Micron Technology FIFO 450

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Output Enable	Maximum Standby Current	Length	Maximum Access Time
MT52C9010-25IT	Micron Technology	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	35 ns	1	CMOS	THROUGH-HOLE		ASYNCHRONOUS	120 mA	1024 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	28.5 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	25 ns
MT52C9012EJ-25ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND		ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	25 ns
MT52C9020-35	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	110 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	22.2 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	35 ns
MT52C9007EJ-20TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT52C4K9A1EJ15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND		ASYNCHRONOUS	150 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		4KX9	4K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32			40 MHz		Not Qualified	36864 bit			e0		.005 Amp		15 ns
MT52C9020CW40	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE		ASYNCHRONOUS		2048 words	5	5	9	IN-LINE	DIP28,.6	FIFOs	2.54 mm	70 Cel		2KX9	2K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	18432 bit			e0				40 ns
MT52C9022-20IT	Micron Technology	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS	THROUGH-HOLE		ASYNCHRONOUS	130 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	33.3 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	20 ns
MT52C9022W-25	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	35 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	100 mA	2048 words	5	5	9	IN-LINE	DIP28,.6	FIFOs	2.54 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.57 mm	28.5 MHz	15.24 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	25 ns
MT52C9010EJ-35	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	110 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9022EJ-35IT	Micron Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND		ASYNCHRONOUS	110 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9012EJ-25	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	25 ns
MT52C9020DJ-15TR	Micron Technology		COMMERCIAL	28	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		2048 words	5		9	SMALL OUTLINE			1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDSO-J28	5.5 V	3.66 mm		7.67 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO		18.44 mm	15 ns
MT52C9005-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE		ASYNCHRONOUS	140 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		512X9	512	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified				e0		.005 Amp		15 ns
MT52C9020EJ-35IT	Micron Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND		ASYNCHRONOUS	110 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9012EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND		ASYNCHRONOUS	120 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	25 ns
MT52C9020EJ-15	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	140 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	40 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	15 ns
MT52C9020EJ-25TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		2048 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	25 ns
MT52C8K9B2-15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE		ASYNCHRONOUS	150 mA	8192 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		8KX9	8K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28			40 MHz		Not Qualified	73728 bit			e0		.005 Amp		15 ns
MT52C9012EJ-15TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	15 ns
MT52C9007-35AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS	THROUGH-HOLE		ASYNCHRONOUS	110 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	125 Cel		512X9	512	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm		7.62 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	35 ns
MT52C9012EJ-20TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT52C4K9A1EJ-15	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND		ASYNCHRONOUS	150 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		4KX9	4K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	40 MHz	11.43 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	15 ns
MT52C9020-15	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	25 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	140 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	40 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	15 ns
MT53C2K18C3EJ-25	Micron Technology	OTHER FIFO	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND		SYNCHRONOUS		2048 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ	FIFOs	1.27 mm	70 Cel		2KX18	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J68	5.5 V	5.08 mm	40 MHz	24.23 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	YES	.005 Amp	24.23 mm	25 ns
MT52C9007-35IT	Micron Technology	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS	THROUGH-HOLE		ASYNCHRONOUS	110 mA	512 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	85 Cel		512X9	512	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm		7.62 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	35 ns
MT52C9005EJ-20	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	130 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	33.33 MHz	11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	20 ns
MT52C8K9B2EJ-15TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND		ASYNCHRONOUS		8192 words	5		9	CHIP CARRIER			1.27 mm	70 Cel		8KX9	8K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	15 ns
MT53C2K18C3EJ-25TR	Micron Technology		COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND		SYNCHRONOUS		2048 words	5		18	CHIP CARRIER			1.27 mm	70 Cel		2KX18	2K	0 Cel	TIN LEAD	QUAD	S-PQCC-J68	5.5 V	5.08 mm		24.23 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	YES		24.23 mm
MT52C8K9B2EJ-25AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND		ASYNCHRONOUS	130 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	28.5 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	25 ns
MT52C9020EJ15IT	Micron Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND		ASYNCHRONOUS	140 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32			40 MHz		Not Qualified	18432 bit			e0		.005 Amp		15 ns
MT52C9012EJ-35IT	Micron Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND		ASYNCHRONOUS	110 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C8K9B2EJ-35IT	Micron Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND		ASYNCHRONOUS	120 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	22.2 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	35 ns
MT52C9020EJ15AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND		ASYNCHRONOUS	140 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		2KX9	2K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32			40 MHz		Not Qualified	18432 bit			e0		.005 Amp		15 ns
MT52C8K9B2EJ-15	Micron Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND		ASYNCHRONOUS	150 mA	8192 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		8KX9	8K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	40 MHz	11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	15 ns
MT52C9021-30	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE		ASYNCHRONOUS		2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	70 Cel		2KX9	2K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	18432 bit			e0				30 ns
MT52C9022EJ-20AT	Micron Technology	OTHER FIFO	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND		ASYNCHRONOUS	130 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	125 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm	40 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	13.97 mm	20 ns
MT52C8K9B2EJ-20ATTR	Micron Technology		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND		ASYNCHRONOUS		8192 words	5		9	CHIP CARRIER			1.27 mm	125 Cel		8KX9	8K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	73728 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT52C9022DJ-20TR	Micron Technology		COMMERCIAL	28	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		2048 words	5		9	SMALL OUTLINE			1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDSO-J28	5.5 V	3.66 mm		7.67 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO		18.44 mm	20 ns
MT52C9041-30	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS	THROUGH-HOLE		ASYNCHRONOUS		4096 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	70 Cel		4KX9	4K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified	36864 bit			e0				30 ns
MT52C9020-20	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	30 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	130 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.32 mm	33.3 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	20 ns
MT52C9007DJ-15	Micron Technology	OTHER FIFO	COMMERCIAL	28	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	512 words	5	5	9	SMALL OUTLINE	SOJ28,.34	FIFOs	1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	DUAL	R-PDSO-J28	5.5 V	3.66 mm	40 MHz	7.67 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	18.44 mm	15 ns
MT52C9010EJ-20ITTR	Micron Technology		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND		ASYNCHRONOUS		1024 words	5		9	CHIP CARRIER			1.27 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT52C4K9A1EJ-20ITTR	Micron Technology		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND		ASYNCHRONOUS		4096 words	5		9	CHIP CARRIER			1.27 mm	85 Cel		4KX9	4K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns
MT53C1K18B2EJ-15	Micron Technology	OTHER FIFO	COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND		SYNCHRONOUS	200 mA	1024 words	5	5	18	CHIP CARRIER	LDCC68,1.0SQ	FIFOs	1.27 mm	70 Cel		1KX18	1K	0 Cel	TIN LEAD	QUAD	S-PQCC-J68	5.5 V	5.08 mm	66.7 MHz	24.23 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	YES	.005 Amp	24.23 mm	15 ns
MT52C9022DJ-35	Micron Technology	OTHER FIFO	COMMERCIAL	28	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	100 mA	2048 words	5	5	9	SMALL OUTLINE	SOJ28,.34	FIFOs	1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	TIN LEAD	DUAL	R-PDSO-J28	5.5 V	3.66 mm	22.2 MHz	7.67 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	18.44 mm	35 ns
MT52C9005W-35	Micron Technology	OTHER FIFO	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	45 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	100 mA	512 words	5	5	9	IN-LINE	DIP28,.6	FIFOs	2.54 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V	4.57 mm	22.22 MHz	15.24 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO	.005 Amp	36.83 mm	35 ns
MT53C1K18B2EJ-20TR	Micron Technology		COMMERCIAL	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND		SYNCHRONOUS		1024 words	5		18	CHIP CARRIER			1.27 mm	70 Cel		1KX18	1K	0 Cel	TIN LEAD	QUAD	S-PQCC-J68	5.5 V	5.08 mm		24.23 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	YES		24.23 mm
MT52C9005EJ-20TR	Micron Technology		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.81 mm		11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	NO		13.97 mm	20 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.