SSOP FIFO 112

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Length	Maximum Access Time
74HC7030DB	NXP Semiconductors		AUTOMOTIVE	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		9	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	64X9	64	-40 Cel		DUAL	R-PDSO-G28		6 V	2 mm		5.3 mm	Not Qualified	576 bit	2 V					YES	10.2 mm
74HCT40105DB-T	NXP Semiconductors		AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5		4	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	16X4	16	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	5.5 V	2 mm		5.3 mm	Not Qualified	64 bit	4.5 V		e4			YES	6.2 mm	120 ns
74HC40105DB-T	NXP Semiconductors		AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5		4	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	16X4	16	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2 mm		5.3 mm	Not Qualified	64 bit	2 V		e4			YES	6.2 mm	600 ns
74HCT7030DB-T	NXP Semiconductors		AUTOMOTIVE	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		9	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	64X9	64	-40 Cel		DUAL	R-PDSO-G28		5.5 V	2 mm		5.3 mm	Not Qualified	576 bit	4.5 V					YES	10.2 mm
74HC40105DB,118	NXP Semiconductors		AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5		4	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	2 mm		5.3 mm	Not Qualified	64 bit	2 V		e4	30	260	YES	6.2 mm	600 ns
74HCT40105DB	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5	5	4	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	FIFOs	.65 mm	125 Cel	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	5.5 V	2 mm	31 MHz	5.3 mm	Not Qualified	64 bit	4.5 V		e4	30	260	YES	6.2 mm	120 ns
74HC7030DB-T	NXP Semiconductors		AUTOMOTIVE	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		9	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	64X9	64	-40 Cel		DUAL	R-PDSO-G28		6 V	2 mm		5.3 mm	Not Qualified	576 bit	2 V					YES	10.2 mm
74HC40105DB	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	FIFOs	.65 mm	125 Cel	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	2 mm	33 MHz	5.3 mm	Not Qualified	64 bit	2 V		e4	30	260	YES	6.2 mm	600 ns
74HCT40105DB,112	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5	5	4	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	FIFOs	.65 mm	125 Cel	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	5.5 V	2 mm	31 MHz	5.3 mm	Not Qualified	64 bit	4.5 V		e4	30	260	YES	6.2 mm	120 ns
74HCT40105DB,118	NXP Semiconductors		AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5		4	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	5.5 V	2 mm		5.3 mm	Not Qualified	64 bit	4.5 V		e4	30	260	YES	6.2 mm	120 ns
74HCT7030DB	NXP Semiconductors		AUTOMOTIVE	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		9	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel	64X9	64	-40 Cel		DUAL	R-PDSO-G28		5.5 V	2 mm		5.3 mm	Not Qualified	576 bit	4.5 V					YES	10.2 mm
M66282FP	Renesas Electronics		COMMERCIAL	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	70 mA	8192 words	3.15	3.15	8	SMALL OUTLINE, SHRINK PITCH	SOP24,.3,32	Other Memory ICs	.8 mm	70 Cel	8KX8	8K	0 Cel		DUAL	R-PDSO-G24		3.6 V	2.1 mm		5.3 mm	Not Qualified	65536 bit	2.7 V					NO	10.1 mm	18 ns
M66256FP	Renesas Electronics		COMMERCIAL	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	80 mA	5120 words	5	5	8	SMALL OUTLINE, SHRINK PITCH	SOP24,.4,32	Other Memory ICs	.8 mm	70 Cel	5KX8	5K	0 Cel		DUAL	R-PDSO-G24		5.5 V	2.65 mm		7.5 mm	Not Qualified	40960 bit	4.5 V	LINE MEMORY				NO	10.3 mm	18 ns
M66257FP	Renesas Electronics		COMMERCIAL	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	120 mA	5120 words	5	5	8	SMALL OUTLINE, SHRINK PITCH	SOP36,.47,32	Other Memory ICs	.8 mm	70 Cel	5KX8	5K	0 Cel		DUAL	R-PDSO-G36		5.5 V	2.4 mm		8.4 mm	Not Qualified	40960 bit	4.5 V	LINE MEMORY				NO	15 mm	18 ns
M66280FP	Renesas Electronics		COMMERCIAL	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	70 mA	5120 words	3.15	3.15	8	SMALL OUTLINE, SHRINK PITCH	SOP24,.3,32	Other Memory ICs	.8 mm	70 Cel	5KX8	5K	0 Cel		DUAL	R-PDSO-G24		3.6 V	2.1 mm		5.3 mm	Not Qualified	40960 bit	2.7 V	LINE MEMORY				NO	10.1 mm	18 ns
M66258FP	Renesas Electronics		COMMERCIAL	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	150 mA	8192 words	5	5	8	SMALL OUTLINE, SHRINK PITCH	SOP24,.4,32	Other Memory ICs	.8 mm	70 Cel	8KX8	8K	0 Cel		DUAL	R-PDSO-G24		5.5 V	2.65 mm		7.5 mm	Not Qualified	65536 bit	4.5 V	LINE MEMORY				NO	10.3 mm	16 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.