Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
UVPROM |
AUTOMOTIVE |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
90 ns |
12.75 |
||||||||
STMicroelectronics |
UVPROM |
AUTOMOTIVE |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
120 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
100 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0001 Amp |
41.885 mm |
250 ns |
|||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
150 ns |
||||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
105 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
5.71 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
120 ns |
||||||||||||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
90 ns |
||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
.0001 Amp |
41.885 mm |
250 ns |
||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.8 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
100 ns |
||||||||||
|
STMicroelectronics |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
J BEND |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-J44 |
4194304 bit |
e3 |
.0001 Amp |
150 ns |
|||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
J BEND |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-J44 |
4194304 bit |
e3 |
.0001 Amp |
45 ns |
|||||||||||||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN |
DUAL |
R-GDIP-T28 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
36.92 mm |
150 ns |
|||||||||||||||
STMicroelectronics |
INDUSTRIAL |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N32 |
4194304 bit |
e0 |
.0001 Amp |
100 ns |
||||||||||||||||||||
STMicroelectronics |
AUTOMOTIVE |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N32 |
1048576 bit |
e0 |
.0001 Amp |
120 ns |
||||||||||||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0001 Amp |
52.195 mm |
100 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
GOLD |
QUAD |
R-CQCC-N32 |
5.25 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.75 V |
e4 |
.0001 Amp |
13.97 mm |
60 ns |
|||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
e0 |
.0001 Amp |
36.92 mm |
80 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
GOLD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
.0001 Amp |
13.97 mm |
35 ns |
|||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.25 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
.0001 Amp |
13.97 mm |
45 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T40 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
90 ns |
|||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.25 V |
2.8 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
.0001 Amp |
13.97 mm |
45 ns |
||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
42 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
524288 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP42,.6 |
8 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T42 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
8388608 bit |
4.5 V |
e0 |
.00005 Amp |
54.635 mm |
50 ns |
|||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
120 ns |
||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
80 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
AUTOMOTIVE |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0001 Amp |
52.195 mm |
45 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
S-CQCC-J44 |
5.25 V |
4.83 mm |
16.51 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
16.51 mm |
80 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
R-GDIP-T32 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0001 Amp |
41.885 mm |
70 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
80 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
55 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
100 ns |
12.5 |
||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
IN-LINE |
2.54 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-CDIP-T40 |
5.5 V |
5.72 mm |
13.2 mm |
Not Qualified |
4194304 bit |
4.5 V |
52.195 mm |
70 ns |
|||||||||||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
120 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T32 |
5.25 V |
5.97 mm |
15.24 mm |
Not Qualified |
2097152 bit |
4.75 V |
e3 |
.0001 Amp |
41.885 mm |
150 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
GOLD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
.0001 Amp |
13.97 mm |
60 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
S-CQCC-J44 |
5.25 V |
4.83 mm |
16.51 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
16.51 mm |
120 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
AUTOMOTIVE |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T32 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
70 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
AUTOMOTIVE |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
150 ns |
12.75 |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
8388608 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
70 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
R-GDIP-T32 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
100 ns |
|||||||||
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
105 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.71 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
100 ns |
||||||||||||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
42 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
1048576 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP42,.6 |
8 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T42 |
5.25 V |
5.71 mm |
15.24 mm |
Not Qualified |
16777216 bit |
4.75 V |
e3 |
.0001 Amp |
54.635 mm |
50 ns |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
200 ns |
|||||||||
STMicroelectronics |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
35 mA |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE |
DIP40,.6 |
EPROMs |
2.54 mm |
105 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T40 |
Not Qualified |
1048576 bit |
e0 |
.0001 Amp |
60 ns |
|||||||||||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
36.92 mm |
70 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-GDIP-T40 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
52.195 mm |
45 ns |
|||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
2.8 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
100 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
MATTE TIN |
QUAD |
S-CQCC-J44 |
5.25 V |
4.83 mm |
16.51 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
16.51 mm |
200 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
GOLD |
QUAD |
R-CQCC-N32 |
5.25 V |
2.28 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.75 V |
e4 |
.0001 Amp |
13.97 mm |
45 ns |
EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.
EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.
EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.