Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-20 Cel |
64 |
YES |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,64K |
50 mA |
8388608 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G56 |
2 V |
1.2 mm |
14 mm |
Not Qualified |
TOP |
134217728 bit |
1.7 V |
8 |
e3 |
NOR TYPE |
.000055 Amp |
18.4 mm |
YES |
75 ns |
1.8 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
33554432 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
1 |
2 |
.5 mm |
105 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
268435456 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e3 |
NAND TYPE |
.0002 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
2097152 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.25 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
4.75 V |
CONFIGURABLE AS 1M X 16 |
16/32 |
e0 |
NOR TYPE |
.00002 Amp |
23.7 mm |
YES |
70 ns |
5 |
NO |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
TOP |
1073741824 bit |
2.3 V |
TOP BOOT; IT ALSO OPERATES IN ASYNCHRONOUS MODE |
e3 |
30 |
260 |
18.4 mm |
105 ns |
3 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
128K |
80 mA |
8388608 words |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
134217728 bit |
4/8 |
30 |
260 |
NOR TYPE |
.00012 Amp |
YES |
75 ns |
NO |
|||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G56 |
2 V |
1.2 mm |
40 MHz |
14 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
ASYNCHRONOUS READ MODE |
e3 |
NOR TYPE |
.00021 Amp |
18.4 mm |
YES |
110 ns |
1.8 |
NO |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM |
536870912 bit |
2.3 V |
BOTTOM BOOT; IT ALSO OPERATES IN ASYNCHRONOUS MODE |
e3 |
18.4 mm |
105 ns |
3 |
||||||||||||||||||||||||||||||||
Intel |
FLASH |
MILITARY |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
MIL-PRF-38535 Class N |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
135 mA |
2097152 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
16 |
Flash Memories |
.8 mm |
125 Cel |
3-STATE |
2MX8 |
2M |
-55 Cel |
32 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
3.15 V |
USER-SELECTABLE 5V OR 12V VPP |
128/256 |
e0 |
NOR TYPE |
.00005 Amp |
23.7 mm |
85 ns |
5 |
NO |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
95 ns |
3 |
||||||||||||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
150 ns |
2.7 |
NO |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
90 mA |
33554432 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
16777216 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
256 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
125 ns |
2.7 |
NO |
|||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-20 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
64 mA |
4194304 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
16 |
Flash Memories |
.5 mm |
70 Cel |
4MX8 |
4M |
0 Cel |
64 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
128/256 |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
70 ns |
3 |
NO |
||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G56 |
2 V |
1.025 mm |
14 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
IT ALSO HAVE ASYNCHRONOUS OPERATING MODE |
e3 |
NOR TYPE |
.00021 Amp |
18.4 mm |
YES |
20 ns |
1.8 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
54 mA |
2097152 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
32 |
YES |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
Not Qualified |
33554432 bit |
2.7 V |
4/8 |
30 |
260 |
NOR TYPE |
.00012 Amp |
YES |
75 ns |
2.7 |
NO |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
64MX16 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
105 ns |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
7 mm |
134217728 bit |
2.7 V |
e1 |
30 |
260 |
NOR TYPE |
9 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
64MX16 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
e3 |
18.4 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
16777216 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
1 |
2 |
.5 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
BOTTOM/TOP |
134217728 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e3 |
30 |
260 |
NAND TYPE |
.0002 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||
|
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
33554432 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
1 |
2 |
.5 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
268435456 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e3 |
NAND TYPE |
.0001 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM/TOP |
536870912 bit |
2.7 V |
e3 |
NOR TYPE |
18.4 mm |
100 ns |
3 |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
105 Cel |
32MX16 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
e3 |
18.4 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||
Toshiba |
FLASH |
INDUSTRIAL |
56 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
70 mA |
2097152 words |
3 |
YES |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA60,8X12,32 |
8 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
7 mm |
BOTTOM |
33554432 bit |
2.3 V |
NOR TYPE |
.00001 Amp |
10 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-20 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
33554432 bit |
4.5 V |
CONFIGURABLE AS 2M X 16; BLOCK ERASE |
16/32 |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
120 ns |
5 |
NO |
|||||||||||||||||
Intel |
FLASH |
AUTOMOTIVE |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
60 mA |
524288 words |
3.3 |
NO |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G56 |
3.6 V |
1.9 mm |
13.3 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
4 |
e0 |
NOR TYPE |
.0001 Amp |
23.7 mm |
95 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
2097152 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
16 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
32 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
2.97 V |
DEEP POWER-DOWN; HARDWARE WRITE PROTECT |
128/256 |
e0 |
NOR TYPE |
.000005 Amp |
23.7 mm |
100 ns |
12 |
NO |
||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
2097152 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
3 V |
16/32 |
e0 |
NOR TYPE |
.000005 Amp |
23.7 mm |
YES |
100 ns |
2.7 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,64K |
50 mA |
8388608 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G56 |
2 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM |
134217728 bit |
1.7 V |
8 |
e3 |
NOR TYPE |
.000055 Amp |
18.4 mm |
YES |
75 ns |
1.8 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,64K |
28 mA |
8388608 words |
NO |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
BOTTOM |
134217728 bit |
4 |
NOR TYPE |
.000155 Amp |
YES |
85 ns |
NO |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,64K |
28 mA |
8388608 words |
3 |
NO |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM |
134217728 bit |
2.3 V |
8 |
30 |
260 |
NOR TYPE |
.002 Amp |
18.4 mm |
YES |
20 ns |
3 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,64K |
51 mA |
16777216 words |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
BOTTOM |
268435456 bit |
4 |
NOR TYPE |
.000115 Amp |
YES |
95 ns |
NO |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,64K |
51 mA |
16777216 words |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
TOP |
268435456 bit |
4 |
NOR TYPE |
.000115 Amp |
YES |
95 ns |
NO |
||||||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e3 |
40 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
128K |
54 mA |
4194304 words |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
TIN |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
67108864 bit |
4/8 |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
YES |
75 ns |
NO |
|||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
54 mA |
4194304 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Sharp Corporation |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G56 |
3 |
5.5 V |
1.19 mm |
14 mm |
Not Qualified |
16777216 bit |
4.5 V |
e6 |
10 |
250 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
256 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
100,000 PROGRAM/ERASE CYCLES |
8/16 |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
15 mA |
16777216 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
.00007 ms |
BOTTOM/TOP |
268435456 bit |
2.7 V |
8/16 |
e3 |
NOR TYPE |
.0001 Amp |
20 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
10 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
18.4 mm |
95 ns |
3 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
7 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
95 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
1073741824 words |
3 |
YES |
1.8/3.3,3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
1K |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
1073741824 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
130 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
134217728 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
1 |
2 |
.5 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
1K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
1073741824 bit |
2.7 V |
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
32 |
e3 |
30 |
260 |
NAND TYPE |
.0001 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
33554432 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
|||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.