OTHER DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4S56323LF-FN75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

268435456 bit

e0

.0005 Amp

1,2,4,8

6 ns

M393B4G70AM0-YF8

Samsung

OTHER

240

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

5166 mA

4294967296 words

COMMON

1.35

1.35

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

4GX72

4G

0 Cel

DUAL

R-PDMA-N240

533 MHz

Not Qualified

309237645312 bit

260

.3 ns

M470T3354CZ0-LF7

Samsung

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

95 Cel

3-STATE

32MX64

32M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1.9 V

400 MHz

Not Qualified

2147483648 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.4 ns

K4S64163LF-AG75

Samsung

SYNCHRONOUS DRAM

OTHER

52

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

115 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA52,6X13,30

DRAMs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

1

R-PBGA-B52

3

2.7 V

1 mm

133 MHz

6.6 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

260

.0005 Amp

1,2,4,8

11 mm

5.4 ns

K4S641633D-GE1L

Samsung

SYNCHRONOUS DRAM

OTHER

52

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

125 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA52,6X13,30

DRAMs

.75 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B52

3.3 V

1.1 mm

100 MHz

6.6 mm

Not Qualified

67108864 bit

2.7 V

AUTO/SELF REFRESH

e0

.001 Amp

1,2,4,8

11 mm

6 ns

M392B5270DH0-YF8

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2310 mA

536870912 words

YES

COMMON

1.35

1.35

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

1.45 V

18.9 mm

533 MHz

4 mm

Not Qualified

38654705664 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX

.69 Amp

133.35 mm

.3 ns

K4T56083QG-ZCD5T

Samsung

CACHE DRAM MODULE

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

250 mA

33554432 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX8

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

267 MHz

Not Qualified

268435456 bit

e3

.008 Amp

4,8

.5 ns

K4N56163QF-ZC36

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

350 mA

16777216 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

2

1.9 V

1.2 mm

275 MHz

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

4,8

13 mm

.5 ns

K4M64163LK-RG750

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

115 mA

4194304 words

1,2,4,8,FP

YES

COMMON

2.5

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN LEAD

BOTTOM

1

S-PBGA-B54

3

2.7 V

1 mm

133 MHz

8 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

e0

240

.0005 Amp

1,2,4,8

8 mm

5.4 ns

K4S643233F-SE1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

2097152 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

3.6 V

1.4 mm

105 MHz

11 mm

Not Qualified

67108864 bit

2.7 V

AUTO/SELF REFRESH

e0

.0005 Amp

1,2,4,8

13 mm

7 ns

K4T51083QC-ZCF7T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

245 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

3

400 MHz

Not Qualified

536870912 bit

260

.008 Amp

4,8

.4 ns

M391T6553GZ3-CE6

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1575 mA

67108864 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

333 MHz

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

260

.072 Amp

.45 ns

K4M563233E-ME1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

268435456 bit

e0

.0012 Amp

1,2,4,8

7 ns

K4S64163LH-BC1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

-25 Cel

BOTTOM

1

S-PBGA-B54

3

2.7 V

1 mm

8 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

8 mm

7 ns

M378T3253FG0-CD5

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2040 mA

33554432 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

266 MHz

Not Qualified

2147483648 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

230

.064 Amp

.5 ns

K4T1G084QE-HLF7

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

170 mA

134217728 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX8

128M

0 Cel

MATTE TIN

BOTTOM

1

R-PBGA-B60

1

1.9 V

1.2 mm

400 MHz

7.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

e3

4,8

9.5 mm

.4 ns

K4M56163DG-BL1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

8MX16

8M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

2.7 V

1 mm

8 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

11 mm

7 ns

M470T6464QH3-LE7

Samsung

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1060 mA

67108864 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N200

3

1.9 V

3.8 mm

400 MHz

30 mm

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

260

.032 Amp

67.6 mm

.4 ns

K4S51323LF-EF1L0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3

2.7 V

1.4 mm

11 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

e1

13 mm

7 ns

K4T51043QJ-BCE7T

Samsung

CACHE DRAM MODULE

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

400 MHz

Not Qualified

536870912 bit

e3

260

.008 Amp

4,8

.4 ns

M393T2950CZA-CCC

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4510 mA

134217728 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

95 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

200 MHz

Not Qualified

9663676416 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.604 Amp

.6 ns

K4N51163QE-ZC25T

Samsung

CACHE DRAM MODULE

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B84

1

400 MHz

Not Qualified

536870912 bit

e3

.008 Amp

4,8

.4 ns

K4A8G045WC-BCRC0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2147483648 words

YES

1.2

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

2GX4

2G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

11 mm

M395T1G60QJ4-CD58

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4940 mA

1073741824 words

YES

COMMON

1.5

1.5,1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N240

3

1.575 V

266 MHz

Not Qualified

77309411328 bit

1.455 V

AUTO/SELF REFRESH

260

2.2 Amp

K4M563233E-MG1H0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

13 mm

7 ns

K4S56323LF-FL75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

268435456 bit

e0

.0005 Amp

1,2,4,8

6 ns

K4M511633E-YL750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

11.5 mm

5.4 ns

M471B5173CB0-YK0

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1080 mA

536870912 words

COMMON

1.35

1.35

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

85 Cel

3-STATE

512MX64

512M

0 Cel

DUAL

R-PDMA-N204

800 MHz

Not Qualified

34359738368 bit

.088 Amp

.225 ns

M391B6573EZ0-CG8

Samsung

SYNCHRONOUS DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

COMMON

1.5

1.5

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

Not Qualified

4831838208 bit

1.425 V

AUTO/SELF REFRESH

K4M563233G-HN7L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

268435456 bit

e3

.001 Amp

1,2,4,8

5.4 ns

M391T5263AZ3-CD5

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3060 mA

536870912 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

267 MHz

Not Qualified

38654705664 bit

1.7 V

AUTO/SELF REFRESH

260

.27 Amp

.5 ns

K4T51163QG-HCCC

Samsung

DDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

210 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B84

200 MHz

Not Qualified

536870912 bit

.008 Amp

4,8

.6 ns

K4T51043QC-ZLE6T

Samsung

DDR2 DRAM

OTHER

63

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA63,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

BOTTOM

R-PBGA-B63

3

333 MHz

Not Qualified

536870912 bit

260

.005 Amp

4,8

.45 ns

K4S51163LF-YF1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

30

240

11.5 mm

7 ns

K4M563233E-EG1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

268435456 bit

.0012 Amp

1,2,4,8

7 ns

K4M28163PH-BF90T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

85 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

134217728 bit

e3

.00001 Amp

1,2,4,8

7 ns

M393B2G73AH0-CF8

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2830 mA

2147483648 words

YES

COMMON

1.5

1.5

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

85 Cel

3-STATE

2GX72

2G

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

30.15 mm

533 MHz

Not Qualified

154618822656 bit

1.425 V

AUTO/SELF REFRESH

260

133.5 mm

K4T51163QG-HLF7

Samsung

DDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

275 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B84

400 MHz

Not Qualified

536870912 bit

.005 Amp

4,8

.4 ns

K4T1G164QF-BCF70

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

67108864 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

64MX16

64M

0 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

400 MHz

7.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.01 Amp

4,8

12.5 mm

.4 ns

K4B2G0846B-HCH9T

Samsung

DDR3 DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

268435456 words

8

COMMON

1.5

1.5

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B78

3

667 MHz

Not Qualified

2147483648 bit

e1

260

.012 Amp

8

.255 ns

K4M56163DG-BN1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

2.7 V

1 mm

8 mm

Not Qualified

134217728 bit

2.3 V

AUTO/SELF REFRESH

11 mm

7 ns

K4T2G044QA-HLF70

Samsung

DDR2 DRAM

OTHER

68

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

350 mA

536870912 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA68,9X19,32

DRAMs

.8 mm

95 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B68

400 MHz

Not Qualified

2147483648 bit

.008 Amp

4,8

.4 ns

K4B2G1646Q-BCH90

Samsung

DDR3 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

193 mA

134217728 words

8

YES

COMMON

1.5

1.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX16

128M

0 Cel

BOTTOM

1

R-PBGA-B96

1.575 V

1.2 mm

667 MHz

7.5 mm

Not Qualified

2147483648 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.011 Amp

8

13.3 mm

.255 ns

K4B2G1646Q-BCMA0

Samsung

DDR3 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

238 mA

134217728 words

8

YES

COMMON

1.5

1.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX16

128M

0 Cel

BOTTOM

1

R-PBGA-B96

1.575 V

1.2 mm

933 MHz

7.5 mm

Not Qualified

2147483648 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.012 Amp

8

13.3 mm

.195 ns

K4M561633G-BF1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

3.6 V

1 mm

111 MHz

8 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

.001 Amp

1,2,4,8

11 mm

7 ns

K4M281633H-BL1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

60 mA

8388608 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

BOTTOM

1

S-PBGA-B54

3

3.6 V

1 mm

111 MHz

8 mm

Not Qualified

134217728 bit

2.7 V

AUTO/SELF REFRESH

.0005 Amp

1,2,4,8

8 mm

7 ns

K4S641633F-GL1L

Samsung

SYNCHRONOUS DRAM

OTHER

52

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

4194304 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA52,6X13,30

DRAMs

.75 mm

70 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

1

R-PBGA-B52

3.6 V

1 mm

105 MHz

6.6 mm

Not Qualified

67108864 bit

2.7 V

AUTO/SELF REFRESH

.0005 Amp

1,2,4,8

11 mm

7 ns

M392T5663DZA-CF70

Samsung

DDR2 DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

268435456 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

95 Cel

256MX72

256M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

Not Qualified

19327352832 bit

1.7 V

AUTO/SELF REFRESH

.4 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.