Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
.0001 Amp |
36.92 mm |
150 ns |
|||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
1695680 words |
3.3 |
3.3/5 |
1 |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
1695680X1 |
1695680 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.2 mm |
7 mm |
Not Qualified |
1695680 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e3 |
.0001 Amp |
7 mm |
3.3 |
||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
36.92 mm |
90 ns |
|||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
SERIAL |
SYNCHRONOUS |
50 mA |
1695680 words |
3.3 |
3.3/5 |
1 |
CHIP CARRIER |
LCC20,.39SQ |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
1695680X1 |
1695680 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
1695680 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e3 |
.0001 Amp |
8.9662 mm |
3.3 |
||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
36.92 mm |
150 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
120 ns |
12.75 |
||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
50 mA |
1046496 words |
3.3 |
3.3/5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
1046496X1 |
1046496 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
1 |
3.6 V |
4.318 mm |
7.62 mm |
Not Qualified |
1046496 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e3 |
.0001 Amp |
9.398 mm |
3.3 |
||||||||
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
1695680 words |
3.3 |
3.3/5 |
1 |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
1695680X1 |
1695680 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.2 mm |
7 mm |
Not Qualified |
1695680 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e0 |
.0001 Amp |
7 mm |
3.3 |
|||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.0001 Amp |
200 ns |
13 |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
36.92 mm |
150 ns |
12.75 |
||||||||
Rochester Electronics |
UVPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.1475 mm |
120 ns |
||||||||||||||||||
Spansion |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
37.1475 mm |
150 ns |
|||||||||||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.0001 Amp |
150 ns |
13 |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
200 ns |
12.5 |
||||||||
Intel |
UVPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
131072 bit |
e0 |
200 ns |
12.5 |
|||||||||||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
245 |
.0001 Amp |
41.885 mm |
120 ns |
||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
70 ns |
|||||||||
Intel |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.5 V |
e0 |
37.15 mm |
200 ns |
12.5 |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
150 ns |
12.5 |
||||||||
Cypress Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
150 ns |
||||||||||||||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0001 Amp |
120 ns |
12.75 |
||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T24 |
5.5 V |
5.969 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.5 V |
TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS |
e0 |
.0001 Amp |
200 ns |
||||||||||
Microchip Technology |
EPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.83 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
DATA RETENTION >200 YEARS |
e0 |
.0001 Amp |
36.32 mm |
100 ns |
5 |
||||||||
Texas Instruments |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
250 ns |
13 |
||||||||||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
200 ns |
|||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
250 ns |
|||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
170 ns |
|||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
150 ns |
|||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
120 ns |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.91 mm |
120 ns |
||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
120 ns |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.91 mm |
100 ns |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
100 ns |
13 |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
DUAL |
R-CDIP-T24 |
5.5 V |
4.907 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
31.75 mm |
100 ns |
||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
16KX8 |
16K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
100 ns |
13 |
|||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.91 mm |
200 ns |
|||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
200 ns |
13 |
|||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.83 mm |
170 ns |
13 |
|||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.83 mm |
120 ns |
13 |
||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
DUAL |
R-CDIP-T24 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
31.75 mm |
120 ns |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.91 mm |
200 ns |
||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
DUAL |
R-CDIP-T24 |
5.5 V |
4.907 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
31.75 mm |
200 ns |
||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
200 ns |
||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
DUAL |
R-CDIP-T40 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
52.07 mm |
200 ns |
|||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.83 mm |
100 ns |
12.5 |
|||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
DUAL |
R-GDIP-T40 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
120 ns |
|||||||||||
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
4.907 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.83 mm |
300 ns |
||||||||||
|
Texas Instruments |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
150 ns |
EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.
EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.
EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.