8192 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

HYB25D256800T-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

180 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.015 Amp

2,4,8

22.22 mm

.8 ns

HYB25L512160AC-7.5

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

LFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

175 mA

33554432 words

1,2,4,8,FP

YES

COMMON

1.8,2.5/3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B54

3.6 V

1.4 mm

133 MHz

8 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.00001 Amp

1,2,4,8

12 mm

8 ns

HYB25D256800BTL-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

210 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.007 Amp

2,4,8

22.22 mm

.8 ns

HYB25D512160ATL-7

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.014 Amp

2,4,8

22.22 mm

.75 ns

HYB25D256160BCL-7

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

235 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

143 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.008 Amp

2,4,8

12 mm

.75 ns

HYB25D256160BC-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

285 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.009 Amp

2,4,8

12 mm

.7 ns

HYB25D256400BCL-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

210 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

100 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.007 Amp

2,4,8

12 mm

.8 ns

HYB25D256800CT-5

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

22.22 mm

.5 ns

HYB25D512160BF-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2,5

16

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

.004 Amp

2,4,8

12 mm

.7 ns

HYB25D512160BE-5

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.6

2,5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

e3

.004 Amp

2,4,8

22.22 mm

.5 ns

HYB25D512160AT-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.012 Amp

2,4,8

22.22 mm

.8 ns

HYB25D256160BT-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

285 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.009 Amp

2,4,8

22.22 mm

.7 ns

HYB25L256160AF-7.5

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

155 mA

16777216 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/3.3,2.5/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e1

.0006 Amp

1,2,4,8

12 mm

7.5 ns

HYB25D256800BT-7

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

225 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.008 Amp

2,4,8

22.22 mm

.75 ns

HYB25D512400ATL-7

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.014 Amp

2,4,8

22.22 mm

.75 ns

HYB25D512800BF-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

.004 Amp

2,4,8

12 mm

.7 ns

HYB25D512400BF-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

.004 Amp

2,4,8

12 mm

.7 ns

HYB25D256800CE-5A

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

2,4,8

22.22 mm

.5 ns

HYB25D256400BCL-5

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

250 mA

67108864 words

2,4,8

YES

COMMON

2.6

2.6

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

200 MHz

8 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

e0

.005 Amp

2,4,8

12 mm

.5 ns

HYB25D512160ATL-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.018 Amp

2,4,8

22.22 mm

.7 ns

HYB25D512400AT-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.012 Amp

2,4,8

22.22 mm

.8 ns

HYB25D512160AT-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.018 Amp

2,4,8

22.22 mm

.7 ns

HYB25D256800AT-7.5

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

190 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.02 Amp

2,4,8

22.22 mm

.75 ns

HYB25D256800BTL-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

270 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.009 Amp

2,4,8

22.22 mm

.7 ns

HYB25D512800AT-7F

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

67108864 words

2,4,8

YES

COMMON

2.5

2.5

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.014 Amp

2,4,8

22.22 mm

.75 ns

HYB25D512400BE-5

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.6

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

e3

.004 Amp

2,4,8

22.22 mm

.5 ns

HYB25D256160BT-5A

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

310 mA

16777216 words

2,4,8

YES

COMMON

2.6

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

e0

.009 Amp

2,4,8

22.22 mm

.5 ns

HYB25D512400BC-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,6X15,32

DRAMs

1 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e0

.004 Amp

2,4,8

12 mm

.7 ns

HYB25D256400BCL-7F

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

225 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.008 Amp

2,4,8

12 mm

.75 ns

HYB25D256160BC-8

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

220 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

125 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.007 Amp

2,4,8

12 mm

.8 ns

HYB25D256400AT-7

Infineon Technologies

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

190 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.02 Amp

2,4,8

22.22 mm

.75 ns

HYB25D256400BCL-6

Infineon Technologies

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

270 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.009 Amp

2,4,8

12 mm

.7 ns

TC59SM804BFT-80

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

150 mA

67108864 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

.001 Amp

1,2,4,8

22.22 mm

6 ns

TC5164405BJS-40

Toshiba

EDO DRAM

COMMERCIAL

32

SOJ

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

120 mA

16777216 words

YES

COMMON

3.3

3.3

4

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J32

3.6 V

3.7 mm

10.16 mm

Not Qualified

67108864 bit

3 V

e0

.0002 Amp

20.96 mm

40 ns

THMD1GE2SB75

Toshiba

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

133 MHz

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

THMY25N11B80

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1200 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

34.85 mm

125 MHz

2.8 mm

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

.008 Amp

133.35 mm

6 ns

TC59SM916AFT-70

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

e0

.001 Amp

1,2,4,8

22.22 mm

5.4 ns

THLY12N11C80L

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

600 mA

16777216 words

YES

COMMON

3.3

3.3

16

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

25.4 mm

125 MHz

3.8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

.004 Amp

67.6 mm

6 ns

THLY12N11B70L

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

680 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

143 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.004 Amp

5.4 ns

THMY25N11C70

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1360 mA

33554432 words

YES

COMMON

3.3

3.3

8

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

34.98 mm

142 MHz

2.8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH; WD-MAX

.008 Amp

133.35 mm

5.4 ns

THMY25E11B70

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1530 mA

33554432 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

143 MHz

Not Qualified

2415919104 bit

3 V

AUTO/SELF REFRESH

.009 Amp

5.4 ns

THLY12N11B80

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

600 mA

16777216 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

125 MHz

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

.004 Amp

6 ns

THLY25N01B75

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1280 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

133 MHz

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

.008 Amp

5.4 ns

TC5164405BFT-40

Toshiba

EDO DRAM

COMMERCIAL

32

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

120 mA

16777216 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

1.27 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

e0

.0005 Amp

20.95 mm

40 ns

THMY25N11B75

Toshiba

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1280 mA

33554432 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

34.85 mm

133 MHz

2.8 mm

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

.008 Amp

133.35 mm

5.4 ns

TC5164805BJS-50

Toshiba

EDO DRAM

COMMERCIAL

32

SOJ

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

100 mA

8388608 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J32

3.6 V

3.7 mm

10.16 mm

Not Qualified

67108864 bit

3 V

e0

.0002 Amp

20.96 mm

50 ns

THMD1GE2SB80

Toshiba

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

125 MHz

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

.8 ns

THMD1GE0SB70

Toshiba

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

143 MHz

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.