Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
30 |
260 |
.0000035 Amp |
4.9 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.7 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
.0000035 Amp |
4.9 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
.0000035 Amp |
4.9 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
.8 mA |
512 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
2.5 V |
e4 |
260 |
.0000035 Amp |
4.9 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
100000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE |
e4 |
.0000035 Amp |
9.5 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
.0000035 Amp |
9.5 mm |
|||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
30 |
260 |
.0000035 Amp |
4.9 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
R-PDSO-G8 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
40 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1 mA |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
8192 bit |
.000015 Amp |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
100000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE |
e4 |
.0000035 Amp |
4.9 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
R-PDSO-G8 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
40 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1024 words |
3.3 |
8 |
SMALL OUTLINE |
40 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
6 V |
2.65 mm |
.1 MHz |
7.5 mm |
Not Qualified |
10 ms |
I2C |
8192 bit |
2.5 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
e4 |
7.55 mm |
||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
10000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
20 ms |
I2C |
1024 bit |
4.5 V |
.00003 Amp |
4.9 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
128X8 |
128 |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDIP-T8 |
5.5 V |
4.2 mm |
10000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
e4 |
.00001 Amp |
9.5 mm |
5 |
||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
20 ms |
I2C |
1024 bit |
4.5 V |
4.9 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-G8 |
6 V |
1.75 mm |
.1 MHz |
3.9 mm |
10 ms |
I2C |
2048 bit |
2.5 V |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-25 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
10000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
2.5 V |
10 YEAR OF DATA RETENTION |
e4 |
.00001 Amp |
4.9 mm |
3 |
|||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1 mA |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
EEPROMs |
10 |
.635 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
Not Qualified |
I2C |
8192 bit |
.000015 Amp |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
128X8 |
128 |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
10000 Write/Erase Cycles |
3.9 mm |
Not Qualified |
I2C |
1024 bit |
4.5 V |
8 BYTE PAGE WRITE; DATA RETENTION = 10 YEARS |
e4 |
.00001 Amp |
4.9 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
I2C |
8192 bit |
2.5 V |
e4 |
.000015 Amp |
4.9 mm |
|||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE |
40 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
2.5 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
1048576 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
MATTE TIN |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
I2C |
8388608 bit |
2.5 V |
e3 |
30 |
260 |
.000018 Amp |
4.9 mm |
|||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
4.2 mm |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.5 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
3.3 |
8 |
SMALL OUTLINE |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
125 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
50000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
.00001 Amp |
4.9 mm |
||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
IN-LINE |
40 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
-25 Cel |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
3 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
9.5 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
.1 MHz |
7.5 mm |
Not Qualified |
40 ms |
I2C |
2048 bit |
4.5 V |
I2C BUS INTERFACE; FMAX IS 100KHZ |
10.3 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1048576 words |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
I2C |
8388608 bit |
2.5 V |
e4 |
4.9 mm |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1024 words |
5 |
8 |
SMALL OUTLINE |
40 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-25 Cel |
DUAL |
R-PDSO-G8 |
6 V |
2.65 mm |
.1 MHz |
7.5 mm |
Not Qualified |
10 ms |
I2C |
8192 bit |
3 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
7.55 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
I2C |
8192 bit |
2.5 V |
e4 |
.000015 Amp |
4.9 mm |
|||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
128X8 |
128 |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDSO-G8 |
6 V |
1.75 mm |
10000 Write/Erase Cycles |
3.9 mm |
Not Qualified |
I2C |
1024 bit |
2.5 V |
8 BYTE PAGE WRITE; DATA RETENTION = 10 YEARS |
e4 |
.00001 Amp |
4.9 mm |
|||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
8 |
SMALL OUTLINE |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-25 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
1024 bit |
4.5 V |
10 YEAR OF DATA RETENTION |
4.9 mm |
5 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
OTHER |
13 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.2 |
1 |
GRID ARRAY |
BGA13,3X6,16 |
10 |
.4 mm |
85 Cel |
4MX1 |
4M |
-20 Cel |
BOTTOM |
1 |
R-PBGA-B13 |
2 V |
.42 mm |
500000 Write/Erase Cycles |
2.74 mm |
SPI |
4194304 bit |
1 V |
2.8 mm |
1.2 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
8 |
IN-LINE |
2.54 mm |
85 Cel |
128X8 |
128 |
-25 Cel |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
1024 bit |
2.5 V |
9.5 mm |
3 |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE |
40 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
-25 Cel |
DUAL |
R-PDSO-G8 |
6 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
3 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
40 |
2.54 mm |
125 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
4.2 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
8192 bit |
4.5 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
9.5 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
SMALL OUTLINE |
40 |
1.27 mm |
125 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
4.5 V |
DATA RETENTION = 40 YEARS; WIRE I2C INTERFACE |
4.9 mm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
UNCASED CHIP |
10 |
85 Cel |
256X8 |
256 |
-40 Cel |
UPPER |
X-XUUC-N |
5.5 V |
.052 MHz |
Not Qualified |
2.5 ms |
I2C |
2048 bit |
4.5 V |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION 10 YEARS MIN |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
UNCASED CHIP |
10 |
85 Cel |
256X8 |
256 |
-40 Cel |
UPPER |
X-XUUC-N |
5.5 V |
.052 MHz |
Not Qualified |
2.5 ms |
I2C |
2048 bit |
4.5 V |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION 10 YEARS MIN |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
3.3 |
8 |
IN-LINE |
10 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE |
e4 |
9.5 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1048576 words |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
1.1 mm |
.4 MHz |
3 mm |
Not Qualified |
I2C |
8388608 bit |
2.5 V |
e4 |
3 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
1024 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
10101MMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
I2C |
8192 bit |
2.5 V |
e4 |
.000015 Amp |
4.9 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.