FBGA DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4X56163PE-LGC2

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

80 mA

16777216 words

2,4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

100 MHz

Not Qualified

268435456 bit

e0

.0003 Amp

2,4,8

2 ns

K4S563233F-FG1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

268435456 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4S641633H-BG1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

7 ns

K4M641633K-BN75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B54

3

133 MHz

Not Qualified

67108864 bit

e1

260

.0005 Amp

1,2,4,8

5.4 ns

K4M28163PH-RF90T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

85 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

134217728 bit

.00001 Amp

1,2,4,8

7 ns

K4M51323LC-DF7L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

K4S56163LF-ZC75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

16777216 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

5.4 ns

K4J55323QG-BC20

Samsung

GDDR3 DRAM

OTHER

136

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

830 mA

8388608 words

4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA136,12X17,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX32

8M

0 Cel

BOTTOM

R-PBGA-B136

500 MHz

Not Qualified

268435456 bit

.07 Amp

4,8

.35 ns

K4S643233H-HE1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

2097152 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

7 ns

K4B4G0446B-HCK0T

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

1073741824 words

8

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

4294967296 bit

.015 Amp

8

.225 ns

K4B2G0846D-HYK0T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

268435456 words

8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.225 ns

K4M563233E-EN80

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

320 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

125 MHz

Not Qualified

268435456 bit

.0012 Amp

1,2,4,8

6 ns

K4T51083QC-ZLF7

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

-5 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

400 MHz

Not Qualified

536870912 bit

e3

4,8

.4 ns

K4S56163LF-ZG75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

16777216 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

5.4 ns

K4N51163QZ-HC20T

Samsung

GDDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B84

500 MHz

Not Qualified

536870912 bit

.01 Amp

4,8

.35 ns

K4S513233F-EC75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

16777216 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

K4T51043QC-ZLE7

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

400 MHz

Not Qualified

536870912 bit

e3

.008 Amp

4,8

.4 ns

K4T2G044QA-HCD5T

Samsung

CACHE DRAM MODULE

OTHER

68

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

290 mA

536870912 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA68,9X19,32

DRAMs

.8 mm

95 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B68

3

267 MHz

Not Qualified

2147483648 bit

260

.015 Amp

4,8

.5 ns

K4S511533F-PC75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

33554432 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

K4S51163LF-PF1L

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

240 mA

33554432 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

7 ns

K4M56163PE-RG90

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

80 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

268435456 bit

e0

.0003 Amp

1,2,4,8

7 ns

K4M64163PK-RE90

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

50 mA

4194304 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

67108864 bit

.0003 Amp

1,2,4,8

7 ns

K4M28163PF-BG1L

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

85 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX16

8M

-25 Cel

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

134217728 bit

.0003 Amp

1,2,4,8

7 ns

K4M51323LE-EF1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

3

105 MHz

Not Qualified

536870912 bit

260

.0015 Amp

1,2,4,8

7 ns

K4T51163QE-ZPE6

Samsung

CACHE DRAM MODULE

INDUSTRIAL

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

240 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B84

1

333 MHz

Not Qualified

536870912 bit

e3

.008 Amp

4,8

.45 ns

K4T51163QB-GCD5

Samsung

DDR2 DRAM

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

3-STATE

32MX16

32M

TIN LEAD

BOTTOM

R-PBGA-B84

267 MHz

Not Qualified

536870912 bit

e0

.008 Amp

4,8

.5 ns

K4B4G1646B-HIH90

Samsung

DDR3 DRAM

INDUSTRIAL

96

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

192 mA

268435456 words

8

COMMON

1.5

1.5

16

GRID ARRAY, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX16

256M

-40 Cel

BOTTOM

R-PBGA-B96

667 MHz

Not Qualified

4294967296 bit

.015 Amp

8

.255 ns

K4B4G0446B-MCH9

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

1073741824 words

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B78

1

667 MHz

Not Qualified

4294967296 bit

e3

.024 Amp

K4S561633F-ZC75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

185 mA

16777216 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

5.4 ns

K4S51323PF-MF90

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

536870912 bit

e0

.0006 Amp

1,2,4,8

7 ns

K4B4G0446B-MCF8T

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

250 mA

1073741824 words

COMMON

1.5

1.5

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B78

1

533 MHz

Not Qualified

4294967296 bit

e3

.024 Amp

K4V1G323PC-XGC30

Samsung

DDR1 DRAM

OTHER

152

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

33554432 words

2,4,8,16

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA152,21X21,25

DRAMs

.635 mm

85 Cel

3-STATE

32MX32

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B152

3

133 MHz

Not Qualified

1073741824 bit

e1

260

.0006 Amp

2,4,8,16

6 ns

K4M56323LG-HN7L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

268435456 bit

e3

.001 Amp

1,2,4,8

5.4 ns

K4M281633H-BG1LT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

60 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

134217728 bit

e3

.0005 Amp

1,2,4,8

7 ns

K4T51083QQ-BCE6T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

80 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

333 MHz

Not Qualified

536870912 bit

.008 Amp

4,8

.45 ns

K4M511533E-YL75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

190 mA

33554432 words

1,2,4,8,FP

COMMON

3

3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

536870912 bit

e0

.0015 Amp

1,2,4,8

5.4 ns

K4M28163PH-RG75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

90 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX16

8M

-25 Cel

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

134217728 bit

.00001 Amp

1,2,4,8

6 ns

K4T1G084QC-ZLCC0

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

134217728 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

128MX8

128M

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

200 MHz

Not Qualified

1073741824 bit

e1

4,8

.6 ns

K4M281633H-BL75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

70 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

134217728 bit

e3

.0005 Amp

1,2,4,8

5.4 ns

K4X1G163PC-FGC6T

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

67108864 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

64MX16

64M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

166 MHz

Not Qualified

1073741824 bit

e1

260

.000025 Amp

2,4,8,16

5.5 ns

K4M51323LC-DG7L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

5.4 ns

K4M563233E-EC1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

290 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

268435456 bit

.0012 Amp

1,2,4,8

7 ns

K4M56163PG-RC90

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

65 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

268435456 bit

.00001 Amp

1,2,4,8

7 ns

K4S643233H-FF1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

2097152 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX32

2M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

67108864 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4T1G164QQ-HCE7

Samsung

DDR2 DRAM

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

265 mA

67108864 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

3-STATE

64MX16

64M

BOTTOM

R-PBGA-B84

3

400 MHz

Not Qualified

1073741824 bit

260

.015 Amp

4,8

.4 ns

K4B8G1646Q-MIK0T

Samsung

DDR3 DRAM

INDUSTRIAL

96

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

251 mA

8

COMMON

1.5

1.5

GRID ARRAY, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

-40 Cel

BOTTOM

R-PBGA-B96

800 MHz

Not Qualified

8589934592 bit

.03 Amp

8

.225 ns

K4M51323LE-EL1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

3

105 MHz

Not Qualified

536870912 bit

260

.0015 Amp

1,2,4,8

7 ns

K4T51083QC-ZCE6T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

220 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

333 MHz

Not Qualified

536870912 bit

e1

260

.008 Amp

4,8

.45 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.