INDUSTRIAL FIFO 1,726

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
IDT72245LB25JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	60 mA	4096 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ		FIFOs	1.27 mm	85 Cel		4KX18	4K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-J68	1	5.5 V	4.572 mm	40 MHz	24.2062 mm	Not Qualified	73728 bit	4.5 V		e3	30	260	YES	.005 Amp	24.2062 mm	15 ns
72V85L20PAGI8	Renesas Electronics		INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		8192 words	3.3		9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel		8KX9	8K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G56		3.6 V	1.2 mm		6.1 mm		73728 bit	3 V	RETRANSMIT	e3			NO		14 mm	20 ns
IDT72T18115L5BBGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	70 mA	262144 words	2.5	2.5	18	GRID ARRAY	BGA240,18X18,40	9	FIFOs	1 mm	85 Cel		256KX18	256K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B240	3	2.625 V	1.97 mm	83 MHz	19 mm	Not Qualified	4718592 bit	2.375 V	ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE	e1			YES	.06 Amp	19 mm	3.6 ns
IDT72V3640L39268PFGI	Renesas Electronics		INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		1024 words	3.3		36	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		1KX36	1K	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.45 V	1.6 mm		14 mm	Not Qualified	36864 bit	3.15 V		e3			YES		20 mm	5 ns
72V3670L7-5BBI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	40 mA	8192 words	3.3	3.3	36	GRID ARRAY	BGA144,12X12,40		FIFOs	1 mm	85 Cel		8KX36	8K	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	3.45 V	1.97 mm	133.3 MHz	13 mm	Not Qualified	294912 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e0	30	225	YES	.015 Amp	13 mm	5 ns
IDT72221L15PFGI8	Renesas Electronics		INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		1024 words	5		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		1KX9	1K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	3	5.5 V	1.6 mm		7 mm	Not Qualified	9216 bit	4.5 V		e3			YES		7 mm	10 ns
IDT7285L15PAGI8	Renesas Electronics		INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		8192 words	5		9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel		8KX9	8K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm		6.1 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e3	40	260	NO		14 mm	15 ns
IDT7202LA25LGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCN	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	35 ns	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	CHIP CARRIER	LCC32,.45X.55		FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	MATTE TIN	QUAD	R-CQCC-N32		5.5 V	3.048 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3			NO	.005 Amp	13.97 mm	25 ns
7204L15TDGI	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	25 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	120 mA	4096 words	5	5	9	IN-LINE			FIFOs		85 Cel	3-STATE	4KX9	4K	-40 Cel	MATTE TIN	DUAL	R-GDIP-T28		5.5 V		40 MHz		Not Qualified	36864 bit	4.5 V		e3			NO	.012 Amp		15 ns
IDT72131L35P	Renesas Electronics	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	20 ns	1	CMOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS	140 mA	2048 words	5	5	9	IN-LINE	DIP28,.6		FIFOs	2.54 mm	85 Cel	3-STATE	2KX9	2K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.5 V	4.699 mm	22.2 MHz	15.24 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	240	NO	.002 Amp	36.576 mm	35 ns
7202LA15TPGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	25 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	IN-LINE	DIP28,.3		FIFOs	2.54 mm	85 Cel		1KX9	1K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28		5.5 V	4.572 mm	40 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3			NO	.005 Amp	34.671 mm	15 ns
IDT72281L20PFGI8	Renesas Electronics		INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		65536 words	5		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		64KX9	64K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm		14 mm	Not Qualified	589824 bit	4.5 V	RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH	e3	40	260	YES		14 mm	12 ns
IDT7205L25JGI8	Renesas Electronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		8192 words	5		9	CHIP CARRIER				1.27 mm	85 Cel		8KX9	8K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.5 V	3.55 mm		11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e3			NO		13.97 mm	25 ns
72V273L7-5BCGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	35 mA	16384 words	3.3	3.3	18	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	9	FIFOs	1 mm	85 Cel		16KX18	16K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	3.45 V	1.5 mm	133.3 MHz	11 mm	Not Qualified	294912 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e1	30	260	YES	.015 Amp	11 mm	5 ns
IDT7200L25TDI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	35 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	80 mA	256 words	5	5	9	IN-LINE	DIP28,.3		FIFOs	2.54 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	DUAL	R-GDIP-T28		5.5 V	5.08 mm	28.5 MHz	7.62 mm	Not Qualified	2304 bit	4.5 V		e0			NO	.005 Amp	37.1475 mm	25 ns
72V223L7-5PFGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	35 mA	512 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP80,.64SQ	9	FIFOs	.65 mm	85 Cel		512X18	512	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G80	3	3.45 V	1.6 mm	133.3 MHz	14 mm	Not Qualified	9216 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 1K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e3	30	260	YES	.015 Amp	14 mm	5 ns
IDT72V14081L15PFGI	Renesas Electronics		INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		8	FLATPACK, LOW PROFILE				.8 mm	85 Cel		4KX8	4K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm	Not Qualified	32768 bit	3 V		e3			YES		7 mm	10 ns
IDT7204L15JGI8	Renesas Electronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		4096 words	5		9	CHIP CARRIER				1.27 mm	85 Cel		4KX9	4K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.5 V	3.55 mm		11.43 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e3			NO		13.97 mm	15 ns
IDT72V273L39268BCGI	Renesas Electronics		INDUSTRIAL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS		16384 words	3.3		18	GRID ARRAY, LOW PROFILE				1 mm	85 Cel		16KX18	16K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	3.45 V	1.5 mm		11 mm	Not Qualified	294912 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 32K X 9	e1			YES		11 mm	5 ns
7201LA25LGI	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	32	QCCN	RECTANGULAR	UNSPECIFIED	YES	35 ns	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5	5	9	CHIP CARRIER	LCC32,.45X.55		FIFOs	1.27 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	QUAD	R-XQCC-N32		5.5 V		28.5 MHz		Not Qualified	4608 bit	4.5 V		e3			NO	.005 Amp		25 ns
72V3670L7-5PFGI8	Renesas Electronics		INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		8192 words	3.3		36	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		8KX36	8K	-40 Cel		QUAD	R-PQFP-G128		3.45 V	1.6 mm		14 mm		294912 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE		NOT SPECIFIED	NOT SPECIFIED	YES		20 mm	5 ns
IDT72245LB15PFGI8	Renesas Electronics		INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	5		18	FLATPACK, LOW PROFILE				.8 mm	85 Cel		4KX18	4K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm		14 mm	Not Qualified	73728 bit	4.5 V		e3	40	260	YES		14 mm	10 ns
IDT72811L15TFGI8	Renesas Electronics		INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		512 words	5		9	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		5.5 V	1.6 mm		10 mm	Not Qualified	4608 bit	4.5 V		e3			YES		10 mm	10 ns
IDT7201LA15SOGI	Renesas Electronics		INDUSTRIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		512 words	5		9	SMALL OUTLINE				1.27 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	5.5 V	3.048 mm		8.763 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e3	40	260	NO		18.3642 mm	15 ns
IDT7202LA20TPI	Renesas Electronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1024 words	5		9	IN-LINE				2.54 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.5 V	4.57 mm		7.62 mm	Not Qualified	9216 bit	4.5 V		e0			NO		34.67 mm	20 ns
72V201L15JGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		256 words	3.3		9	CHIP CARRIER				1.27 mm	85 Cel		256X9	256	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.556 mm		11.4554 mm		2304 bit	3 V		e3	30	260	YES		13.9954 mm	10 ns
IDT72V243L39268PFGI	Renesas Electronics		INDUSTRIAL	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		2048 words	3.3		18	FLATPACK, LOW PROFILE				.65 mm	85 Cel		2KX18	2K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	3.45 V	1.6 mm		14 mm	Not Qualified	36864 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 4K X 9	e3			YES		14 mm	5 ns
IDT72215LB25JGI8	Renesas Electronics		INDUSTRIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		512 words	5		18	CHIP CARRIER				1.27 mm	85 Cel		512X18	512	-40 Cel	MATTE TIN	QUAD	S-PQCC-J68		5.5 V	4.572 mm		24.2062 mm	Not Qualified	9216 bit	4.5 V		e3			YES		24.2062 mm	15 ns
IDT72V273L7-5BCGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	100	BGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	35 mA	16384 words	3.3	3.3	18	GRID ARRAY	BGA100,10X10,40	9	FIFOs	1 mm	85 Cel		16KX18	16K	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B100	3	3.45 V	1.5 mm	133.3 MHz	11 mm	Not Qualified	294912 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e1	30	260	YES	.015 Amp	11 mm	5 ns
IDT72V14165L15TFGI8	Renesas Electronics		INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		2048 words	3.3		16	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		2KX16	2K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		3.6 V	1.6 mm		10 mm	Not Qualified	32768 bit	3 V		e3			YES		10 mm	10 ns
IDT72201L15PFGI8	Renesas Electronics		INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		256 words	5		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		256X9	256	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	3	5.5 V	1.6 mm		7 mm	Not Qualified	2304 bit	4.5 V		e3			YES		7 mm	10 ns
72V3640L7-5BBGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	40 mA	1024 words	3.3	3.3	36	GRID ARRAY	BGA144,12X12,40		FIFOs	1 mm	85 Cel		1KX36	1K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	3.45 V	1.97 mm	133.3 MHz	13 mm	Not Qualified	36864 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e1	40	260	YES	.015 Amp	13 mm	5 ns
IDT72205LB15JGI8	Renesas Electronics		INDUSTRIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		256 words	5		18	CHIP CARRIER				1.27 mm	85 Cel		256X18	256	-40 Cel	MATTE TIN	QUAD	S-PQCC-J68		5.5 V	4.572 mm		24.2062 mm	Not Qualified	4608 bit	4.5 V		e3			YES		24.2062 mm	10 ns
72V3690L7-5BBGI8	Renesas Electronics		INDUSTRIAL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS		32768 words	3.3		36	GRID ARRAY				1 mm	85 Cel		32KX36	32K	-40 Cel		BOTTOM	S-PBGA-B144		3.45 V	1.97 mm		13 mm		1179648 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE		NOT SPECIFIED	NOT SPECIFIED	YES		13 mm	5 ns
IDT72V275L15PFGI	Renesas Electronics		INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		32768 words	3.3		18	FLATPACK, LOW PROFILE				.8 mm	85 Cel		32KX18	32K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm		14 mm	Not Qualified	589824 bit	3 V		e3	40	260	YES		14 mm	10 ns
IDT72V253L39268PFGI	Renesas Electronics		INDUSTRIAL	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		18	FLATPACK, LOW PROFILE				.65 mm	85 Cel		4KX18	4K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	3.45 V	1.6 mm		14 mm	Not Qualified	73728 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 8K X 9	e3			YES		14 mm	5 ns
IDT72T36135ML6BBGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	6 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	180 mA	524288 words	2.5	2.5	36	GRID ARRAY	BGA240,18X18,40		FIFOs	1 mm	85 Cel		512KX36	512K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B240	3	2.625 V	1.76 mm	166 MHz	19 mm	Not Qualified	18874368 bit	2.375 V		e1			YES	.14 Amp	19 mm	3.8 ns
IDT7280L15PAGI8	Renesas Electronics		INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		256 words	5		9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel		256X9	256	-40 Cel	MATTE TIN	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm		6.1 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT	e3	40	260	NO		14 mm	15 ns
IDT72V211L15JGI	Renesas Electronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		512 words	3.3		9	CHIP CARRIER				1.27 mm	85 Cel		512X9	512	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.556 mm		11.4554 mm	Not Qualified	4608 bit	3 V		e3	30	260	YES		13.9954 mm	10 ns
72V83L20PAGI8	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	100 mA	2048 words	3.3	3.3	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20		FIFOs	.5 mm	85 Cel		2KX9	2K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G56	1	3.6 V	1.2 mm	33.3 MHz	6.1 mm	Not Qualified	18432 bit	3 V	RETRANSMIT	e3	30	260	NO	.005 Amp	14 mm	20 ns
72V851L15PFGI	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	40 mA	8192 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.63SQ,32		FIFOs	.8 mm	85 Cel		8KX9	8K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	73728 bit	3 V		e3	30	260	YES	.01 Amp	14 mm	10 ns
IDT72265LA20TFGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	80 mA	16384 words	5	5	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		16KX18	16K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	50 MHz	10 mm	Not Qualified	294912 bit	4 V	RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH	e3	30	260	YES	.02 Amp	10 mm	12 ns
72V261LA15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16384 words	3.3		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		16KX9	16K	-40 Cel		QUAD	S-PQFP-G64		3.6 V	1.6 mm		14 mm		147456 bit	3 V	RETRANSMIT				YES		14 mm	10 ns
72V3640L7-5PFGI8	Renesas Electronics		INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		1024 words	3.3		36	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		1KX36	1K	-40 Cel		QUAD	R-PQFP-G128		3.45 V	1.6 mm		14 mm		36864 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE		NOT SPECIFIED	NOT SPECIFIED	YES		20 mm	5 ns
IDT72215LB25TFGI8	Renesas Electronics		INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		512 words	5		18	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		512X18	512	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm		10 mm	Not Qualified	9216 bit	4.5 V		e3			YES		10 mm	15 ns
IDT72V18320L10PFGI	Renesas Electronics		INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16384 words	3.3		32	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		16KX32	16K	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.45 V	1.6 mm		14 mm	Not Qualified	524288 bit	3.15 V		e3			YES		20 mm	6.5 ns
IDT72225LB15JGI8	Renesas Electronics		INDUSTRIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		1024 words	5		18	CHIP CARRIER				1.27 mm	85 Cel		1KX18	1K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J68		5.5 V	4.572 mm		24.2062 mm	Not Qualified	18432 bit	4.5 V		e3			YES		24.2062 mm	10 ns
IDT72235LB15TFGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	2048 words	5	5	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		2KX18	2K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	36864 bit	4.5 V		e3	40	260	YES	.005 Amp	10 mm	10 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.