AUTOMOTIVE FIFO 214

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
74HC7403D,112	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE			1.27 mm	125 Cel		64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		6 V	2.65 mm		7.5 mm		256 bit	2 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	98 ns
74HC40105PW-T	NXP Semiconductors		AUTOMOTIVE	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5		4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		16X4	16	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	1.1 mm		4.4 mm	Not Qualified	64 bit	2 V		e4			YES		5 mm	600 ns
74HCT7404PW-T	NXP Semiconductors		AUTOMOTIVE	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		5	SMALL OUTLINE				125 Cel		64X5	64	-40 Cel		DUAL	R-PDSO-G20		5.5 V				Not Qualified	320 bit	4.5 V					YES
74HC7403D-T	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE			1.27 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2.65 mm		7.5 mm	Not Qualified	256 bit	2 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	98 ns
74HCT40105D	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5	5	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel	3-STATE	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	5.5 V	1.75 mm	31 MHz	3.9 mm	Not Qualified	64 bit	4.5 V	REGISTER BASED; BUBBLE BACK 750NS	e4	30	260	YES		9.9 mm	120 ns
74HCT40105D,118	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	100 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		16 words	5		4	SMALL OUTLINE			1.27 mm	125 Cel	3-STATE	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	5.5 V	1.75 mm		3.9 mm	Not Qualified	64 bit	4.5 V	REGISTER BASED; BUBBLE BACK 750NS	e4	30	260	YES		9.9 mm	120 ns
74HCT7404DB	NXP Semiconductors		AUTOMOTIVE	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		5	SMALL OUTLINE				125 Cel		64X5	64	-40 Cel		DUAL	R-PDSO-G20		5.5 V				Not Qualified	320 bit	4.5 V					YES
74HCT7403N	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	83.33 ns	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	5	4	IN-LINE	DIP16,.3	FIFOs	2.54 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		5.5 V	4.7 mm	12 MHz	7.62 mm	Not Qualified	256 bit	4.5 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		21.6 mm	108 ns
74HC7403DB	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE				125 Cel		64X4	64	-40 Cel		DUAL	R-PDSO-G16		6 V				Not Qualified	256 bit	2 V					YES
74HCT7030D-T	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	116.28 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5	5	9	SMALL OUTLINE	SOP28,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X9	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	1	5.5 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	576 bit	4.5 V	REGISTER BASED; BUBBLE BACK 3US	e4		260	YES		17.9 mm	117 ns
74HCT7403D,512	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	5	4	SMALL OUTLINE	SOP16,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	5.5 V	2.65 mm	12 MHz	7.5 mm	Not Qualified	256 bit	4.5 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	108 ns
74HC7030NB	NXP Semiconductors		AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	108.7 ns	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		64 words	5		9	IN-LINE			2.54 mm	125 Cel	3-STATE	64X9	64	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		6 V	5.08 mm		15.24 mm	Not Qualified	576 bit	2 V	REGISTER BASED; BUBBLE BACK 3US	e3/e4			YES		36.51 mm	104 ns
74HC7030D,652	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	108.7 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	2/6	9	SMALL OUTLINE	SOP28,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X9	64	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G28	1	6 V	2.65 mm	9.2 MHz	7.5 mm	Not Qualified	576 bit	2 V	REGISTER BASED; BUBBLE BACK 3US	e4	30	260	YES		17.9 mm	104 ns
74HC7403D-Q100,518	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	AEC-Q100	GULL WING		ASYNCHRONOUS	1 mA	64 words		2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel		64X4	64	-40 Cel		DUAL	R-PDSO-G16	2			12 MHz		Not Qualified					30	260				98 ns
74HCT7030D	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	116.28 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5	5	9	SMALL OUTLINE	SOP28,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X9	64	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G28	1	5.5 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	576 bit	4.5 V	REGISTER BASED; BUBBLE BACK 3US	e4	30	260	YES		17.9 mm	117 ns
74HCT7403DB	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE				125 Cel		64X4	64	-40 Cel		DUAL	R-PDSO-G16		5.5 V				Not Qualified	256 bit	4.5 V					YES
74HCT7404D	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	5	5	SMALL OUTLINE	SOP20,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X5	64	-40 Cel		DUAL	R-PDSO-G20		5.5 V		12 MHz		Not Qualified	320 bit	4.5 V	REGISTER BASED; BUBBLE BACK 2.7US				YES			108 ns
74HC7404PW-T	NXP Semiconductors		AUTOMOTIVE	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		5	SMALL OUTLINE				125 Cel		64X5	64	-40 Cel		DUAL	R-PDSO-G20		6 V				Not Qualified	320 bit	2 V					YES
74HCT7030D,112	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	116.28 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5	5	9	SMALL OUTLINE	SOP28,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X9	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	1	5.5 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	576 bit	4.5 V	REGISTER BASED; BUBBLE BACK 3US	e4		260	YES		17.9 mm	117 ns
74HC7403PW	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE				125 Cel		64X4	64	-40 Cel		DUAL	R-PDSO-G16		6 V				Not Qualified	256 bit	2 V					YES
74HCT7403D-T	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE			1.27 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	5.5 V	2.65 mm		7.5 mm	Not Qualified	256 bit	4.5 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	108 ns
74HC7403DB-T	NXP Semiconductors		AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		4	SMALL OUTLINE				125 Cel		64X4	64	-40 Cel		DUAL	R-PDSO-G16		6 V				Not Qualified	256 bit	2 V					YES
74HC7404D	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	2/6	5	SMALL OUTLINE	SOP20,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X5	64	-40 Cel		DUAL	R-PDSO-G20		6 V	2.65 mm	12 MHz	7.5 mm	Not Qualified	320 bit	2 V	REGISTER BASED; BUBBLE BACK 2.7US				YES		12.8 mm	98 ns
74HCT7030DB	NXP Semiconductors		AUTOMOTIVE	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		64 words	5		9	SMALL OUTLINE, SHRINK PITCH			.65 mm	125 Cel		64X9	64	-40 Cel		DUAL	R-PDSO-G28		5.5 V	2 mm		5.3 mm	Not Qualified	576 bit	4.5 V					YES		10.2 mm
74HC7403D,518	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2.65 mm	12 MHz	7.5 mm	Not Qualified	256 bit	2 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	98 ns
74HCT7030NB	NXP Semiconductors		AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	116.28 ns	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		64 words	5		9	IN-LINE			2.54 mm	125 Cel	3-STATE	64X9	64	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.5 V	5.08 mm		15.24 mm	Not Qualified	576 bit	4.5 V	REGISTER BASED; BUBBLE BACK 3US	e3/e4			YES		36.51 mm	117 ns
MT52C9007EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS		J BEND		ASYNCHRONOUS	120 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	25 ns
MT52C4K9A1-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS		THROUGH-HOLE		ASYNCHRONOUS	120 mA	4096 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		4KX9	4K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	4.32 mm	22.2 MHz	7.62 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	36.83 mm	35 ns
MT52C9020EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS		J BEND		ASYNCHRONOUS		2048 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0			NO		13.97 mm	25 ns
MT53C51218A1EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			CMOS		J BEND		SYNCHRONOUS	200 mA	512 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ	FIFOs	1.27 mm	125 Cel		512X18	512	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68				28.6 MHz		Not Qualified	9216 bit			e0				.005 Amp		35 ns
MT52C9022EJ-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS		J BEND		ASYNCHRONOUS	140 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				33.3 MHz		Not Qualified	18432 bit			e0				.005 Amp		15 ns
MT52C9007EJ-20ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS		J BEND		ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0			NO		13.97 mm	20 ns
MT52C9007-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS		THROUGH-HOLE		ASYNCHRONOUS	130 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	4.32 mm		7.62 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	36.83 mm	20 ns
MT52C9012EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS		J BEND		ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0			NO		13.97 mm	25 ns
MT52C4K9A1EJ15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS		J BEND		ASYNCHRONOUS	150 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		4KX9	4K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				40 MHz		Not Qualified	36864 bit			e0				.005 Amp		15 ns
MT52C9005-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS		THROUGH-HOLE		ASYNCHRONOUS	140 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		512X9	512	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28						Not Qualified				e0				.005 Amp		15 ns
MT52C9012EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS		J BEND		ASYNCHRONOUS	120 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	25 ns
MT52C8K9B2-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS		THROUGH-HOLE		ASYNCHRONOUS	150 mA	8192 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		8KX9	8K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				40 MHz		Not Qualified	73728 bit			e0				.005 Amp		15 ns
MT52C9007-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS		THROUGH-HOLE		ASYNCHRONOUS	110 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	4.32 mm		7.62 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	36.83 mm	35 ns
MT52C8K9B2EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS		J BEND		ASYNCHRONOUS	130 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	25 ns
MT52C9020EJ15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS		J BEND		ASYNCHRONOUS	140 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				40 MHz		Not Qualified	18432 bit			e0				.005 Amp		15 ns
MT52C9022EJ-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS		J BEND		ASYNCHRONOUS	130 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm	40 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	20 ns
MT52C8K9B2EJ-20ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS		J BEND		ASYNCHRONOUS		8192 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0			NO		13.97 mm	20 ns
MT53C51218A1EJ-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			CMOS		J BEND		SYNCHRONOUS	200 mA	512 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ	FIFOs	1.27 mm	125 Cel		512X18	512	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68				66.7 MHz		Not Qualified	9216 bit			e0				.005 Amp		15 ns
MT53C51218A1EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			CMOS		J BEND		SYNCHRONOUS	200 mA	512 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ	FIFOs	1.27 mm	125 Cel		512X18	512	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68				40 MHz		Not Qualified	9216 bit			e0				.005 Amp		25 ns
MT52C9007EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS		J BEND		ASYNCHRONOUS	110 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	35 ns
MT52C9010-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS		THROUGH-HOLE		ASYNCHRONOUS	110 mA	1024 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	4.32 mm	22.2 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	36.83 mm	35 ns
MT52C8K9B2EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS		J BEND		ASYNCHRONOUS	120 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0			NO	.005 Amp	13.97 mm	35 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.