INDUSTRIAL FIFO 1,726

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
IDT72V05L25JGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	75 mA	8192 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		8KX9	8K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	73728 bit	3 V		e3	30	260	NO	.005 Amp	13.97 mm	25 ns
72V05L25JGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		8192 words	3.3		9	CHIP CARRIER				1.27 mm	85 Cel		8KX9	8K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.55 mm		11.43 mm	Not Qualified	73728 bit	3 V		e3	30	260	NO		13.97 mm	25 ns
IDT72V05L25JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	75 mA	8192 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		8KX9	8K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	73728 bit	3 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	25 ns
72V05L25JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		8192 words	3.3		9	CHIP CARRIER				1.27 mm	85 Cel		8KX9	8K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	3.6 V	3.55 mm		11.43 mm	Not Qualified	73728 bit	3 V	RETRANSMIT	e3	30	260	NO		13.97 mm	25 ns
7201LA15SOGI8	Renesas Electronics		INDUSTRIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5		9	SMALL OUTLINE				1.27 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	5.5 V	3.048 mm		8.763 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e3		260	NO		18.3642 mm	15 ns
72V2111L15PFGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	524288 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.63SQ,32		FIFOs	.8 mm	85 Cel		512KX9	512K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.45 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	4718592 bit	3.15 V		e3	NOT SPECIFIED	260	YES	.02 Amp	14 mm	10 ns
7201LA15JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	15 ns
7201LA15JGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		512X9	512	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	15 ns
7202LA15JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	15 ns
7282L15PAI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20		FIFOs	.5 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm	40 MHz	6.1 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	240	NO	.015 Amp	14 mm	15 ns
IDT72801L15PFI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	10 ns
IDT72801L15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	10 ns
IDT7282L15PAI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20		FIFOs	.5 mm	85 Cel		1KX9	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm	40 MHz	6.1 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	240	NO	.015 Amp	14 mm	15 ns
72V2111L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	524288 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.63SQ,32		FIFOs	.8 mm	85 Cel		512KX9	512K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.45 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	4718592 bit	3.15 V		e3	NOT SPECIFIED	260	YES	.02 Amp	14 mm	10 ns
72V211L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		512 words	3.3		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		512X9	512	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm		4608 bit	3 V		e3	NOT SPECIFIED	260	YES		7 mm	10 ns
72V82L20PAGI8	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1024 words	3.3		9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G56		3.6 V	1.2 mm		6.1 mm		9216 bit	3 V	RETRANSMIT	e3	40	260	NO		14 mm	20 ns
NTE74HC40105	Nte Electronics	OTHER FIFO	INDUSTRIAL	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		1	CMOS	THROUGH-HOLE	PARALLEL	SYNCHRONOUS	50 mA	16 words	4.5		4	IN-LINE	DIP16,.3			2.54 mm	85 Cel	3-STATE	16X4	16	-40 Cel		DUAL	R-PDIP-T16		6 V	5.08 mm		7.62 mm		64 bit	2 V			NOT SPECIFIED	NOT SPECIFIED	YES		22 mm
7202LA25JGI8	Renesas Electronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5		9	CHIP CARRIER				1.27 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3	30	260	NO		13.97 mm	25 ns
72V241L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		4KX9	4K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm		36864 bit	3 V		e3	NOT SPECIFIED	260	YES		7 mm	10 ns
7203L15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
72V221L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	1024 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		FIFOs	.8 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm	66.7 MHz	7 mm	Not Qualified	9216 bit	3 V		e3	30	260	YES	.005 Amp	7 mm	10 ns
72V255LA15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		8192 words	3.3		18	FLATPACK, LOW PROFILE				.8 mm	85 Cel		8KX18	8K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm		14 mm	Not Qualified	147456 bit	3 V		e3	NOT SPECIFIED	260	YES		14 mm	10 ns
72V255LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		8KX18	8K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	147456 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V263L7-5BCGI8	Renesas Electronics		INDUSTRIAL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS		8192 words	3.3		18	GRID ARRAY, LOW PROFILE				1 mm	85 Cel		8KX18	8K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	3.45 V	1.5 mm		11 mm		147456 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e1		260	YES		11 mm	5 ns
72V265LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		16KX18	16K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	294912 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V265LA15TFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		16KX18	16K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	294912 bit	3 V		e3	30	260	YES	.02 Amp	10 mm	10 ns
IDT7203L15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
IDT72801L25TFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	40 MHz	10 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	10 mm	15 ns
IDT72T36135ML6BBI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	6 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS/ASYNCHRONOUS	180 mA	524288 words	2.5	2.5	36	GRID ARRAY	BGA240,18X18,40		FIFOs	1 mm	85 Cel		512KX36	512K	-40 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B240	3	2.625 V		166 MHz		Not Qualified	18874368 bit	2.375 V		e0	30	225	YES	.14 Amp		3.8 ns
IDT72V255LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		8KX18	8K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	147456 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
IDT72V265LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32		FIFOs	.8 mm	85 Cel		16KX18	16K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	294912 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
7202LA15JGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	15 ns
7203L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.97 mm	25 ns
7204L15SOGI	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	28		RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	120 mA	4096 words	5		9						85 Cel	3-STATE	4KX9	4K	-40 Cel	TIN	DUAL	R-PDSO-G28	3	5.5 V		40 MHz			36864 bit	4.5 V		e3		260	NO	.012 Amp		15 ns
72V265LA15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16384 words	3.3		18	FLATPACK, LOW PROFILE				.8 mm	85 Cel		16KX18	16K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm		14 mm	Not Qualified	294912 bit	3 V		e3	NOT SPECIFIED	260	YES		14 mm	10 ns
72V3680L7-5PFGI8	Renesas Electronics		INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16384 words	3.3		36	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		16KX36	16K	-40 Cel	TIN	QUAD	R-PQFP-G128	3	3.45 V	1.6 mm		14 mm		589824 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e3		260	YES		20 mm	5 ns
72V845L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		18	FLATPACK, LOW PROFILE, FINE PITCH				.5 mm	85 Cel		4KX18	4K	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.6 V	1.6 mm		14 mm		73728 bit	3 V		e3		260	YES		20 mm	10 ns
IDT7202LA25SOI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	SMALL OUTLINE	SOP28,.5		FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G28	3	5.5 V	3.048 mm	28.5 MHz	8.763 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	30	225	NO	.0005 Amp	18.3642 mm	25 ns
IDT7203L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.97 mm	25 ns
IDT72801L15TFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	10 mm	10 ns
IDT72801L25PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	270 mA	256 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.66SQ,32		FIFOs	.8 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	40 MHz	14 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	15 ns
IDT72V05L25JI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	8192 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		8KX9	8K	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	R-PQCC-J32	1	3.6 V	3.556 mm	28.5 MHz	11.4554 mm	Not Qualified	73728 bit	3 V		e0	20	225	NO	.005 Amp	13.9954 mm	25 ns
IDT72V05L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	8192 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		8KX9	8K	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	R-PQCC-J32	1	3.6 V	3.556 mm	28.5 MHz	11.4554 mm	Not Qualified	73728 bit	3 V		e0	20	225	NO	.005 Amp	13.9954 mm	25 ns
IDT72V2111L15PFGI8	Renesas Electronics		INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		524288 words	3.3		9	FLATPACK, LOW PROFILE				.8 mm	85 Cel		512KX9	512K	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	3.45 V	1.6 mm		14 mm	Not Qualified	4718592 bit	3.15 V		e3			YES		14 mm	10 ns
IDT72V243L7-5PFGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	80	QFP	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	35 mA	2048 words	3.3	3.3	18	FLATPACK	QFP80,.64SQ	9	FIFOs	.65 mm	85 Cel		2KX18	2K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G80	3	3.45 V	1.6 mm	133.3 MHz	14 mm	Not Qualified	36864 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 4K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e3	30	260	YES	.015 Amp	14 mm	5 ns
IDT72V265LA15TFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		FIFOs	.5 mm	85 Cel		16KX18	16K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	294912 bit	3 V		e3	30	260	YES	.02 Amp	10 mm	10 ns
7202LA25JGI	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.005 Amp	13.97 mm	25 ns
7205L15JGI	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6		FIFOs	1.27 mm	85 Cel	3-STATE	8KX9	8K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	73728 bit	4.5 V		e3	30	260	NO	.012 Amp	13.9954 mm	15 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.