Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
65 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
1KX9 |
1K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
15.4 MHz |
11.455 mm |
Not Qualified |
9216 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.002 Amp |
13.995 mm |
50 ns |
||||||||
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
35 ns |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
512 words |
5 |
5 |
9 |
CHIP CARRIER |
LDCC32,.5X.6 |
FIFOs |
1.27 mm |
70 Cel |
3-STATE |
512X9 |
512 |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
28.57 MHz |
11.455 mm |
Not Qualified |
4608 bit |
4.5 V |
RETRANSMIT |
e0 |
NO |
.012 Amp |
13.995 mm |
25 ns |
||||||||
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
2KX9 |
2K |
0 Cel |
DUAL |
R-PDIP-T28 |
10 MHz |
Not Qualified |
18432 bit |
.012 Amp |
80 ns |
|||||||||||||||||||||
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
512X9 |
512 |
0 Cel |
DUAL |
R-PDIP-T28 |
7.14 MHz |
Not Qualified |
.0005 Amp |
120 ns |
||||||||||||||||||||||
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
80 mA |
512 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
512X9 |
512 |
0 Cel |
DUAL |
R-PDIP-T28 |
5.71 MHz |
Not Qualified |
.0005 Amp |
150 ns |
||||||||||||||||||||||
STMicroelectronics |
OTHER FIFO |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
120 mA |
2048 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
70 Cel |
2KX9 |
2K |
0 Cel |
DUAL |
R-PDIP-T28 |
12.5 MHz |
Not Qualified |
18432 bit |
.012 Amp |
65 ns |
|||||||||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
116.28 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
2.65 mm |
10 MHz |
7.5 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
30 |
260 |
YES |
17.9 mm |
117 ns |
||||||
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
12 MHz |
Not Qualified |
320 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
108 ns |
||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
116.28 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
2.65 mm |
10 MHz |
7.5 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
260 |
YES |
17.9 mm |
117 ns |
|||||||
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
5 |
SMALL OUTLINE |
SOP20,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-40 Cel |
DUAL |
R-PDSO-G20 |
6 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
320 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
12.8 mm |
98 ns |
|||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
98 ns |
|||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
12 MHz |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
108 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
116.28 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
2.65 mm |
10 MHz |
7.5 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
260 |
YES |
17.9 mm |
117 ns |
|||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
108.7 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
9.2 MHz |
7.5 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
30 |
260 |
YES |
17.9 mm |
104 ns |
|||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
12 MHz |
7.62 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
98 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
12 MHz |
7.62 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
98 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
31 MHz |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
21.6 mm |
120 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
108.7 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
6 V |
5.1 mm |
9.2 MHz |
15.24 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e3 |
YES |
35.5 mm |
104 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
108.7 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
9.2 MHz |
7.5 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
30 |
260 |
YES |
17.9 mm |
104 ns |
|||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
2 |
5.5 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
30 |
260 |
YES |
10.3 mm |
108 ns |
|||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.1 mm |
33 MHz |
4.4 mm |
Not Qualified |
64 bit |
2 V |
e4 |
30 |
260 |
YES |
5 mm |
600 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
108.7 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
TIN SILVER |
DUAL |
R-PDIP-T28 |
6 V |
5.1 mm |
9.2 MHz |
15.24 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e2 |
YES |
35.5 mm |
104 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
14 MHz |
3.9 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
30 |
260 |
YES |
9.9 mm |
600 ns |
||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
108 ns |
|||||||
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
5 |
IN-LINE |
DIP18,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-40 Cel |
DUAL |
R-PDIP-T18 |
6 V |
12 MHz |
Not Qualified |
320 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
98 ns |
||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
6 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
98 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
116.28 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
TIN SILVER |
DUAL |
R-PDIP-T28 |
5.5 V |
5.1 mm |
10 MHz |
15.24 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e2 |
YES |
35.5 mm |
117 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
108 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
2 |
6 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
30 |
260 |
YES |
10.3 mm |
98 ns |
|||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
31 MHz |
3.9 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
9.9 mm |
120 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
31 MHz |
5.3 mm |
Not Qualified |
64 bit |
4.5 V |
e4 |
30 |
260 |
YES |
6.2 mm |
120 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
31 MHz |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
21.6 mm |
120 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2 mm |
33 MHz |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e4 |
30 |
260 |
YES |
6.2 mm |
600 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
AEC-Q100 |
GULL WING |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
12 MHz |
Not Qualified |
108 ns |
|||||||||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
108.7 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
9.2 MHz |
7.5 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
30 |
260 |
YES |
17.9 mm |
104 ns |
|||||
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
5 |
IN-LINE |
DIP18,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X5 |
64 |
-40 Cel |
DUAL |
R-PDIP-T18 |
5.5 V |
12 MHz |
Not Qualified |
320 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
108 ns |
||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
31 MHz |
5.3 mm |
Not Qualified |
64 bit |
4.5 V |
e4 |
30 |
260 |
YES |
6.2 mm |
120 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
116.28 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
IN-LINE |
DIP28,.6 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
5.1 mm |
10 MHz |
15.24 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e3 |
YES |
35.5 mm |
117 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
31 MHz |
3.9 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
30 |
260 |
YES |
9.9 mm |
120 ns |
||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
12 MHz |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
108 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
116.28 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
2.65 mm |
10 MHz |
7.5 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
260 |
YES |
17.9 mm |
117 ns |
|||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP16,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
108 ns |
|||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
108.7 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
9.2 MHz |
7.5 mm |
Not Qualified |
576 bit |
2 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
30 |
260 |
YES |
17.9 mm |
104 ns |
|||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
AEC-Q100 |
GULL WING |
ASYNCHRONOUS |
1 mA |
64 words |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 |
12 MHz |
Not Qualified |
30 |
260 |
98 ns |
|||||||||||||||||||
|
Infineon Technologies |
OTHER FIFO |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
SYNCHRONOUS |
500 mA |
1048576 words |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
FIFOs |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B209 |
3 |
100 MHz |
Not Qualified |
37748736 bit |
e1 |
10 ns |
|||||||||||||||||||
|
Infineon Technologies |
OTHER FIFO |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
41.67 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
524288 words |
1.5 |
1.5,1.8,3.3 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
FIFOs |
1 mm |
85 Cel |
512KX36 |
512K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B209 |
3 |
1.575 V |
1.96 mm |
100 MHz |
14 mm |
Not Qualified |
18874368 bit |
1.425 V |
ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32 |
e1 |
YES |
22 mm |
10 ns |
||||||||
|
Infineon Technologies |
OTHER FIFO |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
SYNCHRONOUS |
500 mA |
1048576 words |
1.8 |
1.8 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
FIFOs |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B209 |
3 |
100 MHz |
Not Qualified |
37748736 bit |
e1 |
10 ns |
|||||||||||||||||||
|
Infineon Technologies |
OTHER FIFO |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
41.67 ns |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
2097152 words |
1.5 |
1.5,1.8,3.3 |
36 |
GRID ARRAY |
BGA209,11X19,40 |
FIFOs |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B209 |
3 |
1.575 V |
1.96 mm |
100 MHz |
14 mm |
Not Qualified |
75497472 bit |
1.425 V |
ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32 |
e1 |
YES |
22 mm |
10 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.