Samsung EEPROM 1,108

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S524L50D51-SCT

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2048 words

3.3

8

SMALL OUTLINE

1.27 mm

70 Cel

2KX8

2K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.1 MHz

3.95 mm

Not Qualified

5 ms

I2C

16384 bit

2 V

4.92 mm

K8S1215EZC-FE1CT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

512

YES

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

K9K2G08U0A-FIB0T

Samsung

EEPROM CARD

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

268435456 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.71,20

Flash Memories

.5 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

1

Not Qualified

2147483648 bit

2K

e3

NAND TYPE

.0001 Amp

30 ns

2.7

NO

KM28C17J-15

Samsung

EEPROM

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

2048 words

5

NO

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

10

1.27 mm

70 Cel

2KX8

2K

0 Cel

NO

TIN LEAD

YES

QUAD

R-PQCC-J32

5.5 V

3.55 mm

11.43 mm

Not Qualified

16384 bit

4.5 V

AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS

32

e0

.0001 Amp

13.97 mm

150 ns

5

YES

S524L50D51-RC

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2048 words

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

2KX8

2K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

.1 MHz

3 mm

Not Qualified

5 ms

I2C

16384 bit

2 V

4.4 mm

KS24C021ISTF

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

2.5

3/5

1

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

85 Cel

2KX1

2K

-40 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.95 mm

1000000 Write/Erase Cycles

.4 MHz

3.95 mm

Not Qualified

10 ms

I2C

2048 bit

2.2 V

e0

.000005 Amp

4.92 mm

S524A60X51-DC

Samsung

EEPROM

OTHER

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

2048 words

2.5

2/5

8

IN-LINE

DIP8,.3

EEPROMs

100

2.54 mm

70 Cel

2KX8

2K

-25 Cel

1010MMMR

DUAL

HARDWARE

R-PDIP-T8

5.5 V

5.08 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

5 ms

I2C

16384 bit

1.8 V

.000001 Amp

9.2 mm

K8S1015EZC-SE1CT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

512

YES

MATTE TIN

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524C20D21-R1

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

256 words

3.3

8

SMALL OUTLINE

85 Cel

256X8

256

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

10 ms

I2C

2048 bit

2.5 V

e0

S524LB0DB1-SIT

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

8192 words

3.3

8

SMALL OUTLINE

85 Cel

8KX8

8K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

5 ms

I2C

65536 bit

2 V

S524A60X81-DCB

Samsung

S524C80D40-SCT

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

512 words

3.3

8

SMALL OUTLINE

1.27 mm

70 Cel

512X8

512

-25 Cel

TIN LEAD

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.1 MHz

3.95 mm

Not Qualified

10 ms

I2C

4096 bit

2.5 V

e0

4.92 mm

S524A40X11-RCT

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

128 words

2.5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.65 mm

70 Cel

128X8

128

-25 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

1024 bit

1.8 V

e0

.000001 Amp

4.4 mm

S524A40X21-SI

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

85 Cel

256X8

256

-40 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

2048 bit

1.8 V

.000001 Amp

4.9 mm

S524LB0D91-SI

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4096 words

3.3

8

SMALL OUTLINE

85 Cel

4KX8

4K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

5 ms

I2C

32768 bit

2 V

KM93C66G

Samsung

EEPROM

COMMERCIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

5

5

16

SMALL OUTLINE

SOP8,.25

EEPROMs

10

1.27 mm

70 Cel

3-STATE

256X16

256

0 Cel

TIN LEAD

DUAL

SOFTWARE

R-PDSO-G8

5.5 V

1.95 mm

100000 Write/Erase Cycles

1 MHz

3.94 mm

Not Qualified

10 ms

MICROWIRE

4096 bit

4.5 V

e0

.00005 Amp

5.02 mm

S524A40X11-DIU

Samsung

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

SERIAL

3 mA

128 words

2/5

8

IN-LINE

DIP8,.3

EEPROMs

100

2.54 mm

85 Cel

128X8

128

-40 Cel

1010DDDR

DUAL

HARDWARE

R-PDIP-T8

1000000 Write/Erase Cycles

Not Qualified

I2C

1024 bit

.000001 Amp

KM28C65-20

Samsung

EEPROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

8192 words

5

YES

5

8

IN-LINE

DIP28,.6

EEPROMs

10

2.54 mm

70 Cel

3-STATE

8KX8

8K

0 Cel

NO

TIN LEAD

YES

DUAL

R-PDIP-T28

5.5 V

5.59 mm

15.24 mm

Not Qualified

65536 bit

4.5 V

AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS

64

e0

.0001 Amp

200 ns

5

YES

KM2816A-35

Samsung

EEPROM

COMMERCIAL

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

110 mA

2048 words

5

NO

5

8

IN-LINE

DIP24,.6

EEPROMs

2.54 mm

70 Cel

2KX8

2K

0 Cel

NO

TIN LEAD

DUAL

R-PDIP-T24

3

5.5 V

6.98 mm

15.24 mm

Not Qualified

16384 bit

4.5 V

SEATED HT-CALCULATED

e0

.05 Amp

32 mm

350 ns

5

NO

KM28C256J-25

Samsung

EEPROM

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

60 mA

32768 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

1.27 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

NO

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.55 mm

10000 Write/Erase Cycles

11.43 mm

Not Qualified

5 ms

262144 bit

4.5 V

64

e0

.0001 Amp

13.97 mm

250 ns

5

YES

K8S1215ETC-SE1DT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B64

1

Not Qualified

TOP

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524A40X10-RC

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

128 words

2.5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.65 mm

70 Cel

128X8

128

-25 Cel

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

1024 bit

1.8 V

.000001 Amp

4.4 mm

KM28C256AJ-20

Samsung

EEPROM

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

60 mA

32768 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

10

1.27 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

NO

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.55 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

5 ms

262144 bit

4.5 V

AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS

64

e0

.0001 Amp

13.97 mm

200 ns

5

YES

KFM1G16Q2A-DED8T

Samsung

EEPROM CARD

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

45 mA

67108864 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX16

64M

-30 Cel

1K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

1073741824 bit

1K

e3

NAND TYPE

.00005 Amp

76 ns

2.7

NO

S524A40X20-SCT

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

256 words

2.5

8

SMALL OUTLINE

1.27 mm

70 Cel

256X8

256

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.8 mm

.4 MHz

3.95 mm

Not Qualified

5 ms

I2C

2048 bit

1.8 V

4.92 mm

KS24L161CTTF

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16384 words

5

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

16KX1

16K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

.4 MHz

3 mm

Not Qualified

5 ms

I2C

16384 bit

2 V

4.4 mm

KS24C081IS

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

2.5

2.2/5.5

1

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

85 Cel

8KX1

8K

-40 Cel

TIN LEAD

1010DXXR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.95 mm

1000000 Write/Erase Cycles

.4 MHz

3.95 mm

Not Qualified

10 ms

I2C

8192 bit

2.2 V

e0

.000005 Amp

4.92 mm

KM2865AH-30

Samsung

EEPROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

MOS

THROUGH-HOLE

PARALLEL

8192 words

5

NO

5

8

IN-LINE

DIP28,.6

EEPROMs

2.54 mm

70 Cel

8KX8

8K

0 Cel

NO

TIN LEAD

YES

DUAL

R-PDIP-T28

3

Not Qualified

2 ms

65536 bit

e0

300 ns

YES

S524A40X11-SCU

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

3 mA

128 words

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

70 Cel

128X8

128

-25 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1000000 Write/Erase Cycles

Not Qualified

I2C

1024 bit

.000001 Amp

KS24A2561ITTF

Samsung

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

262144 words

2.5

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

256KX1

256K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

1 MHz

3 mm

Not Qualified

5 ms

I2C

262144 bit

1.8 V

4.4 mm

S524LB0D91-R1T

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4096 words

3.3

8

SMALL OUTLINE

85 Cel

4KX8

4K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

5 ms

I2C

32768 bit

2 V

K8S1115EBC-SC1ET

Samsung

EEPROM CARD

COMMERCIAL

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B64

1

Not Qualified

BOTTOM

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524C20D21-SCT

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

256 words

3.3

8

SMALL OUTLINE

1.27 mm

70 Cel

256X8

256

-25 Cel

TIN LEAD

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.1 MHz

3.95 mm

Not Qualified

10 ms

I2C

2048 bit

2.5 V

e0

4.92 mm

KM28C16I-20

Samsung

EEPROM

INDUSTRIAL

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

2048 words

5

NO

5

8

IN-LINE

DIP24,.6

EEPROMs

10

2.54 mm

85 Cel

2KX8

2K

-40 Cel

NO

TIN LEAD

DUAL

R-PDIP-T24

5.5 V

4.44 mm

15.24 mm

Not Qualified

16384 bit

4.5 V

AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS

32

e0

.0001 Amp

200 ns

5

YES

K8S1215EZC-SE1DT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

512

YES

MATTE TIN

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

KM28C16JI-20

Samsung

EEPROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

2048 words

5

NO

5

8

CHIP CARRIER

LDCC32,.5X.6

EEPROMs

10

1.27 mm

85 Cel

2KX8

2K

-40 Cel

NO

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.55 mm

11.43 mm

Not Qualified

16384 bit

4.5 V

AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS

32

e0

.0001 Amp

13.97 mm

200 ns

5

YES

S524C20D21-DI

Samsung

EEPROM

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

256 words

3.3

8

IN-LINE

85 Cel

256X8

256

-40 Cel

TIN LEAD

DUAL

R-PDIP-T8

5.5 V

.1 MHz

Not Qualified

10 ms

I2C

2048 bit

2.5 V

e0

KM28C64BI-12

Samsung

EEPROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

40 mA

8192 words

5

YES

5

8

IN-LINE

DIP28,.6

EEPROMs

2.54 mm

85 Cel

3-STATE

8KX8

8K

-40 Cel

NO

TIN LEAD

DUAL

R-PDIP-T28

5.5 V

5.59 mm

100000 Write/Erase Cycles

15.24 mm

Not Qualified

5 ms

65536 bit

4.5 V

64

e0

.0001 Amp

120 ns

5

YES

KS24A641ITTF

Samsung

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

65536 words

2

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

64KX1

64K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

.4 MHz

3 mm

Not Qualified

5 ms

I2C

65536 bit

1.8 V

4.4 mm

S524C20D10-RIB0

Samsung

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

3 mA

128 words

2.5/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.635 mm

85 Cel

128X8

128

-40 Cel

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1000000 Write/Erase Cycles

Not Qualified

I2C

1024 bit

.000005 Amp

S524L50D51-SI

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2048 words

3.3

8

SMALL OUTLINE

85 Cel

2KX8

2K

-40 Cel

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

5 ms

I2C

16384 bit

2 V

KS24C021ITTF

Samsung

EEPROM

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

2.5

3/5

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.65 mm

85 Cel

2KX1

2K

-40 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

10 ms

I2C

2048 bit

2.2 V

e0

.000005 Amp

4.4 mm

K8S1315EZC-DC1FT

Samsung

EEPROM CARD

COMMERCIAL

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

70 Cel

32MX16

32M

0 Cel

512

YES

MATTE TIN

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

KFG2816U1M-PIB

Samsung

EEPROM CARD

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

32K

30 mA

8388608 words

3.3

NO

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

1

Not Qualified

134217728 bit

512

e3

NAND TYPE

.00005 Amp

14.5 ns

2.7

NO

S524C80D40-SIB0

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

3 mA

512 words

2.5/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

85 Cel

512X8

512

-40 Cel

1010DDMR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1000000 Write/Erase Cycles

Not Qualified

I2C

4096 bit

.000005 Amp

S524C20D21-SIT

Samsung

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

256 words

3.3

8

SMALL OUTLINE

85 Cel

256X8

256

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

5.5 V

.1 MHz

Not Qualified

10 ms

I2C

2048 bit

2.5 V

e0

KS24C041CT

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

4096 words

2.5

2.2/5.5

1

SMALL OUTLINE

TSSOP8,.3

EEPROMs

100

.65 mm

70 Cel

4KX1

4K

-25 Cel

TIN LEAD

1010DDXR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

10 ms

I2C

4096 bit

2.2 V

e0

.000005 Amp

4.4 mm

KM28C64IJ25

Samsung

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.