Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
135 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.4 mm |
133 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
13 mm |
5.4 ns |
|||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.7 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
6 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
290 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.45 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
1.9 V |
AUTO/SELF REFRESH |
12 mm |
.55 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
135 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
133 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
13 mm |
5.4 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.55 ns |
|||||||||||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
402 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.625 V |
1.4 mm |
250 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e1 |
260 |
.02 Amp |
2,4,8 |
12 mm |
.6 ns |
|||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
1.95 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
13 mm |
7 ns |
|||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
6 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
LFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
280 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B54 |
2.7 V |
1.3 mm |
100 MHz |
9.5 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0015 Amp |
1,2,4,8 |
15.5 mm |
7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
100 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
580 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
166 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
.065 Amp |
2,4,8 |
12 mm |
.75 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
7 ns |
|||||||||||||||||||||||
Samsung |
GDDR3 DRAM |
OTHER |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
1060 mA |
8388608 words |
4 |
YES |
COMMON |
2 |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.4 mm |
700 MHz |
12 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
e0 |
.14 Amp |
4 |
12 mm |
.26 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
6 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
290 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.45 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
12 mm |
.7 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
100 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
100 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
2.375 V |
AUTO/SELF REFRESH |
30 |
240 |
12 mm |
.7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
320 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
3.6 V |
1.45 mm |
125 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
6 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
115 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
133 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
13 mm |
5.4 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
270 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.45 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
260 |
13 mm |
6 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
INDUSTRIAL |
54 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.3 mm |
9.5 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
15.5 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
1.9 V |
AUTO/SELF REFRESH |
12 mm |
.45 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
7 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
GDDR3 DRAM |
OTHER |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
2 |
2.1 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
||||||||||||||||||||||
Samsung |
GDDR3 DRAM |
OTHER |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
1.9 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B144 |
2 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
1.8 V |
AUTO/SELF REFRESH |
e0 |
12 mm |
||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
13 mm |
6 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
125 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.45 mm |
100 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0012 Amp |
1,2,4,8 |
13 mm |
6 ns |
||||||||||||
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
314 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
1.9 V |
1.4 mm |
300 MHz |
12 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
2,4,8 |
12 mm |
.55 ns |
|||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
260 |
13 mm |
6 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
LFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
250 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B54 |
2.7 V |
1.3 mm |
66 MHz |
9.5 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0015 Amp |
1,2,4,8 |
15.5 mm |
9 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
290 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
|||||||||||||
|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
655 mA |
4194304 words |
2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.625 V |
1.4 mm |
222 MHz |
12 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
260 |
.07 Amp |
2,4,8 |
12 mm |
.7 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2MX32 |
2M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
2.7 V |
1.4 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
13 mm |
5.4 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.8 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
4MX32 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
S-PBGA-B144 |
3 |
2.94 V |
1.4 mm |
12 mm |
Not Qualified |
134217728 bit |
2.66 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
.55 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.