Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
BOTTOM |
8388608 bit |
3 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
18.4 mm |
55 ns |
3 |
||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
TOP |
8388608 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
40 |
260 |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
16 |
GRID ARRAY |
8 |
85 Cel |
512KX16 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
3 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3.3 |
YES |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
TOP |
16777216 bit |
3 V |
TOP BOOT BLOCK |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
55 ns |
3 |
YES |
||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
40 |
260 |
NOR TYPE |
10 mm |
90 ns |
3 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
1.95 V |
1 mm |
6.15 mm |
Not Qualified |
TOP |
16777216 bit |
1.65 V |
TOP BOOT BLOCK |
NOR TYPE |
8.15 mm |
70 ns |
1.8 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
BOTTOM |
33554432 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
33554432 bit |
2.7 V |
8.15 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
8/16 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
8 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8K,64K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
16,126 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
105 Cel |
256MX8 |
256M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
2147483648 bit |
2.7 V |
e3 |
260 |
SLC NAND TYPE |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
1073741824 bit |
2.7 V |
18.4 mm |
3.3 |
|||||||||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
18 mA |
1048576 words |
3 |
NO |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.00002 Amp |
18.4 mm |
70 ns |
3 |
|||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
CONFG AS 128K X 16; USER SELECTABLE AS 5V OR 12V VPP; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.3 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
110 ns |
2.7 |
NO |
|||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
8 |
e3 |
NOR TYPE |
.00004 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
1K |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT-BLOCK |
e1 |
40 |
260 |
NOR TYPE |
.00005 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
|||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
1K |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
TOP BOOT BLOCK |
4 |
e1 |
40 |
260 |
NOR TYPE |
.00003 Amp |
8 mm |
YES |
90 ns |
3 |
YES |
|||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
262144 words |
3.3 |
YES |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
128 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
4194304 bit |
3 V |
e1 |
40 |
260 |
NOR TYPE |
.00002 Amp |
8 mm |
YES |
55 ns |
3.3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
NOR TYPE |
.00002 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
35 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
1K |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.71,20 |
Flash Memories |
.5 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
15 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e1 |
NOR TYPE |
.00005 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
0 Cel |
256 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
8388608 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
512KX16 |
512K |
0 Cel |
256 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
8388608 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
256 |
YES |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
8388608 bit |
2.7 V |
e1 |
NOR TYPE |
.00002 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
256 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
8388608 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
Texas Instruments |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
8388608 bit |
4.5 V |
CONFG AS 512K X 16; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
80 ns |
3 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
8388608 bit |
4.5 V |
10000 PROGRAM/ERASE CYCLES; TTL COMPATIBLE I/O; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
70 ns |
3 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4194304 bit |
2.7 V |
CAN ALSO BE CONFIGURED AS 256K X 16 |
NOR TYPE |
18.4 mm |
120 ns |
3 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
125 Cel |
128KX16 |
128K |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
2097152 bit |
4.5 V |
CAN BE PROGRAMMED AT 12V VPP; BOTTOM BOOT BLOCK |
NOR TYPE |
18.4 mm |
70 ns |
5 |
||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1,2,1,1 |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
10000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
10000 PROGRAM/ERASE CYCLES; CONFG AS 128K X 16; TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
8388608 bit |
2.7 V |
CONFG AS 512K X 16; USER SELECTABLE 5V VCC; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
120 ns |
3 |
|||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
CAN BE CONFG AS 256K X 16; TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
NO |
||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
524288 words |
3.3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
2.7 |
YES |
|||||||||||||||||||
Texas Instruments |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
60 mA |
524288 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
YES |
DUAL |
R-PDSO-G48 |
100000 Write/Erase Cycles |
Not Qualified |
TOP |
8388608 bit |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
120 ns |
YES |
||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
INDUSTRIAL |
48 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
8 |
GRID ARRAY |
85 Cel |
1MX8 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
CONFG AS 512K X 16; BOTTOM BOOT BLOCK |
NOR TYPE |
120 ns |
3 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
3.3 |
NO |
3.3/5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
1,2,1,3 |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY; BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
110 ns |
12 |
NO |
||||||||||||||||||
Texas Instruments |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
3 |
NO |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1,2,1,1 |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
2.7 V |
CAN BE CONFG AS 128K X 16; TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000008 Amp |
18.4 mm |
130 ns |
5 |
NO |
||||||||||||||||||
Texas Instruments |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
CONFG AS 512K X 16; USER SELECTABLE 5V VCC; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
120 ns |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.