Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
85 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20/26,.36 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
4194304 bit |
.001 Amp |
80 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20/26,.36 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
4194304 bit |
.0002 Amp |
70 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
85 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20/26,.36 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
4194304 bit |
.001 Amp |
80 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0045 Amp |
2,4,8 |
22.22 mm |
.8 ns |
||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.75 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0045 Amp |
2,4,8 |
22.22 mm |
.8 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
350 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0055 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.8 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.75 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.6 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e3 |
22.22 mm |
.7 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.6 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.8 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
YES |
2.6 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
128MX4 |
128M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
128MX4 |
128M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.6 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0045 Amp |
2,4,8 |
22.22 mm |
.8 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.6 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.7 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.6 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
350 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0055 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
350 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0055 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
350 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0055 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
250 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.6 |
2.6 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
200 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
.005 Amp |
2,4,8 |
22.22 mm |
.65 ns |
|||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0045 Amp |
2,4,8 |
22.22 mm |
.8 ns |
||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
315 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.6 |
2.6 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
250 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
.006 Amp |
2,4,8 |
22.22 mm |
.6 ns |
|||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.7 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
YES |
2.6 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
128MX4 |
128M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
22.22 mm |
.5 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
280 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.75 ns |
||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.6 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
22.22 mm |
.5 ns |
||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
.8 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0045 Amp |
2,4,8 |
22.22 mm |
.8 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
350 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.0055 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
280 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
280 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
2.6 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
22.22 mm |
.5 ns |
||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
32MX16 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
280 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.