Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
268435456 bit |
e0 |
.0005 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||||||||
|
Samsung |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5166 mA |
4294967296 words |
COMMON |
1.35 |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
4GX72 |
4G |
0 Cel |
DUAL |
R-PDMA-N240 |
533 MHz |
Not Qualified |
309237645312 bit |
260 |
.3 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
400 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.4 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
52 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
115 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B52 |
3 |
2.7 V |
1 mm |
133 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0005 Amp |
1,2,4,8 |
11 mm |
5.4 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
52 |
TFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
125 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B52 |
3.3 V |
1.1 mm |
100 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
11 mm |
6 ns |
||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2310 mA |
536870912 words |
YES |
COMMON |
1.35 |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
18.9 mm |
533 MHz |
4 mm |
Not Qualified |
38654705664 bit |
1.283 V |
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX |
.69 Amp |
133.35 mm |
.3 ns |
|||||||||||||||
|
Samsung |
CACHE DRAM MODULE |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
250 mA |
33554432 words |
4,8 |
COMMON |
1.8 |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B60 |
1 |
267 MHz |
Not Qualified |
268435456 bit |
e3 |
.008 Amp |
4,8 |
.5 ns |
|||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
84 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
350 mA |
16777216 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B84 |
2 |
1.9 V |
1.2 mm |
275 MHz |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
4,8 |
13 mm |
.5 ns |
|||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
115 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
2.7 V |
1 mm |
133 MHz |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
240 |
.0005 Amp |
1,2,4,8 |
8 mm |
5.4 ns |
||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
120 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
105 MHz |
11 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.0005 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
245 mA |
67108864 words |
4,8 |
COMMON |
1.8 |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
BOTTOM |
R-PBGA-B60 |
3 |
400 MHz |
Not Qualified |
536870912 bit |
260 |
.008 Amp |
4,8 |
.4 ns |
||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1575 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
333 MHz |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.072 Amp |
.45 ns |
||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
300 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
105 MHz |
Not Qualified |
268435456 bit |
e0 |
.0012 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
2.7 V |
1 mm |
8 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
8 mm |
7 ns |
|||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2040 mA |
33554432 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
266 MHz |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
230 |
.064 Amp |
.5 ns |
|||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
60 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
170 mA |
134217728 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
0 Cel |
MATTE TIN |
BOTTOM |
1 |
R-PBGA-B60 |
1 |
1.9 V |
1.2 mm |
400 MHz |
7.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
e3 |
4,8 |
9.5 mm |
.4 ns |
|||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
8MX16 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
2.7 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
11 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1060 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3 |
1.9 V |
3.8 mm |
400 MHz |
30 mm |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.032 Amp |
67.6 mm |
.4 ns |
|||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e1 |
13 mm |
7 ns |
|||||||||||||||||||||
|
Samsung |
CACHE DRAM MODULE |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
140 mA |
134217728 words |
4,8 |
COMMON |
1.8 |
1.8 |
4 |
GRID ARRAY, FINE PITCH |
BGA60,9X11,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B60 |
1 |
400 MHz |
Not Qualified |
536870912 bit |
e3 |
260 |
.008 Amp |
4,8 |
.4 ns |
||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4510 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
200 MHz |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.604 Amp |
.6 ns |
||||||||||||||||
|
Samsung |
CACHE DRAM MODULE |
OTHER |
84 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
280 mA |
33554432 words |
4,8 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B84 |
1 |
400 MHz |
Not Qualified |
536870912 bit |
e3 |
.008 Amp |
4,8 |
.4 ns |
|||||||||||||||||||||
Samsung |
DDR4 DRAM |
OTHER |
78 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2147483648 words |
YES |
1.2 |
4 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2GX4 |
2G |
0 Cel |
BOTTOM |
1 |
R-PBGA-B78 |
1.26 V |
1.2 mm |
7.5 mm |
8589934592 bit |
1.14 V |
AUTO/SELF REFRESH |
11 mm |
|||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4940 mA |
1073741824 words |
YES |
COMMON |
1.5 |
1.5,1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.575 V |
266 MHz |
Not Qualified |
77309411328 bit |
1.455 V |
AUTO/SELF REFRESH |
260 |
2.2 Amp |
|||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
7 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
268435456 bit |
e0 |
.0005 Amp |
1,2,4,8 |
6 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX16 |
32M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
11.5 mm |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
536870912 words |
COMMON |
1.35 |
1.35 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM204,24 |
DRAMs |
.6 mm |
85 Cel |
3-STATE |
512MX64 |
512M |
0 Cel |
DUAL |
R-PDMA-N204 |
800 MHz |
Not Qualified |
34359738368 bit |
.088 Amp |
.225 ns |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
Not Qualified |
4831838208 bit |
1.425 V |
AUTO/SELF REFRESH |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
160 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B90 |
1 |
133 MHz |
Not Qualified |
268435456 bit |
e3 |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3060 mA |
536870912 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
267 MHz |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.27 Amp |
.5 ns |
||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
84 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
210 mA |
33554432 words |
4,8 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
BOTTOM |
R-PBGA-B84 |
200 MHz |
Not Qualified |
536870912 bit |
.008 Amp |
4,8 |
.6 ns |
||||||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
63 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
134217728 words |
4,8 |
COMMON |
1.8 |
1.8 |
4 |
GRID ARRAY, FINE PITCH |
BGA63,9X11,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
BOTTOM |
R-PBGA-B63 |
3 |
333 MHz |
Not Qualified |
536870912 bit |
260 |
.005 Amp |
4,8 |
.45 ns |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX16 |
32M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
2.7 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
240 |
11.5 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
300 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
105 MHz |
Not Qualified |
268435456 bit |
.0012 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
85 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B54 |
1 |
111 MHz |
Not Qualified |
134217728 bit |
e3 |
.00001 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2830 mA |
2147483648 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
533 MHz |
Not Qualified |
154618822656 bit |
1.425 V |
AUTO/SELF REFRESH |
260 |
133.5 mm |
|||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
84 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
275 mA |
33554432 words |
4,8 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
BOTTOM |
R-PBGA-B84 |
400 MHz |
Not Qualified |
536870912 bit |
.005 Amp |
4,8 |
.4 ns |
||||||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
84 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
180 mA |
67108864 words |
4,8 |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA84,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
64MX16 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B84 |
1.9 V |
1.2 mm |
400 MHz |
7.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.01 Amp |
4,8 |
12.5 mm |
.4 ns |
|||||||||||
|
Samsung |
DDR3 DRAM |
OTHER |
78 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
280 mA |
268435456 words |
8 |
COMMON |
1.5 |
1.5 |
8 |
GRID ARRAY, FINE PITCH |
BGA78,9X13,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B78 |
3 |
667 MHz |
Not Qualified |
2147483648 bit |
e1 |
260 |
.012 Amp |
8 |
.255 ns |
||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
2.7 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
11 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
68 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
350 mA |
536870912 words |
4,8 |
COMMON |
1.8 |
1.8 |
4 |
GRID ARRAY, FINE PITCH |
BGA68,9X19,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
512MX4 |
512M |
0 Cel |
BOTTOM |
R-PBGA-B68 |
400 MHz |
Not Qualified |
2147483648 bit |
.008 Amp |
4,8 |
.4 ns |
||||||||||||||||||||||||
|
Samsung |
DDR3 DRAM |
OTHER |
96 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
193 mA |
134217728 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA96,9X16,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX16 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
1.575 V |
1.2 mm |
667 MHz |
7.5 mm |
Not Qualified |
2147483648 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.011 Amp |
8 |
13.3 mm |
.255 ns |
|||||||||||
|
Samsung |
DDR3 DRAM |
OTHER |
96 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
238 mA |
134217728 words |
8 |
YES |
COMMON |
1.5 |
1.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA96,9X16,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
128MX16 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B96 |
1.575 V |
1.2 mm |
933 MHz |
7.5 mm |
Not Qualified |
2147483648 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.012 Amp |
8 |
13.3 mm |
.195 ns |
|||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
110 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
3.6 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
.001 Amp |
1,2,4,8 |
11 mm |
7 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
60 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
3.6 V |
1 mm |
111 MHz |
8 mm |
Not Qualified |
134217728 bit |
2.7 V |
AUTO/SELF REFRESH |
.0005 Amp |
1,2,4,8 |
8 mm |
7 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
52 |
VFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
120 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA52,6X13,30 |
DRAMs |
.75 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B52 |
3.6 V |
1 mm |
105 MHz |
6.6 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
.0005 Amp |
1,2,4,8 |
11 mm |
7 ns |
||||||||||||||
Samsung |
DDR2 DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
95 Cel |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
.4 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.