not Qualified

1073741824 bit

260

8

.225 ns

K4B1G0446F-HYK00

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

268435456 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

1073741824 bit

260

8

.225 ns

K4B1G0846F-HYK0T

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

134217728 words

8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

128MX8

128M

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

1073741824 bit

260

8

.225 ns

K4B1G0846G-BCMA

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

134217728 words

4,8

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

128MX8

128M

MATTE TIN

BOTTOM

R-PBGA-B78

1

933 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.195 ns

K4B1G0846F-HYH90

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

134217728 words

8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

128MX8

128M

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

1073741824 bit

260

8

.255 ns

K4A4G045WD-BCPB0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4B1G0446F-HYF80

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

268435456 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B78

533 MHz

Not Qualified

1073741824 bit

260

8

.3 ns

K4A4G085WE-BIPB0

Samsung

DDR4 DRAM

INDUSTRIAL

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

11 mm

K4B1G0446E-HCF70

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

170 mA

268435456 words

4,8

YES

COMMON

1.5

1.5

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

95 Cel

3-STATE

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.575 V

1.2 mm

400 MHz

7.5 mm

Not Qualified

1073741824 bit

1.425 V

AUTO/SELF REFRESH

260

4,8

11 mm

.4 ns

K4B1G0846G-BCK0

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

134217728 words

4,8

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

128MX8

128M

MATTE TIN

BOTTOM

R-PBGA-B78

1

800 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.225 ns

K4A4G085WE-BCTD0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4B1G0446G-BCH9

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

MATTE TIN

BOTTOM

R-PBGA-B78

1

667 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.255 ns

K4B1G0846I-BYMA0

Samsung

DDR3L DRAM

INDUSTRIAL

78

VFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B1G0446G-BCF8

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

MATTE TIN

BOTTOM

R-PBGA-B78

1

533 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.3 ns

K4B1G0446G-BCMAT

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

MATTE TIN

BOTTOM

R-PBGA-B78

1

933 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.195 ns

K4B1G0446E-HCH9

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

225 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

TIN SILVER COPPER

BOTTOM

R-PBGA-B78

3

667 MHz

Not Qualified

1073741824 bit

e1

260

4,8

.125 ns

K4A4G045WD-BCRC0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4B1G0846I-BMMA0

Samsung

DDR3L DRAM

INDUSTRIAL

78

VFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B1G0446F-HYF8T

Samsung

DDR3L DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

268435456 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B78

533 MHz

Not Qualified

1073741824 bit

260

8

.3 ns

K4B1G0446G-BYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4A4G085WF-BCTD

Samsung

DDR4 DRAM

OTHER

78

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

536870912 words

1.2

8

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

4294967296 bit

K4B1G0446G-BCF8T

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

MATTE TIN

BOTTOM

R-PBGA-B78

1

533 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.3 ns

K4B1G0446G-BCMA0

Samsung

DDR3 DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

135 mA

268435456 words

4,8

YES

COMMON

1.5

1.5

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

933 MHz

7.5 mm

Not Qualified

1073741824 bit

1.425 V

AUTO/SELF REFRESH

260

4,8

11 mm

.195 ns

K4B1G0846G-BYF80

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B1G0846I-BCK00

Samsung

DDR3 DRAM

OTHER

78

VFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.5

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1 mm

7.5 mm

1073741824 bit

1.425 V

AUTO/SELF REFRESH

11 mm

K4B1G0846G-BCF8T

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

105 mA

134217728 words

4,8

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

128MX8

128M

MATTE TIN

BOTTOM

R-PBGA-B78

1

533 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.3 ns

K4B1G0446G-BCMA

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

MATTE TIN

BOTTOM

R-PBGA-B78

1

933 MHz

Not Qualified

1073741824 bit

e3

260

4,8

.195 ns

K4A4G085WD-BCRC0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

4294967296 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4B1G0446G-BYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

1073741824 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B1G0446F-HCF8T

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

268435456 words

8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

TIN SILVER COPPER

BOTTOM

R-PBGA-B78

3

533 MHz

Not Qualified

1073741824 bit

e1

260

8

.3 ns

K4B1G0446E-HCF8

Samsung

DDR3 DRAM

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

268435456 words

4,8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

3-STATE

256MX4

256M

TIN SILVER COPPER

BOTTOM

R-PBGA-B78

3

533 MHz

Not Qualified

1073741824 bit

e1

260

4,8

.15 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.