Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
1048576 bit |
3.135 V |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3.465 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
3.135 V |
128 |
e3 |
.00005 Amp |
18.4 mm |
200 ns |
3 |
YES |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
64 |
e3 |
40 |
245 |
.0003 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
Intersil |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION |
128 |
e0 |
.0005 Amp |
13.97 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
e3 |
40 |
245 |
.0002 Amp |
13.97 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
Intersil |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION |
128 |
e0 |
.0005 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
1 |
HARDWARE/SOFTWARE |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
64 |
e3 |
40 |
245 |
.00005 Amp |
13.97 mm |
200 ns |
3 |
YES |
|||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
1 |
HARDWARE/SOFTWARE |
R-PQCC-J32 |
3.6 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
10 ms |
262144 bit |
2.7 V |
THE PART EXISTS IN EEPROM3V |
64 |
.00005 Amp |
13.97 mm |
200 ns |
3 |
||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
e3 |
40 |
245 |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
3.556 mm |
11.43 mm |
10 ms |
1048576 bit |
4.5 V |
13.97 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
e3 |
.0002 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
45 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
40 |
245 |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
Intersil |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION |
128 |
e0 |
.0005 Amp |
13.97 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
150 ns |
5 |
YES |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
e3 |
40 |
245 |
13.97 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
8 |
SMALL OUTLINE |
SOP8,.16 |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
1 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
10 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
245 |
.0001 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
e3 |
40 |
245 |
13.97 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
30 |
245 |
13.97 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
245 |
.0002 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE |
128 |
e0 |
240 |
.0002 Amp |
18.4 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.465 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.00002 Amp |
13.97 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
100 mA |
131072 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL32,.5 |
EEPROMs |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
R-XDFP-F32 |
5.5 V |
3.048 mm |
10000 Write/Erase Cycles |
11.6586 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE |
128 |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
.00085 Amp |
20.85 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
8192 words |
3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
2.7 V |
100K ENDURANCE CYCLES; DATA RETENTION = 10 YEARS |
64 |
e0 |
30 |
225 |
.00002 Amp |
13.97 mm |
250 ns |
3 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0002 Amp |
13.97 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0002 Amp |
13.97 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0002 Amp |
13.97 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
225 |
.0001 Amp |
13.97 mm |
250 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0003 Amp |
13.97 mm |
120 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
225 |
.04 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
8192 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.63 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
2.97 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.00002 Amp |
13.97 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
Altera |
CONFIGURATION MEMORY |
COMMERCIAL |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
65536 words |
COMMON |
5 |
5 |
1 |
FLATPACK, LOW PROFILE |
TQFP32,.35SQ,32 |
OTP ROMs |
.8 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
3 |
5.25 V |
1.27 mm |
4 MHz |
7 mm |
Not Qualified |
65536 bit |
4.75 V |
4 WIRE INTERFACE TO FLEX 8000 DEVICES |
e0 |
220 |
7 mm |
||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.25 V |
4.8 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
BULK ERASE; BLOCK ERASE |
e0 |
42 mm |
15000 ns |
5 |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
EEPROM |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
5 |
YES |
8 |
IN-LINE |
DIP32,.6 |
100 |
2.54 mm |
125 Cel |
NO |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
5.92 mm |
100000 Write/Erase Cycles |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
LG_MAX |
256 |
.0005 Amp |
42.95 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
13.97 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
11.43 mm |
5 ms |
65536 bit |
4.5 V |
e3 |
30 |
245 |
13.97 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
42.2 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL32,.5 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.05 mm |
10000 Write/Erase Cycles |
12.2 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; DATA RETENTION: 10 YEARS |
128 |
e0 |
.0003 Amp |
20.85 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
8 |
IN-LINE |
DIP32,.6 |
10 |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
HARDWARE/SOFTWARE |
R-GDIP-T32 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
128 |
.0003 Amp |
42.2 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
8 |
FLATPACK |
10 |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-CDFP-F32 |
5.5 V |
3.05 mm |
100000 Write/Erase Cycles |
12.15 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
.0003 Amp |
20.8 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
64 |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
NO |
DUAL |
R-PDSO-G32 |
10000 Write/Erase Cycles |
Not Qualified |
10 ms |
1048576 bit |
128 |
.003 Amp |
90 ns |
YES |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
12.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
2A |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
12.4 mm |
150 ns |
5 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.