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Manufacturer | Samsung |
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Manufacturer's Part Number | K4D553235F-GC330 |
Description | GDDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: LFBGA; Refresh Cycles: 4096; Package Shape: SQUARE; |
Datasheet | K4D553235F-GC330 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 8MX32 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.4 mm |
Access Mode: | FOUR BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | DRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 314 mA |
No. of Terminals: | 144 |
Maximum Clock Frequency (fCLK): | 300 MHz |
No. of Words: | 8388608 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B144 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 65 Cel |
Package Code: | LFBGA |
Width: | 12 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 268435456 bit |
Self Refresh: | YES |
Sequential Burst Length: | 2,4,8 |
Memory IC Type: | GDDR1 DRAM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 32 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA144,12X12,32 |
Refresh Cycles: | 4096 |
Interleaved Burst Length: | 2,4,8 |
Length: | 12 mm |
Maximum Access Time: | .55 ns |
No. of Words Code: | 8M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 1.9 V |
Power Supplies (V): | 1.8 |