Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class C |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class C |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
1 |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
100000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
Defense Logistics Agency |
EEPROM |
MILITARY |
DFP |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
5.5 V |
3.02 mm |
10.16 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
18.285 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
100 mA |
131072 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL32,.5 |
EEPROMs |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
R-XDFP-F32 |
5.5 V |
3.048 mm |
10000 Write/Erase Cycles |
11.6586 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE |
128 |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
.00085 Amp |
20.85 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
Intersil |
EEPROM |
INDUSTRIAL |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
5.5 V |
2.92 mm |
1000000 Write/Erase Cycles |
12.445 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION |
128 |
e0 |
.0005 Amp |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class C |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
1 |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL32,.5 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.05 mm |
10000 Write/Erase Cycles |
12.2 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; DATA RETENTION: 10 YEARS |
128 |
e0 |
.0003 Amp |
20.85 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
8 |
FLATPACK |
10 |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-CDFP-F32 |
5.5 V |
3.05 mm |
100000 Write/Erase Cycles |
12.15 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
128 |
.0003 Amp |
20.8 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
Texas Instruments |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
FLATPACK |
125 Cel |
32KX8 |
32K |
-55 Cel |
DUAL |
R-XDFP-F28 |
5.5 V |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
200 ns |
5 |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.1242 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.828 mm |
250 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
200 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
200 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.1242 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.828 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
150 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.825 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.415 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
250 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
200 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
200 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.415 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
250 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
200 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.415 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
150 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.1242 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.828 mm |
200 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
200 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
200 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.415 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
250 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.825 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
250 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
250 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.415 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
200 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
250 ns |
5 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
250 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.12 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
20.825 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
200 ns |
5 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.