Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
GRID ARRAY |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B6 |
6 V |
.864 mm |
1.91 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
2.85 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
1048576 bit |
.000003 Amp |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
256 words |
3.3 |
3/5 |
4 |
GRID ARRAY |
BGA6,2X3,40/20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
NO |
OPEN-DRAIN |
256X4 |
256 |
-40 Cel |
NO |
TIN SILVER COPPER NICKEL |
BOTTOM |
HARDWARE |
R-PBGA-B6 |
1 |
5.25 V |
.98 mm |
50000 Write/Erase Cycles |
1.68 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e2 |
30 |
260 |
1.68 mm |
NO |
|||||||||||||||||||||
Infineon Technologies |
CONFIGURATION MEMORY |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1073741824 words |
1.8 |
1 |
GRID ARRAY |
85 Cel |
1GX1 |
1G |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
100 MHz |
1073741824 bit |
1.7 V |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
3 mA |
8192 words |
2/3.3 |
8 |
GRID ARRAY |
BGA8,2X4(UNSPEC) |
EEPROMs |
20 |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
65536 bit |
.000002 Amp |
|||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
3 mA |
8192 words |
2/3.3 |
8 |
GRID ARRAY |
BGA8,2X4(UNSPEC) |
EEPROMs |
20 |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
100000 Write/Erase Cycles |
Not Qualified |
SPI |
65536 bit |
.000002 Amp |
|||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
3 mA |
4096 words |
2/3.3 |
8 |
GRID ARRAY |
BGA6(UNSPEC) |
EEPROMs |
10 |
85 Cel |
4KX8 |
4K |
-40 Cel |
1010000R |
BOTTOM |
HARDWARE |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
32768 bit |
.000002 Amp |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
3 mA |
512 words |
1.8/3.3 |
8 |
GRID ARRAY |
BGA4(UNSPEC) |
EEPROMs |
20 |
85 Cel |
512X8 |
512 |
-40 Cel |
1010000R |
BOTTOM |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
4096 bit |
.000002 Amp |
||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
2.5 |
8 |
GRID ARRAY |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
3.6 V |
.4 MHz |
10 ms |
I2C |
16384 bit |
1.7 V |
|||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
2.5 |
2/3.3 |
8 |
GRID ARRAY |
BGA6(UNSPEC) |
EEPROMs |
10 |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010000R |
BOTTOM |
HARDWARE |
R-PBGA-B6 |
3.6 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
65536 bit |
1.7 V |
.000002 Amp |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/3.3 |
8 |
GRID ARRAY |
BGA6(UNSPEC) |
EEPROMs |
10 |
85 Cel |
4KX8 |
4K |
-40 Cel |
1010000R |
BOTTOM |
HARDWARE |
R-PBGA-B6 |
3.6 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
32768 bit |
1.7 V |
.000002 Amp |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/3.3 |
8 |
GRID ARRAY |
BGA8,2X4(UNSPEC) |
EEPROMs |
10 |
85 Cel |
4KX8 |
4K |
-40 Cel |
1010000R |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
32768 bit |
1.8 V |
.000002 Amp |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
6 |
BGA |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
3 mA |
8192 words |
2/3.3 |
8 |
GRID ARRAY |
BGA6(UNSPEC) |
EEPROMs |
10 |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010000R |
BOTTOM |
HARDWARE |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
65536 bit |
.000002 Amp |
||||||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
4 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
2.5 |
1.8/3.3 |
8 |
GRID ARRAY |
BGA4(UNSPEC) |
EEPROMs |
20 |
85 Cel |
512X8 |
512 |
-40 Cel |
1010000R |
BOTTOM |
R-PBGA-B4 |
3.6 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
4096 bit |
1.7 V |
.000002 Amp |
||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
OTHER |
5 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
2.5 |
1.8/3.3 |
8 |
GRID ARRAY |
BGA5,3X3,17/10 |
EEPROMs |
20 |
.254 mm |
85 Cel |
512X8 |
512 |
-20 Cel |
101000MR |
BOTTOM |
HARDWARE |
R-PBGA-B5 |
3.6 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
4096 bit |
1.7 V |
.000002 Amp |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
1.8/5 |
8 |
GRID ARRAY |
BGA8,3X5,14/8 |
EEPROMs |
200 |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
1 MHz |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
.000001 Amp |
|||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
2.5 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
1048576 bit |
.000003 Amp |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
65536 words |
5 |
2/5 |
8 |
GRID ARRAY |
BGA8,3X5,17/10 |
1 |
EEPROMs |
200 |
.254 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
.4 MHz |
1.289 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.955 mm |
5 |
|||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.7 V |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.8 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1010DDMR |
BOTTOM |
HARDWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
1048576 bit |
.000001 Amp |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
1048576 bit |
.000003 Amp |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
1.8/5 |
8 |
GRID ARRAY |
BGA8,3X5,14/8 |
EEPROMs |
200 |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
1 MHz |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
.000001 Amp |
|||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.8 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
524288 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE |
40 |
85 Cel |
512KX8 |
512K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
1200000 Write/Erase Cycles |
10 MHz |
1.863 mm |
5 ms |
SPI |
4194304 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
2.809 mm |
2.5 |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
1.8/5 |
8 |
GRID ARRAY |
BGA8,3X5,14/8 |
EEPROMs |
200 |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
1 MHz |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
.000001 Amp |
|||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.8 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
1048576 bit |
.000003 Amp |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.7 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1010DDMR |
BOTTOM |
HARDWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
1048576 bit |
.000001 Amp |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1010DDMR |
BOTTOM |
HARDWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
1048576 bit |
.000001 Amp |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
65536 words |
5 |
2/5 |
8 |
GRID ARRAY |
BGA8,3X5,17/10 |
1 |
EEPROMs |
200 |
.254 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
.4 MHz |
1.289 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.955 mm |
5 |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
65536 words |
5 |
2/5 |
8 |
GRID ARRAY |
BGA8,3X5,17/10 |
1 |
EEPROMs |
200 |
.254 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
.4 MHz |
1.289 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.955 mm |
5 |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
524288 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE |
40 |
85 Cel |
512KX8 |
512K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
1200000 Write/Erase Cycles |
10 MHz |
1.863 mm |
5 ms |
SPI |
4194304 bit |
1.8 V |
.000002 Amp |
2.809 mm |
2.5 |
|||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
2.5 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1010DDMR |
BOTTOM |
HARDWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
1048576 bit |
.000001 Amp |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
2.5 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
1.8/5 |
8 |
GRID ARRAY |
BGA8,3X5,14/8 |
EEPROMs |
200 |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
1 MHz |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
.000001 Amp |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
524288 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE |
40 |
85 Cel |
512KX8 |
512K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
1200000 Write/Erase Cycles |
10 MHz |
1.863 mm |
5 ms |
SPI |
4194304 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
2.809 mm |
2.5 |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
65536 words |
5 |
2/5 |
8 |
GRID ARRAY |
BGA8,3X5,17/10 |
1 |
EEPROMs |
200 |
.254 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
5 |
|||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
524288 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE |
40 |
85 Cel |
512KX8 |
512K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
1200000 Write/Erase Cycles |
10 MHz |
1.863 mm |
5 ms |
SPI |
4194304 bit |
1.8 V |
.000002 Amp |
2.809 mm |
2.5 |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
SERIAL |
5 mA |
131072 words |
2/5 |
8 |
GRID ARRAY |
BGA8,3X3,47/24 |
EEPROMs |
40 |
.6 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
1048576 bit |
.000003 Amp |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.8 V |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
1.7 V |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
GRID ARRAY |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
1 MHz |
5 ms |
I2C |
131072 bit |
2.5 V |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
16384 words |
1.8/5 |
8 |
GRID ARRAY |
BGA8,3X5,14/8 |
EEPROMs |
200 |
85 Cel |
16KX8 |
16K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
4000000 Write/Erase Cycles |
1 MHz |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
.000001 Amp |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
13 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.2 |
1 |
GRID ARRAY |
BGA13,3X6,16 |
10 |
.4 mm |
85 Cel |
4MX1 |
4M |
-20 Cel |
BOTTOM |
1 |
R-PBGA-B13 |
2 V |
.42 mm |
500000 Write/Erase Cycles |
2.74 mm |
SPI |
4194304 bit |
1 V |
2.8 mm |
1.2 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.