Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
105 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
64MX16 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
e3 |
18.4 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
64K |
80 mA |
8388608 words |
YES |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
105 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
Not Qualified |
134217728 bit |
16 |
e3 |
30 |
260 |
NOR TYPE |
.0002 Amp |
YES |
100 ns |
YES |
|||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
3 V |
e0 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
1073741824 bit |
2.7 V |
NOR TYPE |
18.4 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
4194304 words |
3 |
YES |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
e0 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
1073741824 bit |
2.7 V |
NOR TYPE |
18.4 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
OTHER |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
268435456 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256MX1 |
256M |
0 Cel |
256 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
3 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
e3 |
NOR TYPE |
18.4 mm |
90 ns |
3 |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
e0 |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
64MX16 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
1073741824 bit |
2.7 V |
NOR TYPE |
18.4 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
80 ns |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
105 Cel |
32MX16 |
32M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
CAN ALSO BE ORGANISED AS 512MX1 |
NOR TYPE |
18.4 mm |
120 ns |
2.7 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
268435456 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
256 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
3 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
CAN ALSO ORGANISED AS 1GX1 |
NOR TYPE |
18.4 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
268435456 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256MX1 |
256M |
0 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
3 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
e0 |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
7 mm |
BOTTOM/TOP |
1073741824 bit |
2.7 V |
NOR TYPE |
9 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
2097152 words |
3 |
YES |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1 |
.5 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
18.4 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
NOR TYPE |
18.4 mm |
100 ns |
3 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1 |
.5 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
18.4 mm |
110 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
120 ns |
2.7 |
YES |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
33554432 bit |
2.7 V |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
3 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
3 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1 |
.5 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
2.7 V |
18.4 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
e0 |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1073741824 words |
COMMON |
3.3 |
YES |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSOP56,.78,20 |
20 |
.5 mm |
85 Cel |
TOTEM POLE |
1GX1 |
1G |
-40 Cel |
YES |
YES |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
1073741824 bit |
3 V |
.000005 Amp |
18.4 mm |
110 ns |
3 |
YES |
||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
7 mm |
BOTTOM/TOP |
536870912 bit |
2.7 V |
NOR TYPE |
9 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
2097152 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE |
4/8 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
105 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
TOP |
33554432 bit |
2.7 V |
NOR TYPE |
18.4 mm |
90 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
4194304 words |
3 |
YES |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
e0 |
NOR TYPE |
18.4 mm |
110 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
64KX16 |
64K |
0 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
13.95 mm |
1048576 bit |
3 V |
NOR TYPE |
18.35 mm |
100 ns |
3 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
18.4 mm |
80 ns |
3 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
3 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||||
Infineon Technologies |
FLASH |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
100 mA |
134217728 words |
3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
14 mm |
.00006 ms |
1073741824 bit |
2.7 V |
32 |
NAND TYPE |
.0001 Amp |
18.4 mm |
YES |
120 ns |
3 |
YES |
||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
18.4 mm |
90 ns |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.