AUTOMOTIVE FIFO 214

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Output Enable	Maximum Standby Current	Length	Maximum Access Time
MT52C9012-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	130 mA	1024 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	33.3 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	20 ns
MT52C4K9A1EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	ASYNCHRONOUS		4096 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	4KX9	4K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	25 ns
MT52C9022EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS	110 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9012EJ-35ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	35 ns
MT52C9005EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	25 ns
MT52C8K9B2-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	140 mA	8192 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	8KX9	8K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	33.3 MHz	7.62 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	20 ns
MT52C4K9A1EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	ASYNCHRONOUS	130 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	4KX9	4K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	25 ns
MT52C9020-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	35 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	120 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	2KX9	2K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	28.5 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	25 ns
MT52C9007EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	25 ns
MT52C9010EJ15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND	ASYNCHRONOUS	140 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	1KX9	1K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32			40 MHz		Not Qualified	9216 bit			e0		.005 Amp		15 ns
MT52C9012-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	35 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	120 mA	1024 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	28.5 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	25 ns
MT52C9005-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	110 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm		7.62 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	35 ns
MT52C9010EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS	110 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C8K9B2EJ-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	ASYNCHRONOUS	140 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	33.3 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	20 ns
MT52C9020EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS	110 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9005EJ-35ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	35 ns
MT52C9007EJ-35ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	35 ns
MT52C9020EJ-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	ASYNCHRONOUS	130 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	33.3 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	20 ns
MT52C9005EJ-20ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT52C9022-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE	ASYNCHRONOUS	140 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	2KX9	2K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28			40 MHz		Not Qualified	18432 bit			e0		.005 Amp		15 ns
MT52C9020-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS	THROUGH-HOLE	ASYNCHRONOUS	130 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel	2KX9	2K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	33.3 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	20 ns
MT52C9005EJ-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	ASYNCHRONOUS	110 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel	512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.