Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
SMALL OUTLINE |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
2.03 mm |
.1 MHz |
5.25 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3 V |
1000K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS |
5.3 mm |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
2.5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
1 mm |
.1 MHz |
2 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
28 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.55 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.25 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
11.8 mm |
200 ns |
5 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.6 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
1.8 V |
e4 |
.00001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
MATTE TIN |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
16384 bit |
4.5 V |
ENDURANCE >100000 WRITE/ERASE CYCLES; DATA RETENTION > 40 YEARS; 32 BYTE PAGE WRITE |
32 |
e3 |
.00005 Amp |
13.995 mm |
200 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
2 |
8 |
CHIP CARRIER |
10 |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
QUAD |
R-PQCC-J32 |
2.4 V |
3.56 mm |
11.455 mm |
Not Qualified |
1048576 bit |
1.8 V |
100K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS |
13.995 mm |
100 ns |
3 |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
10 mA |
8192 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
40 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
MATTE TIN |
YES |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
11.455 mm |
Not Qualified |
5 ms |
65536 bit |
2.7 V |
MINIMUM 100K ERASE/WRITE CYCLES; MINIMUM 40 YEARS DATA RETENTION |
64 |
e3 |
.00002 Amp |
13.995 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e0 |
.0001 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
256 words |
2.2 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
1.8 V |
e4 |
.0000005 Amp |
4.4 mm |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
6 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
34 words |
5 |
8 |
UNCASED CHIP |
34X8 |
34 |
UPPER |
X-XUUC-N6 |
Not Qualified |
5 ms |
I2C |
272 bit |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e3 |
.0001 Amp |
36.02 mm |
200 ns |
5 |
YES |
||||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
1 mm |
.1 MHz |
2 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
125 Cel |
256X16 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
2 MHz |
3 mm |
Not Qualified |
5 ms |
MICROWIRE |
4096 bit |
4.5 V |
e4 |
.00005 Amp |
4.4 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
4.5 V |
e0 |
.0001 Amp |
4.9 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
3 |
8 |
IN-LINE |
40 |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDIP-T28 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
5 ms |
65536 bit |
2.7 V |
MINIMUM 100K ERASE/WRITE CYCLES; MINIMUM 40 YEARS DATA RETENTION |
36.02 mm |
200 ns |
3 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
8 |
EEPROMs |
40 |
1.27 mm |
70 Cel |
128X16 |
128 |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
MICROWIRE |
2048 bit |
4.5 V |
1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION; USER CONFIGURABLE AS 128 X 16 |
e4 |
.00005 Amp |
4.9 mm |
|||||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
3.3/5 |
8 |
IN-LINE |
DIP8,.3 |
16 |
EEPROMs |
40 |
2.54 mm |
70 Cel |
128X8 |
128 |
0 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.9 mm |
1000000 Write/Erase Cycles |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
1024 bit |
3 V |
e0 |
.00005 Amp |
9.55 mm |
500 ns |
||||||||||||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
262144 bit |
e3 |
.0001 Amp |
120 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
3.3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
3 V |
e4 |
4.9 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
2 mA |
256 words |
3.3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
2048 bit |
e0 |
.00001 Amp |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
1.5 mA |
64 words |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
64X16 |
64 |
-20 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
MICROWIRE |
1024 bit |
e0 |
.00001 Amp |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
100000 Write/Erase Cycles |
Not Qualified |
3 ms |
262144 bit |
64 |
e0 |
.0001 Amp |
150 ns |
YES |
||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
28 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.55 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.25 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
11.8 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1 mA |
131072 words |
3.3 |
3/5 |
1 |
UNCASED CHIP |
MODULE,8LEAD,.4 |
EEPROMs |
40 |
70 Cel |
128KX1 |
128K |
0 Cel |
1010000R |
UPPER |
HARDWARE |
R-XUUC-N |
1 |
5.5 V |
100000 Write/Erase Cycles |
.4 MHz |
Not Qualified |
10 ms |
I2C |
131072 bit |
2.5 V |
.000002 Amp |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
1 mm |
.1 MHz |
2 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
TIN LEAD |
MMMMMMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.9 mm |
100000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
2 WIRE SERIAL INTERFACE; 100K ERASE/WRITE CYCLE; DATA RETENTION 100 YEARS; HARDWARE WRITE |
e0 |
.0001 Amp |
9.55 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
4.8 mm |
7.62 mm |
Not Qualified |
MICROWIRE |
1024 bit |
4.5 V |
CAN BE ORGANIZED AS 64 X 16 |
9.55 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
5 ms |
262144 bit |
2.7 V |
64 |
e3 |
.00002 Amp |
13.995 mm |
150 ns |
3 |
YES |
||||||||||||||||||||||
|
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
1048576 bit |
e3 |
.0001 Amp |
35 ns |
2.7 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
5 |
3.3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
3 V |
40 YEARS DATA RETENTION; 2 WIRE SERIAL INTERFACE |
e4 |
4.9 mm |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
8 |
SMALL OUTLINE |
10 |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
16384 bit |
3 V |
OVER 10 YEARS DATA RETENTION |
4.9 mm |
3 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
3-STATE |
256X8 |
256 |
-40 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.9 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
2.5 V |
e0 |
.000025 Amp |
9.55 mm |
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STMicroelectronics |
EEPROM CARD |
COMMERCIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
Not Qualified |
262144 bit |
e0 |
.0001 Amp |
150 ns |
2.7 |
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STMicroelectronics |
EEPROM |
INDUSTRIAL |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP14,.25 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
SOFTWARE |
R-PDSO-G14 |
5.5 V |
1.75 mm |
100000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3 V |
1000K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS |
e0 |
.0001 Amp |
8.65 mm |
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|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
128 words |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
EEPROMs |
40 |
.65 mm |
125 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
1000000 Write/Erase Cycles |
2 MHz |
3 mm |
Not Qualified |
5 ms |
MICROWIRE |
2048 bit |
4.5 V |
e3 |
.00005 Amp |
3 mm |
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|
STMicroelectronics |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
5 |
3.3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
70 Cel |
512X8 |
512 |
0 Cel |
NICKEL PALLADIUM GOLD |
1010DDMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
3 V |
40 YEARS DATA RETENTION; 2 WIRE SERIAL INTERFACE |
e4 |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE |
2.54 mm |
125 Cel |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
1048576 bit |
1.8 V |
e3 |
9.27 mm |
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STMicroelectronics |
EEPROM |
OTHER |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
1.5 mA |
256 words |
3/5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.635 mm |
85 Cel |
256X16 |
256 |
-20 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
MICROWIRE |
4096 bit |
e0 |
.00001 Amp |
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|
STMicroelectronics |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e3 |
.0001 Amp |
13.995 mm |
200 ns |
5 |
YES |
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STMicroelectronics |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
26 mA |
131072 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
2.7 V |
128 |
e0 |
.00003 Amp |
18.4 mm |
100 ns |
3 |
YES |
|||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
10 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
100K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS |
128 |
e0 |
.00005 Amp |
18.4 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
STMicroelectronics |
EEPROM CARD |
INDUSTRIAL |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
262144 bit |
e0 |
.0001 Amp |
200 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
3-STATE |
16X16 |
16 |
-40 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
4.8 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
256 bit |
4.5 V |
1 MILLION ERASE/WRITE CYCLES.; 40 YEARS DATA RETENTION; USER CONFIGURABLE 16 X 16 |
e0 |
.00005 Amp |
9.55 mm |
|||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
8 |
IN-LINE |
10 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.9 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
2.5 V |
1000K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS |
9.55 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.