512 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

KM416V256BLT-7

Samsung

FAST PAGE DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

80 mA

262144 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

3.6 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0001 Amp

18.41 mm

70 ns

MT42C4256Z-8

Micron Technology

VIDEO DRAM

COMMERCIAL

28

ZIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

130 mA

262144 words

5

5

4

IN-LINE

ZIP28,.1

Other Memory ICs

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

ZIG-ZAG

2

R-PZIP-T28

5.5 V

10.16 mm

2.8 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.008 Amp

36 mm

80 ns

LH64256BK-70

Sharp Corporation

FAST PAGE DRAM

COMMERCIAL

26

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

1

R-PDSO-J26

5.5 V

3.7 mm

7.7 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

17.2 mm

70 ns

MT42C8128DJ-7

Micron Technology

VIDEO DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

160 mA

131072 words

5

5

8

SMALL OUTLINE

SOJ40,.44

Other Memory ICs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J40

5.5 V

3.81 mm

10.21 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.008 Amp

26.06 mm

70 ns

KM416C256BJ-6

Samsung

FAST PAGE DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J40

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.04 mm

60 ns

KM416C256BJ-7

Samsung

FAST PAGE DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

80 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J40

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.04 mm

70 ns

KM416V256ALT-7

Samsung

FAST PAGE DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

262144 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

3.6 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

3 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.0001 Amp

18.41 mm

70 ns

MT42C8256DJ-8

Micron Technology

VIDEO DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

195 mA

262144 words

5

5

8

SMALL OUTLINE

SOJ40,.44

Other Memory ICs

1.27 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

TIN LEAD

DUAL

2

R-PDSO-J40

5.5 V

3.81 mm

10.21 mm

Not Qualified

2097152 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.01 Amp

26.06 mm

80 ns

KM416C254BLT-6

Samsung

EDO DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

18.41 mm

60 ns

KM416C256AJ-7

Samsung

FAST PAGE DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

110 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J40

5.5 V

3.56 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.001 Amp

26.04 mm

70 ns

KM44C256AP-8

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

75 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T20

3

5.5 V

4.19 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

80 ns

KM44C256BP-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T20

5.5 V

4.65 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

70 ns

KM44C256BZ-8

Samsung

FAST PAGE DRAM

COMMERCIAL

19

ZIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

70 mA

262144 words

COMMON

5

5

4

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

ZIG-ZAG

1

R-PZIP-T19

5.5 V

10.16 mm

2.96 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.165 mm

80 ns

KM44C256CP-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

65 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T20

5.5 V

4.65 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

24.56 mm

70 ns

KMM591000B-8

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

30

SIMM

512

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

630 mA

1048576 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

1MX9

1M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

20.447 mm

Not Qualified

9437184 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.009 Amp

80 ns

MB81C4256A-70P

Fujitsu

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

68 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

1048576 bit

e0

.001 Amp

70 ns

MCM511000AJ80

Motorola

FAST PAGE DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

70 mA

1048576 words

SEPARATE

5

5

1

SMALL OUTLINE

SOJ20/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J20

5.5 V

3.75 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE

e0

.001 Amp

17.145 mm

80 ns

MCM514256AJ10

Motorola

FAST PAGE DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

60 mA

262144 words

COMMON

5

5

4

SMALL OUTLINE

SOJ20/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J20

5.5 V

3.75 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.145 mm

100 ns

MCM514256AP70

Motorola

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

80 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDIP-T20

5.5 V

4.44 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.001 Amp

24.64 mm

70 ns

MT43C8128AEJ-7

Micron Technology

VIDEO DRAM

COMMERCIAL

52

QCCJ

512

SQUARE

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

200 mA

131072 words

5

5

8

CHIP CARRIER

LDCC52,.8SQ

Other Memory ICs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

TIN LEAD

QUAD

3

S-PQCC-J52

5.25 V

4.57 mm

19.1262 mm

Not Qualified

1048576 bit

4.75 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 2 X 256 X 8 SAM

e0

.002 Amp

19.1262 mm

70 ns

TC511000AZ-70

Toshiba

FAST PAGE DRAM

COMMERCIAL

19

ZIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

1

IN-LINE

1.27 mm

70 Cel

1MX1

1M

0 Cel

TIN LEAD

ZIG-ZAG

1

R-PZIP-T19

5.5 V

10.16 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

25.8 mm

70 ns

SMJ4C1024-12HLM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

SON

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

YES

1

CMOS

38535Q/M;38534H;883B

NO LEAD

SYNCHRONOUS

60 mA

1048576 words

SEPARATE

5

5

1

SMALL OUTLINE

SOLCC20/26,.35

DRAMs

1.27 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDSO-N20

5.5 V

2.03 mm

8.89 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

17.145 mm

120 ns

TM024GAD8-10L

Texas Instruments

FAST PAGE DRAM MODULE

COMMERCIAL

30

SIMM

512

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

520 mA

1048576 words

COMMON

5

5

8

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

1MX8

1M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

20.4978 mm

Not Qualified

8388608 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.016 Amp

100 ns

TMS45160-80DGE

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

140 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

1

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.001 Amp

18.41 mm

80 ns

SMJ44C256-12HMM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

SON

512

RECTANGULAR

CERAMIC

YES

CMOS

38535Q/M;38534H;883B

NO LEAD

55 mA

262144 words

COMMON

5

5

4

SMALL OUTLINE

SOLCC20/26,.35

DRAMs

1.27 mm

125 Cel

3-STATE

256KX4

256K

-55 Cel

DUAL

R-XDSO-N20

Not Qualified

1048576 bit

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

120 ns

TMX4C1024-15N

Texas Instruments

FAST PAGE DRAM

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

1

IN-LINE

2.54 mm

3-STATE

1MX1

1M

DUAL

1

R-PDIP-T18

5.5 V

5.08 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

22.48 mm

150 ns

TM024GAD8-80

Texas Instruments

FAST PAGE DRAM MODULE

COMMERCIAL

30

512

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1048576 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

1MX8

1M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

Not Qualified

8388608 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

80 ns

SMJ4C1024-15SVM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

38535Q/M;38534H;883B

THROUGH-HOLE

SYNCHRONOUS

55 mA

1048576 words

SEPARATE

5

5

1

IN-LINE

ZIP20,.1

DRAMs

1.27 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDIP-T20

5.5 V

10.92 mm

2.92 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

26.67 mm

150 ns

TMS48C138-10DJ

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

24

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

70 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE

SOJ24/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

DUAL

1

R-PDSO-J24

5.5 V

3.76 mm

7.57 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

17.145 mm

100 ns

TMS55165-60DGE

Texas Instruments

VIDEO DRAM

COMMERCIAL

64

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

262144 words

5

16

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

2

R-PDSO-G64

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT

23.495 mm

60 ns

TMX44C259-12DJ

Texas Instruments

NIBBLE MODE DRAM

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

NIBBLE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

3-STATE

256KX4

256K

DUAL

1

R-PDSO-J20

5.5 V

3.76 mm

7.57 mm

Not Qualified

1048576 bit

4.5 V

17.145 mm

120 ns

TMS45169P-60DZ

Texas Instruments

EDO DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

180 mA

262144 words

YES

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

R-PDSO-J40

Not Qualified

4194304 bit

NOT SPECIFIED

NOT SPECIFIED

.00035 Amp

60 ns

TMS44C256-12DJL

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

1

R-PDSO-J20

5.5 V

3.76 mm

7.57 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

17.145 mm

120 ns

SMJ44C251B-10SVL

Texas Instruments

VIDEO DRAM

COMMERCIAL

28

ZIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE WITH EDO

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

ZIG-ZAG

2

R-CZIP-T28

5.5 V

13.08 mm

2.92 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT

36.83 mm

100 ns

SMJ44C251B-12HMM

Texas Instruments

VIDEO DRAM

MILITARY

28

SON

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

YES

1

CMOS

38535Q/M;38534H;883B

NO LEAD

ASYNCHRONOUS

100 mA

262144 words

5

5

4

SMALL OUTLINE

SOLCC28,.4

Other Memory ICs

1.27 mm

125 Cel

3-STATE

256KX4

256K

-55 Cel

DUAL

2

R-CDSO-N28

5.5 V

2.54 mm

10.16 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.015 Amp

18.288 mm

120 ns

TMX4C1029-10DJ

Texas Instruments

NIBBLE MODE DRAM

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

NIBBLE

YES

1

CMOS

J BEND

ASYNCHRONOUS

1048576 words

5

1

SMALL OUTLINE

1.27 mm

3-STATE

1MX1

1M

DUAL

1

R-PDSO-J20

5.5 V

3.76 mm

7.57 mm

Not Qualified

1048576 bit

4.5 V

17.145 mm

100 ns

TMS4C1024-10DN

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

65 mA

1048576 words

SEPARATE

5

5

1

SMALL OUTLINE

SOJ20/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

DUAL

1

R-PDSO-J20

5.5 V

1.83 mm

7.47 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

16.51 mm

100 ns

SMJ44C256-15HLM

Texas Instruments

FAST PAGE DRAM

MILITARY

20

SON

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

YES

1

CMOS

MIL-PRF-38535

NO LEAD

SYNCHRONOUS

55 mA

262144 words

COMMON

5

5

4

SMALL OUTLINE

SOLCC20/26,.35

DRAMs

1.27 mm

125 Cel

3-STATE

256KX4

256K

-55 Cel

DUAL

1

R-CDSO-N20

5.5 V

2.03 mm

8.89 mm

Not Qualified

1048576 bit

4.5 V

CAS BEFORE RAS REFRESH

NOT SPECIFIED

NOT SPECIFIED

.003 Amp

17.145 mm

150 ns

TMS44C257-10DJL

Texas Instruments

STATIC COLUMN DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

1

R-PDSO-J20

5.5 V

3.76 mm

7.57 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

17.145 mm

100 ns

SMJ4C1024-10JD

Texas Instruments

FAST PAGE DRAM

MILITARY

18

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

1048576 words

5

1

IN-LINE

2.54 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDIP-T18

5.5 V

4.45 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

22.606 mm

100 ns

SMJ44C251-10HJM

Texas Instruments

VIDEO DRAM

MILITARY

28

SOJ

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

YES

1

CMOS

38535Q/M;38534H;883B

J BEND

ASYNCHRONOUS

110 mA

262144 words

5

5

4

SMALL OUTLINE

SOJ28,.4

Other Memory ICs

1.27 mm

125 Cel

3-STATE

256KX4

256K

-55 Cel

DUAL

2

R-CDSO-J28

5.5 V

4.521 mm

10.541 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.015 Amp

18.542 mm

100 ns

SMJ55166-80GB

Texas Instruments

VIDEO DRAM

MILITARY

68

PGA

512

SQUARE

CERAMIC, METAL-SEALED COFIRED

FAST PAGE WITH EDO

NO

1

CMOS

PIN/PEG

ASYNCHRONOUS

262144 words

5

16

GRID ARRAY

2.54 mm

125 Cel

3-STATE

256KX16

256K

-55 Cel

PERPENDICULAR

2

S-CPGA-P68

5.5 V

3.62 mm

24.38 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT

24.38 mm

80 ns

SMJ44C251B-12JDL

Texas Instruments

VIDEO DRAM

COMMERCIAL

28

DIP

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE WITH EDO

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

262144 words

5

4

IN-LINE

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

2

R-CDIP-T28

5.5 V

3.56 mm

10.16 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT

120 ns

SMJ4C1024-15FQ

Texas Instruments

FAST PAGE DRAM

MILITARY

20

SON

512

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

FAST PAGE

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1048576 words

5

1

SMALL OUTLINE

1.27 mm

125 Cel

3-STATE

1MX1

1M

-55 Cel

DUAL

1

R-CDSO-N20

5.5 V

2.34 mm

8.89 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

17.145 mm

150 ns

TMS44C256-80N

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

20

DIP

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

75 mA

262144 words

COMMON

5

5

4

IN-LINE

DIP20,.3

DRAMs

2.54 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

1

R-PDIP-T20

5.5 V

5.08 mm

7.62 mm

Not Qualified

1048576 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

NOT SPECIFIED

NOT SPECIFIED

.002 Amp

24.325 mm

80 ns

TMS44C250-1DZL

Texas Instruments

VIDEO DRAM

COMMERCIAL

28

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

262144 words

5

4

SMALL OUTLINE

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

DUAL

2

R-PDSO-J28

5.25 V

3.76 mm

10.16 mm

Not Qualified

1048576 bit

4.75 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT

18.415 mm

100 ns

TMS45165S-10DGE

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

120 mA

262144 words

YES

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

1

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH; BYTE WRITE

NOT SPECIFIED

NOT SPECIFIED

.0002 Amp

18.41 mm

100 ns

TMS45165P-10DZ

Texas Instruments

FAST PAGE DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

120 mA

262144 words

YES

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

DUAL

1

R-PDSO-J40

5.5 V

3.76 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.0002 Amp

26.035 mm

100 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.